| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 02/16/2011 | CN101165858B Processing method for wafer |
| 02/10/2011 | WO2011016996A2 Methods and systems for processing abrasive slurry |
| 02/09/2011 | CN201736357U Diamond fretsaw |
| 02/09/2011 | CN201736356U Cutting machine capable of measuring speed |
| 02/09/2011 | CN1835823B Method for the production of components |
| 02/09/2011 | CN101970194A Methods for processing ornamental diamonds and corresponding ornamental diamonds |
| 02/09/2011 | CN101970193A Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers |
| 02/09/2011 | CN101969038A Supporting arrangement for a group of integrated circuit units |
| 02/09/2011 | CN101966727A Multi-wire cutting machine mortar jet flow device |
| 02/09/2011 | CN101564828B Wire saw for cutting hard and fragile materials and manufacturing method thereof |
| 02/09/2011 | CN101253021B Method of improving nanotopography on surface of wafer and wire saw device |
| 02/03/2011 | WO2011013556A1 Method for cutting object to be processed |
| 02/03/2011 | WO2011013549A1 Method for cutting processing target |
| 02/03/2011 | US20110027972 Method of cutting a substrate and method of manufacturing a semiconductor device |
| 02/03/2011 | US20110027971 Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
| 02/02/2011 | EP2279983A2 Method and Apparatus for Processing Brittle Material Substrate |
| 02/02/2011 | EP2279066A1 Methods for processing ornamental diamonds and corresponding ornamental diamonds |
| 02/02/2011 | CN201728761U 6-inch single crystal block slicing device |
| 02/02/2011 | CN201728760U Fretsaw device using lengthened silicon supports |
| 02/02/2011 | CN201728759U Wire guide roller of multi-wire cutting machine |
| 02/02/2011 | CN201728758U Pulley gear of multi-wire cutting machine |
| 02/02/2011 | CN201728757U Mortar cooling device of multi-thread cutting machine |
| 02/02/2011 | CN201728756U Multi-wire cutting machine take-up reel |
| 02/02/2011 | CN201728755U Mortar box of multi-wire cutting machine |
| 02/02/2011 | CN201728754U Gluing tool for binding silicon rods |
| 02/02/2011 | CN101961886A Cutting device |
| 01/27/2011 | WO2011009927A1 Device for cleaning substrates on a carrier |
| 01/27/2011 | WO2011009587A1 Mechanically working and cutting silicon in an alkaline milieu |
| 01/27/2011 | US20110021004 Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| 01/26/2011 | EP1920874B1 Laser processing method |
| 01/26/2011 | CN201720951U Aluminum row rotating surface mechanism of crystal processing equipment |
| 01/26/2011 | CN201720950U Automatic limiting mechanism on crystal processing device |
| 01/26/2011 | CN101959813A Separation device and separation method of mother board for plane display panel |
| 01/26/2011 | CN101954675A Method for recovering mortar in wire cutting process |
| 01/26/2011 | CN101954674A Improved film silicon wafer cutting method |
| 01/26/2011 | CN101510527B Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof |
| 01/26/2011 | CN101335205B Method of producing iii-nitride substrate |
| 01/19/2011 | EP2275241A1 Method, apparatus and slurry for wire sawing |
| 01/19/2011 | CN201712076U Concentrated cooling monocrystalline silicon wire cutting unit |
| 01/19/2011 | CN201712075U Laser cutting processing machine tool used for quartz crystals |
| 01/19/2011 | CN201711247U Cutting liquid spray nozzle for square-cutting machine |
| 01/19/2011 | CN101947819A Method for processing small-size quartz crystal substrate for manufacturing resonator |
| 01/19/2011 | CN101947818A Manipulator device for producing rhinestones |
| 01/19/2011 | CN101134265B Laser processing method and method of cutting semiconductor material substrate |
| 01/13/2011 | WO2011004189A1 Gemstone alignment |
| 01/13/2011 | WO2011003782A1 Method for preparing a suspension |
| 01/13/2011 | CA2767745A1 Gemstone alignment |
| 01/13/2011 | CA2767415A1 Method for preparing a suspension |
| 01/12/2011 | EP2272618A2 Method of cutting object to be processed |
