| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 11/18/2009 | CN100560319C Controlling means of cycloidal generator in multi-wire saw take-up unit |
| 11/11/2009 | CN101577217A Breaking apparatus for membraniform adhesive and breaking method thereof |
| 11/11/2009 | CN101574836A Multiline cutting machine of numerical-control polysilicon silicon |
| 11/10/2009 | US7615721 Laser processing method and laser processing apparatus |
| 11/05/2009 | WO2009134212A1 Apparatus and method for multiple substrate processing |
| 11/05/2009 | WO2009133832A1 Brittle material breaking apparatus and brittle material breaking method |
| 11/05/2009 | WO2009133612A1 Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid |
| 11/04/2009 | EP2112967A1 Method for manufacturing silicon matter for plasma processing apparatus |
| 11/04/2009 | EP1901897B1 Device for positioning and blocking thin substrates on a cut substrate block |
| 10/29/2009 | WO2009130549A1 Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device |
| 10/28/2009 | EP2111960A1 Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device |
| 10/28/2009 | CN201333764Y Sawing machine for cutting silicon rod |
| 10/28/2009 | CN101567303A Laser film engraving equipment, scribing method and amorphous silicon film photovoltaic panel manufactured by same two |
| 10/28/2009 | CN101564828A Wire saw for cutting hard and fragile materials and manufacturing method thereof |
| 10/28/2009 | CN101564794A Ultraviolet laser device for cutting copper substrate for high-power LED chip |
| 10/28/2009 | CN100555576C Semiconductor wafers with highly precise edge profile and method for producing them |
| 10/28/2009 | CN100553852C Laser beam machining method and laser beam machining device |
| 10/22/2009 | WO2009128334A1 Method of machining vulnerable material substrate |
| 10/22/2009 | WO2009128316A1 Method for processing fragile material substrate |
| 10/22/2009 | WO2009128315A1 Method for processing fragile material substrate |
| 10/22/2009 | WO2009128314A1 Method for processing fragile material substrate |
| 10/22/2009 | DE102006050330B4 Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben A method for simultaneously severing at least two cylindrical workpieces in a plurality of discs |
| 10/21/2009 | EP2110216A1 Wire saw device and method for operating same |
| 10/21/2009 | EP1603612B1 Protective sheath for a cannula |
| 10/21/2009 | CN201329622Y Shield of inside diameter slicer |
| 10/21/2009 | CN101562127A Marking device and multi-shaft marking device |
| 10/21/2009 | CN101559629A Coaxial image system applied to LED laser cutting device |
| 10/21/2009 | CN101559628A Ultraviolet laser device for cutting large-width Micro Phone chip |
| 10/21/2009 | CN101559627A Particle beam assisted single-crystal fragile material ultraprecise processing method |
| 10/21/2009 | CN100552887C Process for exfoliating a thin film |
| 10/21/2009 | CN100551552C Processing machine with washing device |
| 10/21/2009 | CN100551454C Protective sheath for a cannula, injection part including said sheath and needle with said sheath |
| 10/20/2009 | US7605344 Laser beam machining method, laser beam machining apparatus, and laser beam machining product |
| 10/20/2009 | US7603999 Metal bonded drilling and boring tool |
| 10/14/2009 | CN201325127Y Silicon chip collecting groove of wire cutting machine |
| 10/14/2009 | CN201325126Y Dismantlement-free mortar jar of wire cutting machine |
| 10/14/2009 | CN101556910A Processer |
| 10/14/2009 | CN101554757A Cutting method of crystalline silicon blocks |
| 10/14/2009 | CN101554756A Cutting passage capable of improving finished product ratio of cutting |
| 10/14/2009 | CN100548564C Laser machining method and semiconductor device |
| 10/08/2009 | US20090253352 Slicing Method |
| 10/07/2009 | EP2106331A1 Method for dividing monocrystals |
| 10/07/2009 | CN201320809Y Silicon rod cutting clamp |
| 10/07/2009 | CN100547740C 晶片分割方法 Wafer Segmentation |
| 10/07/2009 | CN100546793C Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface |
| 10/07/2009 | CN100546754C Laser machining apparatus and method of adjusting the same |
| 10/06/2009 | CA2412370C Use of a u-groove as an alternative to using a v-groove for protecting silicon against dicing induced damage |
| 10/01/2009 | WO2009091264A3 Wafer stack cleaning |
| 09/30/2009 | EP2105239A1 Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material |
| 09/30/2009 | CN100544922C Water curtain special graphite sculpturing machine |
