| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 09/01/2010 | CN201566059U Guide rail of roller of silicon wafer line cutting machine |
| 09/01/2010 | CN201566058U Roller-supporting mechanism for silicon wafer wire cutting machines |
| 09/01/2010 | CN201566057U Damping and automatic tensioning device of silicon wafer line cutting machines |
| 09/01/2010 | CN201566056U Automatic sensing arresting device |
| 09/01/2010 | CN1970266B Cutter wheel, scribing device using the cutter wheel, and cutter wheel manufacturing device for manufacturing the cutter wheel |
| 09/01/2010 | CN1946527B Saw for semiconductor device |
| 09/01/2010 | CN101821071A Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus |
| 09/01/2010 | CN101819927A System and method for preparing micro/nano structured silicon materials |
| 09/01/2010 | CN101817209A Real-time deviation correcting method for precise cutting process of diamond wire saw |
| 08/25/2010 | EP2221138A1 Method of and device for separating a semiconductor wafer from a semiconductor crystal by creation of weak points inside the semiconductor crystal |
| 08/25/2010 | CN201559264U Numerical control multi-wire slicing machine with stable and constant tension |
| 08/25/2010 | CN201559263U Wire discharging device of wire winding drum of diamond wire cutting machine |
| 08/25/2010 | CN201559262U Diamond wire cutting machine with upright column type frame |
| 08/25/2010 | CN201559261U Special turnover bonding table for silicon wafer cutting |
| 08/25/2010 | CN201559260U Improved structure of sparse serration brazing diamond tool segment |
| 08/19/2010 | WO2010092964A1 Method for cutting brittle material substrate |
| 08/19/2010 | US20100206285 Wire saw apparatus |
| 08/18/2010 | EP2218539A1 A method of cutting an object along two different directions using elliptically polarised laser beam |
| 08/18/2010 | CN201552683U Multi-wire cutting device for silicon rod |
| 08/18/2010 | CN201552682U Cutting mechanism for diamond wire guillotine |
| 08/18/2010 | CN201552681U Positioning plate used for cutting single crystal of eight inches |
| 08/18/2010 | CN101804670A Work cutting device and work cutting method |
| 08/18/2010 | CN101174547B Wafer processing method |
| 08/11/2010 | EP2216805A2 Method of cutting semiconductor substrate |
| 08/11/2010 | EP2216128A2 Method of cutting object to be processed |
| 08/11/2010 | CN201544362U Multi-wire multi-slot excavation machine with wire jumping alarm device |
| 08/10/2010 | US7772522 Method for scribing substrate of brittle material and scriber |
| 08/10/2010 | US7770500 Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| 08/10/2010 | CA2606197C Method and system for laser marking in the volume of gemstones such as diamonds |
| 08/05/2010 | WO2010087424A1 Substrate breaking apparatus |
| 08/05/2010 | WO2010087423A1 Cutter and method for cutting brittle material substrate using same |
| 08/05/2010 | US20100197202 Method and Product for Cutting Materials |
| 08/04/2010 | EP2213632A1 Device for scoring glass sheet |
| 08/04/2010 | EP2213403A1 Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed |
| 08/04/2010 | EP2211656A2 Gemstones and methods for controlling the appearance thereof |
| 08/04/2010 | CN101791829A Processing method for broken wires of cutter for crystal bar |
| 08/04/2010 | CN101791828A Deflection angle multi-line cutting method and cutting device thereof |
| 07/29/2010 | US20100186239 Tip holder for manual cutter, and manual cutter having the tip holder |
| 07/28/2010 | CN201534360U 单晶硅棒料开方检验设备组合 Monocrystalline bar prescribing test equipment portfolio |
| 07/22/2010 | US20100180880 Method of improving nanotopography of surface of wafer and wire saw apparatus |
| 07/21/2010 | CN201530061U Silicon single crystal bar slicing pretreatment fixture |
| 07/21/2010 | CN201530060U Wafer slicer guide wheel |
| 07/21/2010 | CN201530059U X-Y-theta moving platform applied to LED laser cutting equipment |
| 07/21/2010 | CN1967815B Wafer product and processing method therefor |
| 07/21/2010 | CN101780694A Wire skipping alarming method of multi-wire cutting machine |
| 07/21/2010 | CN101323152B Thimble module and method for separating wafer and blue tape using the module |
| 07/15/2010 | US20100176100 Laser processing method and laser processing apparatus |
| 07/15/2010 | US20100175677 Diamond wire saw |
| 07/14/2010 | EP2205415A1 Method for producing wafers from ingots |
| 07/14/2010 | CN201525091U Air-tight sealing device for principle axis of multi-wire cutting machine wire wheel |
