Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
12/2010
12/07/2010US7845529 Method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrate
12/02/2010WO2010137228A1 Method for cutting silicon ingot
12/02/2010WO2010136568A1 Device and method for stacking or transporting a plurality of flat substrates
12/02/2010WO2010135949A1 Proton beam assisted ultraprecise processing method for processing single-crystal fragile material
12/02/2010US20100300423 Compound semiconductor substrate production method
12/01/2010CN201663152U Crystal grain picking device
12/01/2010CN101903129A Laser processing apparatus and laser processing method
12/01/2010CN101903128A Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
12/01/2010CN101901740A Electronic component cutting and stripping machine and method thereof
11/2010
11/25/2010WO2010135616A2 Method for separating a sheet of brittle material
11/25/2010WO2010133683A1 Carrier for a silicon block and method for producing such a carrier and arrangement
11/25/2010WO2010133682A1 Carrier for a silicon block
11/24/2010CN201645673U Grounding detecting system of multi-wire slicon wafer cutter and detection electrode of grounding detecting system
11/24/2010CN101892515A Method for preparing full-diameter and low-oxygen and carbon solar monocrystalline silicon slice
11/24/2010CN101890763A Wiring transversely-moving rack
11/23/2010US7838795 Method of breaking a brittle substrate
11/23/2010US7836727 Glass cutting method
11/18/2010WO2010132637A2 Methods for cutting a fragile material
11/18/2010US20100288101 Glass cutting apparatus, glass-substrate disassembling apparatus, glass-substrate disassembling system, glass cutting method, and glass-substrate disassembling method
11/18/2010DE102004029094B4 Verfahren zum Herstellen eines Halbleiterchips A method of manufacturing a semiconductor chip
11/17/2010EP2251135A1 A method of cutting an object along two different directions further using an elastic sheet for dividing the object
11/17/2010EP2251134A1 A method of cutting an object along two different directions with modified regions located in different positions in the thickness direction of the object
11/17/2010EP1957247B1 Apparatus and method for cleaning a sawn wafer block
11/17/2010CN101885211A Chip chipping endless belt
11/17/2010CN101402229B Laser scribing dust collector and operation method thereof
11/17/2010CN101011845B Scribing apparatus
11/11/2010WO2010128011A1 Wire saw
11/11/2010WO2009157757A8 Half-marble
11/11/2010US20100282234 Ornamental diamond having two-stage pavilion
11/10/2010EP2249380A2 Method for cutting semiconductor substrate
11/10/2010CN1938837B Method of forming a scribe line on a ceramic substrate
11/10/2010CN101882578A Integral solid laser lift-off and cutting equipment
11/10/2010CN101879759A Main roller slotting method of multi-wire cutting machine
11/10/2010CN101879758A Crystal bar installation method in multi-wire cutter
11/10/2010CN101879757A Installation method of crystal bars in multi-wire cutting machine
11/10/2010CN101879756A Silicon wafer stripping machine
11/10/2010CN101879696A Diamond wire saw
11/04/2010DE112008002790T5 Drahtsägevorrichtung A wire saw
11/03/2010EP1408012B1 Scribing head
11/03/2010CN101875216A Marking head and marking device using the same
11/02/2010US7825350 Laser processing method and laser processing apparatus
10/2010
10/27/2010EP2242629A1 Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers
10/27/2010CN101870142A Cutting device, cutting device assembly and cutting method
10/27/2010CN101870141A Cutting device, cutting device having dewatering exhaust mechanism and environment control method
10/27/2010CN101870084A Sapphire wafer cutting method
10/27/2010CN101197316B Processing device
10/26/2010USRE41853 Scribing head, and scribing apparatus and scribing method using the scribing head
10/20/2010CN201609933U 微机控制双工位多线晶片切割机 Computer control duplex multi-line wafer cutting machine
10/20/2010CN101863087A Mortar box of multiwire cutting machine
10/20/2010CN101862907A Laser beam machining method, laser beam machining apparatus, and laser machined product
10/20/2010CN101862906A Laser beam machining method, laser beam machining apparatus, and laser machined product