| 09/24/2009 | US20090236384 Method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrate |
| 09/23/2009 | CN101537666A Processing method of seed crystal with big drift angle |
| 09/22/2009 | US7592238 Laser processing method and laser processing apparatus |
| 09/22/2009 | US7591376 Methods for fractionating a machining suspension using destabilization and separation steps |
| 09/22/2009 | CA2435688C Method and apparatus for cutting workpieces |
| 09/16/2009 | EP1603722B1 Breaking device for separating ceramic printed circuit boards |
| 09/16/2009 | CN101531037A Integrated transporter of multi-wire saw component and attachment |
| 09/16/2009 | CN101531036A A pulley bracket and a fretsaw device making use of the pulley bracket |
| 09/16/2009 | CN101531035A A method for manufacturing electroplating diamond wire saw |
| 09/10/2009 | DE10030183B4 Schneidmaschine Cutting machine |
| 09/09/2009 | CN201304692Y Improved engaged wheel structure of digital controlled cutter for cutting silicon wafer |
| 09/09/2009 | CN101524876A Process for numerically controlled electrical discharge wire cutting of bismuth telluride |
| 09/09/2009 | CN101524875A Process for multi-wire cutting of bismuth telluride by cutting machine |
| 09/03/2009 | WO2009107794A1 Separation device and separation method of mother board for plane display panel |
| 09/02/2009 | CN201300501Y A portable slotting device for fragile material substrate |
| 09/02/2009 | CN101522383A Scribe device and scribe method |
| 09/02/2009 | CN101518925A Process waste liquid treatment apparatus |
| 08/27/2009 | US20090211167 Slurry for wire saw |
| 08/26/2009 | EP2093036A2 Method and device for the mechanical structuring of flexible thin-film solar cells |
| 08/26/2009 | EP2091708A1 Device for separating a stacked structure and related method |
| 08/26/2009 | CN101517711A Cutting method |
| 08/26/2009 | CN101517710A Cutting method and epitaxial wafer manufacturing method |
| 08/26/2009 | CN101516573A Cutting method |
| 08/26/2009 | CN101516566A Laser processing method and laser processing apparatus |
| 08/26/2009 | CN101514488A A silicon chip for growing silicon polycrystal crystal rod and a method for preparing the same |
| 08/26/2009 | CN101513753A Method for recovering waste slurry of multiline cut silicon chips |
| 08/26/2009 | CN101513752A Antioxidant cutting method and device |
| 08/20/2009 | WO2009102630A1 Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers |
| 08/20/2009 | WO2009101761A1 Cylindrical grinding equipment and grinding method |
| 08/20/2009 | WO2009101760A1 Blade fixing jig set and fixing method |
| 08/20/2009 | WO2009101339A2 Abrasive grain powder |
| 08/20/2009 | WO2009051745A8 Constant force mechanical scribers and methods for using same in semiconductor processing applications |
| 08/20/2009 | DE102005031200B4 Verfahren und Vorrichtung zum Herstellen eines kristallachsenorientierten Saphir-Substrats, Saphir-Substrat und Halbleitersubstrat Method and apparatus for producing a crystal axis oriented sapphire substrate, sapphire substrate, and the semiconductor substrate |
| 08/20/2009 | CA2715053A1 Abrasive grain powder |
| 08/19/2009 | CN201291526Y Laser reticle dust collector |
| 08/19/2009 | CN101510527A Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof |
| 08/19/2009 | CN101508152A Solar energy film cutting device follow-up dust suction device |
| 08/19/2009 | CN101508151A Polysilicon rod thermodynamics breaking technique and device |
| 08/19/2009 | CN100530526C Rectangular substrate dividing apparatus |
| 08/19/2009 | CN100528507C Scribe line forming device and scribe line forming method |
| 08/13/2009 | WO2009099130A1 Polycrystalline diamond |
| 08/13/2009 | WO2009097987A1 Method for laser cutting of a nonmetal workpiece |
| 08/13/2009 | US20090199836 Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers |
| 08/12/2009 | CN201287408Y Cooling water supply facility of single crystal stick cut-off machine |
| 08/12/2009 | CN201287405Y Mortar splitting apparatus |
| 08/12/2009 | CN201287404Y Induction type ultrasonic electric primary shaft |
| 08/12/2009 | CN201287403Y Novel automatic multi-cutter cutting machine |
| 08/12/2009 | CN201287402Y Home roll of multi-lane cutting machine |
| 08/12/2009 | CN201287401Y Double-guide pulley detection system for multi-lane cutting machine |
| 08/12/2009 | CN101504914A Improved cooling apparatus for silicon chip cutting liquor |