| 07/14/2010 | CN201525090U Numerical control multi-wire cutting machine for silicon chip of polycrystalline silicon |
| 07/14/2010 | CN201525089U Square machine tool for wire cutting |
| 07/14/2010 | CN101474831B Tool holder device of adjustable type diamond knife tool |
| 07/08/2010 | WO2010078274A2 Methods to recover and purify silicon particles from saw kerf |
| 07/08/2010 | US20100170495 Method and system for manufacturing wafer-like slices from a substrate material |
| 07/07/2010 | EP2204255A2 Laser processing apparatus with controller for positioning the focus point at different levels in the object to be processed |
| 07/07/2010 | EP2204254A2 Laser processing apparatus and method with focusing adjustments achieved with low laser power output |
| 07/07/2010 | CN101772398A Laser working method, laser working apparatus, and its manufacturing method |
| 07/06/2010 | US7749867 Method of cutting processed object |
| 07/01/2010 | WO2010074091A1 Method and device for cutting brittle-material plate, and window glass for vehicle |
| 07/01/2010 | US20100163462 Methods to recover and purify silicon particles from saw kerf |
| 07/01/2010 | US20100163010 Slicing method and a wire saw apparatus |
| 06/30/2010 | CN201516649U Wire cutting machine home roll |
| 06/30/2010 | CN201516648U Wafer splitting and leveling device |
| 06/30/2010 | CN101765487A Method and apparatus for the production of thin disks or films from semiconductor bodies |
| 06/30/2010 | CN101758565A Bonding device of direction-finder |
| 06/24/2010 | WO2010071128A1 Splitting apparatus and cleavage method for brittle material |
| 06/24/2010 | US20100154473 Round brilliant cut diamond and its incision method |
| 06/23/2010 | EP2200075A1 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device |
| 06/23/2010 | EP2199009A2 Laser Processing Method |
| 06/23/2010 | EP2199008A2 Laser Processing Method |
| 06/23/2010 | EP2199007A1 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| 06/23/2010 | CN1871104B Method for scribing substrate of brittle material and scriber |
| 06/23/2010 | CN101754840A Multi-head mounted scribing device, and tip holder automatic-exchanging system |
| 06/23/2010 | CN101754839A Tip holder for manual cutter, and manual cutter having the tip holder |
| 06/23/2010 | CN101752240A Group iii nitride semiconductor substrate production method, and group iii nitride semiconductor substrate |
| 06/23/2010 | CN101752217A Film for manufacturing semiconductor device and method of manufacturing the same |
| 06/23/2010 | CN101745993A Method for forming windmill-shaped scribing sheet groove structures |
| 06/23/2010 | CN101745746A Laser four-beam slotting device of solar silicon wafer |
| 06/23/2010 | CN101188194B Bonded wafer and method for producing bonded wafer |
| 06/17/2010 | US20100151202 Laser beam machining method, laser beam machining apparatus, and laser beam machining product |
| 06/16/2010 | CN201505991U Safety diamond cutting blade |
| 06/16/2010 | CN1966198B Laser beam processing machine |
| 06/16/2010 | CN1826207B Laser machining method and device, and machined product |
| 06/16/2010 | CN101743092A Methods of crystallographically reorienting single crystal bodies |
| 06/16/2010 | CN101740353A Dicing die-bonding film and process for producing semiconductor device |
| 06/16/2010 | CN101740352A Dicing die-bonding film and process for producing semiconductor device |
| 06/16/2010 | CN101740351A Dicing die-bonding film and process for producing semiconductor device |
| 06/16/2010 | CN101733851A Spool for lineation saw and lineation saw |
| 06/16/2010 | CN101733850A Cutting device |
| 06/16/2010 | CN101733847A Method of working sintered diamond, cutter wheel for substrate and method of working the same |
| 06/16/2010 | CN101136361B Laser processing method |
| 06/15/2010 | US7736995 Process for producing components |
| 06/09/2010 | CN201501049U Diamond tool block |
| 06/09/2010 | CN201501048U Clamping mechanism for single crystal silicon rod |
| 06/09/2010 | CN201501046U Improved structure of wide-tooth type brazing diamond tool segment |
| 06/09/2010 | CN1668431B Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head |
| 06/09/2010 | CN101728259A Method for cutting semi-conducting material composite rod into a plurality of wafers |
| 06/09/2010 | CN101722582A Revolving binding platform special for cutting silicon chip |
| 06/09/2010 | CN101722581A Method of scribing laminated substrate |