| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 01/28/2010 | DE102006058819B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück A method for separating a plurality of wafers from a workpiece |
| 01/27/2010 | EP2147899A1 Method for processing terminal in bonded substrate |
| 01/27/2010 | CN201389927Y Clamping mechanism of multi-wire cutting machine |
| 01/27/2010 | CN101633215A Cutting device |
| 01/21/2010 | US20100015783 Method of cutting an object to be processed |
| 01/21/2010 | DE102008032555B3 Strukturierungsvorrichtung für die Strukturierung von plattenförmigen Elementen, insbesondere von Dünnschicht-Solarmodulen, entsprechendes Strukturierungsverfahren sowie Verwendung derselben Structuring device for structuring plate-like elements, especially of thin-film solar modules, corresponding structuring method and use thereof |
| 01/20/2010 | CN201385386Y Wafer cutting machine |
| 01/20/2010 | CN101628452A Method for cutting silicon chips |
| 01/20/2010 | CN101628451A Saw wire |
| 01/20/2010 | CN100582322C Nano monocrystalline diamond preparation method |
| 01/19/2010 | US7648888 Apparatus and method for splitting substrates |
| 01/14/2010 | WO2010006148A2 Wire slicing system |
| 01/14/2010 | WO2010005307A1 Device and method for sawing electronic components |
| 01/14/2010 | US20100006082 Wire slicing system |
| 01/14/2010 | US20100006081 Method for manufacturing silicon matter for plasma processing apparatus |
| 01/13/2010 | EP2144304A2 Structuring device for structuring board-shaped elements, particularly thin layer solar modules |
| 01/13/2010 | EP2143537A1 Method and device for breaking semiconductor discs or similar substrates |
| 01/13/2010 | CN201380555Y Multi wire cutting machine workpiece and integrated transportation device of accessories |
| 01/13/2010 | CN201380554Y Remote control system of multi wire cutting machine |
| 01/13/2010 | CN201380553Y Automatically tracking control device for steel wire taking-up and taking-off of multi wire cutting machine |
| 01/13/2010 | CN101626876A Method for manufacturing silicon matter for plasma processing apparatus |
| 01/13/2010 | CN101626875A Apparatus and method for edge processing of a sheet of brittle material |
| 01/07/2010 | WO2010001961A1 Method of regenerating coolant and method of regenerating slurry |
| 01/07/2010 | WO2010001529A1 Method for cutting work |
| 01/07/2010 | WO2010000169A1 A device for cutting wafers by wire and its method |
| 01/07/2010 | US20100000507 Angle cut on cvd diamond |
| 01/06/2010 | EP2139657A1 Method and apparatus for the production of thin disks or films from semiconductor bodies |
| 01/06/2010 | CN101618575A Manufacturing method of wire rod with abrasive particle |
| 01/06/2010 | CN100577386C Motherboard cutting method and motherboard scribing apparatus |
| 12/31/2009 | US20090320820 Gemstone waterbath drill |
| 12/30/2009 | WO2009157757A1 Half-marble |
| 12/30/2009 | WO2009157440A1 Scribing apparatus |
| 12/30/2009 | CN101612765A Solar monocrystalline silicon slice process |
| 12/30/2009 | CN100575062C An apparatus and method for controlled cleaving |
| 12/30/2009 | CN100575026C Method and device for processing fragile material |
| 12/30/2009 | CN100574960C Laser processing machine |
| 12/24/2009 | DE102008022476B3 Method for mechanical treatment of disk, involves allocating disk separated by wire saw from work piece having sawing edge to their extent |
| 12/24/2009 | DE10057998B4 Poliergerät und Polierverfahren Polishing apparatus and polishing method |
| 12/24/2009 | DE10043212B4 Schneidverfahren Cutting process |
| 12/23/2009 | WO2009154022A1 Substrate processing system |
| 12/23/2009 | WO2009153887A1 Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar |
| 12/23/2009 | WO2009153877A1 Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar |
| 12/23/2009 | CN101610870A Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| 12/23/2009 | CN101607423A Thread-breakage protecting method of silicon ingot cutting fret saw and fret saw applying same |
| 12/23/2009 | CN101607422A Lineation saw |
| 12/23/2009 | CN100572004C Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| 12/17/2009 | WO2009150520A1 Apparatuses and methods for subdividing ceramic products |
| 12/16/2009 | CN201361951Y Workpiece clamping/releasing device of multi-line cutting machine |
