Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
06/2010
06/09/2010CN101140868B Epitaxial wafer and method of producing same
06/08/2010US7732730 Laser processing method and laser processing apparatus
06/02/2010EP1777031B1 Laser processing method
06/02/2010CN1891422B Apparatus for scribing a substrate in use for a flat panel display
06/02/2010CN101716745A Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery
06/02/2010CN101110391B System and method for cutting underlay
06/02/2010CN101086958B Ultraviolet radiation device and cutting machine with the same
05/2010
05/27/2010WO2010058389A1 Method and device for facilitating separation of sliced wafers
05/26/2010EP2189245A2 Methods and apparatus for multiple cutoff machining of rare earth magnet blocks
05/26/2010CN201483658U Reel device for semiconductor dedicated equipment
05/26/2010CN201483657U Wire wheel mechanism
05/26/2010CN101712186A Preparation method of guide roller used for cutting silicon chips
05/26/2010CN101712161A Numerical control yarn cutting machine
05/25/2010US7723641 Brittle material substrate scribing device and scribing method, and automatic analysis line
05/20/2010WO2010006148A3 Wire slicing system
05/19/2010EP2186596A1 Laser working method, laser working apparatus, and its manufacturing method
05/19/2010CN201471610U Multi-line cutting type diamond linear cutting machine
05/19/2010CN1983555B Method of making semiconductor element
05/19/2010CN1967783B Laser processing apparatus and laser processing method
05/14/2010WO2010052827A1 Ingot cutting apparatus and cutting method
05/12/2010CN201456258U Combined clamp for cutting single-crystal silicon bar materials
05/12/2010CN201456254U Guiding wheel for cutting single-crystal silicon
05/12/2010CN201456253U Special fixture for use in cutting of monocrystalline silicon for making seed crystals
05/12/2010CN1994713B Crystal grain separation device and separation method thereof
05/12/2010CN1933942B Electrodeposition wire tool
05/12/2010CN1867435B Work cutting device and work cutting method
05/12/2010CN101704276A Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof
05/12/2010CN101001730B Bi-directional singulation system and method
05/05/2010CN201446631U Silicon slice nesting working head
05/05/2010CN101700684A Main shaft of multiline cutter
05/05/2010CN101700683A Process for processing jade in gold and jade product
04/2010
04/22/2010WO2010043596A1 Method for separating wafers from a wafer support and device therefor
04/21/2010EP2176028A1 Methods of crystallographically reorienting single crystal bodies
04/21/2010CN101695854A Scoring device and scoring method
04/20/2010US7699200 Scribing and breaking apparatus and system therefor
04/15/2010US20100089209 Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers
04/15/2010DE10121502B4 Verfahren zum Unterteilen eines Halbleiterwafers A method for dividing a semiconductor wafer
04/14/2010EP2174918A1 Hand operated breaker
04/14/2010EP2174762A1 Method for scribing bonded substrates
04/08/2010WO2010038563A1 Method for scribing substrate of fragile material
04/07/2010CN201436170U Movable V-shape groove
04/07/2010CN201436147U Wafer grinding and cutting protection structure
04/07/2010CN1856392B Substrate dicing system and substrate dicing method
04/06/2010CA2442584C Forming a mark on a gemstone or industrial diamond
03/2010
03/31/2010CN201435382Y Wax melter for semiconductor wafer manufacturing
03/31/2010CN201432376Y Improved special device for scribing brittle substrate by precise laser
03/31/2010CN201432373Y Novel diamond saw blade
03/31/2010CN101687342A Method for processing brittle material substrate and crack forming apparatus used in the method
03/31/2010CN101687306A Multi-wire saw and method of cutting ingot
03/31/2010CN101683750A Bi-directional singulation system and method
03/31/2010CN101683749A Cutting device
03/25/2010WO2010032371A1 Band saw cutting device and method of cutting ingot
03/24/2010EP2165805A1 Multi-wire saw and method of cutting ingot
03/24/2010CN101679101A Hand operated breaker
03/24/2010CN101679041A 多晶金刚石 Polycrystalline diamond
03/24/2010CN101678563A Cutting method and wire saw device
03/23/2010US7682858 Wafer processing method including formation of a deteriorated layer
03/17/2010CN101670623A Main shaft of wire wheel
03/17/2010CN101670494A Laser processing method and laser processing apparatus
03/17/2010CN101670493A Laser processing method and laser processing apparatus
03/17/2010CN101670485A Laser processing method and laser processing apparatus
03/17/2010CN101670484A Laser processing method and laser processing apparatus
03/11/2010US20100059034 Gemstone production from cvd diamond plate
03/10/2010CN101664970A Monocrystal silicon-rod butting technique
03/10/2010CN101664969A Method for cleaving brittle materials
03/10/2010CN101664968A Improved clamping mechanism for monocrystal silicon rods
03/10/2010CN101664967A Improved monocrystal silicon-rod cutting machine
03/04/2010WO2010022531A1 Device for holding columnar workpieces and use of the device
03/04/2010US20100055876 Laser processing method and laser processing apparatus
03/03/2010EP2159026A1 Device for holding column-shaped workpieces and use of the device
03/03/2010EP2159025A2 Race track configuration and method for wafering silicon solar substrates
03/03/2010CN201415450Y Multi-knife cutting pressing device
03/03/2010CN201415449Y Mortar flow controller of pneumatic valve
03/03/2010CN201415448Y Quartz crystal cutting device
03/03/2010CN201415447Y Burst preventing device of silicon block cutting equipment
03/03/2010CN101659089A Method for slotting guide roller of multi-line cutting machine
02/2010
02/25/2010US20100043769 Wire saw and method for producing a wire saw
02/24/2010CN101653972A Swing mechanism of workbench
02/24/2010CN101653971A A cutting apparatus
02/24/2010CN101653970A Crystal block cutting machine
02/18/2010US20100037881 Slicing method
02/18/2010US20100037880 Slurry for slicing silicon ingot and method for slicing silicon ingot using the same
02/17/2010EP2153962A1 Multi-head mounted scribing device, and tip holder automatic-exchanging system
02/17/2010EP2153961A1 Tip holder for hand cutter, and hand cutter having the tip holder
02/17/2010EP2153960A2 Holder, method and device for producing wafers and use of the produced wafers
02/17/2010CN201405456Y Crystal plate taking tool
02/17/2010CN201405455Y Viscous mound positioning device
02/17/2010CN201405454Y Novel UV laser device for cutting large format Micro Phone chip
02/17/2010CN201405453Y Diamond drilling machine with roller wheel device
02/17/2010CN201405162Y Novel UV laser device for cutting copper substrate used for high-power LED chip
02/17/2010CN100589915C Method for separating flat ceramic workpieces with a calculated radiation spot length
02/10/2010EP2151712A1 Method of manufacturing a wavelength converter and wavelength converter
02/10/2010CN101642941A Diamond cutter
02/03/2010CN201394897Y Cutting positioning fixture for corrosive tunnel and Q value detection of quartz wafer
02/03/2010CN101637947A Technological method for slicing silicon
02/03/2010CN101637946A Grain unit of diamond tool segment and manufacturing method thereof
02/03/2010CN101637945A Dicing frame
02/02/2010CA2438728C Mounting and preparing a gemstone or industrial diamond for the formation of a mark on the surface thereof
01/2010
01/28/2010WO2010010657A1 Method for resuming operation of wire saw and wire saw
01/28/2010WO2010009881A1 Multi-wire cutting device with a revolving workpiece mount
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