10/14/2010WO2010116421A1 Glass plate scribing method and scribing device
10/14/2010WO2009035419A3 An apparatus and method for dicing an ic substrate
10/14/2010US20100258605 Apparatus for cutting liquid crystal display panel
10/14/2010US20100258103 Method for slicing workpiece by using wire saw and wire saw
10/13/2010EP2239228A1 Polycrystalline diamond
10/13/2010EP2239085A1 Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
10/13/2010CN1791497B Method for cleaning sic particles
10/13/2010CN101861237A Method for dividing monocrystals
10/13/2010CN101861230A Method for cutting work by wire saw and wire saw
10/13/2010CN101859729A Wafer processing method
10/13/2010CN101856844A Dismantling, overturning and carrying appliance of silicon rod connecting seat
10/13/2010CN101015943B Feeding controlling means for multi-wire saw working bench
10/07/2010WO2010112412A1 Component having an overlapping laser track; method for producing such a component
10/07/2010US20100252017 Method for slicing workpiece by using wire saw and wire saw
10/07/2010CA2757229A1 Component having an overlapping laser track; method for producing such a component
10/06/2010EP2237308A2 Manufacturing Unit for Integrated Thin Film Solar Cells
10/06/2010CN201597127U 具有成像光源的晶圆劈裂压板 Splitting wafer platen having an imaging light source
10/06/2010CN1792597B Autocontrolling multiline rotating, point cutter for diamond
10/06/2010CN101855045A Method for cutting work by wire saw and wire saw
10/06/2010CN101850579A Method for cutting workpiece and device for changing rolling width of wire cutting workpiece
10/06/2010CN101850538A Support jig of wafer and method for grinding, transferring and cutting wafer
10/06/2010CN101850532A Method and apparatus for ultra thin wafer backside processing
10/06/2010CN101195190B Laser processing method and laser processing apparatus, semiconductor chip and its manufacture method
09/2010
09/30/2010WO2010110673A1 Wire sawing to form thin wafers
09/30/2010WO2010109141A1 Method and machine for producing a semiconductor, of the photovoltaic cell type, or a similar electronic component
09/30/2010DE10019472B4 Reinigungsvorrichtung Cleaning device
09/29/2010CN101844374A Forming an image while milling work piece
09/22/2010EP2230042A2 Laser processing method and semiconductor device
09/22/2010EP2229265A1 Method of, and apparatus for, separating wafers from a wafer stack
09/22/2010CN201587046U Silicon chip cutter adopting guide bar
09/22/2010CN201587045U Adjustable main shaft of square cutting machine
09/22/2010CN101842326A Cutting line on glass sheet providing apparatus
09/22/2010CN101842203A Method for cutting a fragile material substrate
09/22/2010CN101838838A Preparation method of composite diamond fretsaw
09/16/2010WO2010103946A1 Grooveing tool and grooving method for thin film solar cell using the same
09/15/2010EP2228166A1 Method of cutting a substrate with localisation of laser modified region near the surface(s) of the substrate
09/15/2010EP2228165A1 Method of cutting a substrate with forming along a line of overlapping modified spot inside the substrate
09/15/2010EP2228164A1 Method of cutting a substrate with forming along a line of not overlapping modified spot inside the substrate
09/15/2010EP2228163A1 Method of processing an object with formation of three modified regions as starting point for cutting the object
09/15/2010CN201579886U Multi-head carborundum wire cutting-off machine
09/15/2010CN101834270A Production method of langasite crystal element
09/08/2010CN1974167B Multi split system
09/08/2010CN1927520B Laser beam processing machine
09/08/2010CN101499428B Double-interface card production method and equipment
09/02/2010WO2010098306A1 Slotting tool, and thin film solar cell slotting method and scribing device using same
09/02/2010WO2010098186A1 Semiconductor element manufacturing method
09/02/2010WO2010098058A1 Scribing apparatus and scribing method
09/01/2010CN201566062U Clamping mechanism for silicon wafer wire cutting machines
09/01/2010CN201566060U Cutting assembly of silicon chip linear cutter
1 ... 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 ... 67