| 12/16/2009 | CN201361950Y Silicon chip cutting machine |
| 12/16/2009 | CN201361949Y Wafer cutting structure |
| 12/16/2009 | CN101605642A Endless chipping belt |
| 12/16/2009 | CN101604659A Optical device wafer dividing method |
| 12/16/2009 | CN101603202A Method for processing seed crystal capable of showing characteristic structure and shape of quartz crystal |
| 12/16/2009 | CN101602233A Method and device for circularly utilizing washing water of multi-line cutting machine |
| 12/16/2009 | CN101602232A Wire butting machine tool |
| 12/16/2009 | CN101602231A Preparation method of electroplating diamond fret saw |
| 12/16/2009 | CN100569475C Device and method for cutting single crystal in cutting machine |
| 12/16/2009 | CN100569441C Cutting device |
| 12/16/2009 | CN100569439C Apparatus for exchanging cutting blade |
| 12/10/2009 | WO2009148073A1 Scribing wheel and method for scribing brittle material substrate |
| 12/10/2009 | WO2009146940A1 Process for fastening a silicon block on a support intended therefor and corresponding arrangement |
| 12/09/2009 | EP2130240A1 Method and system for detaching a plurality of ceramic components from a component block |
| 12/09/2009 | CN201357522Y Base structure of semiconductor wafer processing machine |
| 12/09/2009 | CN101597795A Epitaxially coated silicon wafer with 110 orientation and method for producing it |
| 12/09/2009 | CN101596751A Remote control system of multi-wire cutting machine |
| 12/09/2009 | CN101596750A Steel wire drawing and releasing automatic tracing and controlling method and device for multi-wire cutting machine |
| 12/09/2009 | CN101596749A Production method of brazed diamond wire saw |
| 12/09/2009 | CN101596723A Substrate-cutting system |
| 12/09/2009 | CN101596722A Substrate-cutting system |
| 12/09/2009 | CN101596721A Substrate-cutting system |
| 12/09/2009 | CN101596720A Substrate-cutting system |
| 12/09/2009 | CN101596719A Substrate-cutting system |
| 12/09/2009 | CN100568565C Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
| 12/03/2009 | WO2009145058A1 Scribe apparatus for thin film solar cell |
| 12/03/2009 | WO2009145026A1 Method for chamfering brittle material substrate |
| 12/03/2009 | WO2009145008A1 Laser working apparatus, and laser working method |
| 12/03/2009 | WO2009144594A1 Methods for processing ornamental diamonds and corresponding ornamental diamonds |
| 12/02/2009 | EP2127838A1 Device for positioning and blocking thin substrates on a cut substrate block |
| 12/02/2009 | CN101594961A Disklike cutting tool and cutting device |
| 12/02/2009 | CN101590669A Cutting device |
| 12/02/2009 | CN100565935C Ultra-thin solar silicon slice and its cutting technology |
| 12/02/2009 | CN100563974C Method for forming piezoelectric ceramic pattern |
| 12/02/2009 | CN100563973C Eggplant-shaped jewel cutting and polishing process |
| 12/02/2009 | CN100563972C Rose-shaped jewel cutting and polishing process |
| 12/02/2009 | CN100563934C Polishing pad and device |
| 12/01/2009 | US7626137 Laser cutting by forming a modified region within an object and generating fractures |
| 11/25/2009 | EP2122676A1 Method and device for separation of silicon wafers |
| 11/25/2009 | CN201350670Y Silicon chip deglue protection device after silicon chip being cut by multi-fretsaw |
| 11/25/2009 | CN101585657A Substrate dividing apparatus and method for dividing substrate |
| 11/25/2009 | CN101585656A Substrate dividing apparatus and method for dividing substrate |
| 11/25/2009 | CN101585655A Substrate dividing apparatus and method for dividing substrate |
| 11/25/2009 | CN101585113A Method for precisely processing monocrystalline silicon by laser |
| 11/25/2009 | CN100562977C Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same |
| 11/19/2009 | US20090283761 Method of cutting single crystals |
| 11/18/2009 | CN201346810Y Fixture of internal cylindrical cutting machine |
| 11/18/2009 | CN201346809Y Positioning fixture of quartz crystal rolling machine |
| 11/18/2009 | CN201346807Y Improved structure of diamond cable saw |
| 11/18/2009 | CN101579895A Chip slicer guide wheel and chip slicing method |
| 11/18/2009 | CN101579894A Cutting device |
| 11/18/2009 | CN101579893A Method and clamp for pretreatment of silicon single crystal bar chips |