| 01/12/2011 | CN101945732A Cylindrical grinding apparatus and method for grinding |
| 01/12/2011 | CN101941249A Polycrystalline working plate for disassembled or assembled wire squarer |
| 01/12/2011 | CN101941248A Cutting device |
| 01/06/2011 | WO2011002089A1 Cutting method and cutting device for brittle material substrate, and vehicle window glass obtained by the cutting method |
| 01/05/2011 | EP2269765A1 Method of cutting a semiconductor substrate using multiphoton absorption phenomenon pulsed laser beam ; Semiconductor chip cut according to the method |
| 01/05/2011 | CN101937887A Wafer structure and water processing method |
| 01/05/2011 | CN101934558A Silicon rod slicing method |
| 01/05/2011 | CN101502986B Positioning apparatus for bonding silicon block |
| 12/30/2010 | US20100327416 Laser beam machining method, laser beam machining apparatus, and laser beam machining product |
| 12/30/2010 | DE112008003321T5 Verfahren zum Schneiden eines Werkstücks mittels einer Drahtsäge sowie Drahtsäge A method of cutting a workpiece by means of a wire saw and wire saw |
| 12/29/2010 | WO2010150460A1 Ingot cutting method reusing waste sludge and system using same |
| 12/29/2010 | EP2267763A2 Method for cutting semiconductor substrate |
| 12/29/2010 | EP1498216B1 Method of cutting processed object |
| 12/29/2010 | CN201685351U Dismounting, overturning and transportation device of silicon rod connecting base |
| 12/29/2010 | CN201685349U Numerically controlled diamond micro-line cutting machine tool |
| 12/29/2010 | CN201685348U Multi-wire-chase type braided rolling tube |
| 12/29/2010 | CN201685347U Sticky bar adjusting table |
| 12/29/2010 | CN101930909A Method for producing a semiconductor wafer |
| 12/29/2010 | CN101927533A Method for cubing single crystal bar |
| 12/22/2010 | CN201677419U Lifting device |
| 12/22/2010 | CN201677418U Guide-wheel device used for processing silicon-slice |
| 12/22/2010 | CN201677417U Crystal silicon cutting machine |
| 12/22/2010 | CN201677416U Sapphire crystal end surface cutting machine |
| 12/22/2010 | CN201677415U Sapphire crystal glass fixing strip positioning bonding device |
| 12/22/2010 | CN201677414U Directionally bonding device for sapphire crystal |
| 12/22/2010 | CN201677413U Crystal support for silicon bar |
| 12/22/2010 | CN201677412U External circle square cutting machine circulation water supply device |
| 12/22/2010 | CN201677411U Cutter for monocrystalline silicon bar or polycrystalline silicon bar |
| 12/22/2010 | CN201677213U Digital-control silicon chip grinding bed |
| 12/21/2010 | US7855130 Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations |
| 12/16/2010 | WO2010143354A1 Cutting method for workpiece |
| 12/16/2010 | WO2010078274A3 Methods to recover and purify silicon particles from saw kerf |
| 12/15/2010 | EP2260963A1 Method and jig assembly for manufacturing outer blade cutting wheel |
| 12/15/2010 | CN101913210A Polycrystalline silicon ingot ripping method |
| 12/15/2010 | CN101913209A Manufacture method of silicon chip |
| 12/15/2010 | CN101913208A Crystal block slicing method |
| 12/15/2010 | CN101913207A Angle lapping-free cutting method of silicon chip |
| 12/15/2010 | CN101115581B Method of producing knife for substrate of brittle material |
| 12/15/2010 | CN101112776B Instrument for accurate cutting of crystal round examples and method of use thereof |
| 12/14/2010 | US7851241 Method for severing brittle material substrate and severing apparatus using the method |
| 12/09/2010 | DE112008003339T5 Verfahren zum Zerschneiden eines Werkstücks durch Verwendung einer Drahtsäge und Drahtsäge A method of cutting a workpiece by using a wire saw and wire saw |
| 12/08/2010 | EP2258512A1 Method and apparatus for processing a substrate using laser focussed on the surface or inside the substrate for creating a weakened cutting line |
| 12/08/2010 | CN201664969U Quartz-tube cutting device |
| 12/08/2010 | CN1906003B Scribe head and scribe device |
| 12/08/2010 | CN101910076A Method for forming cracks on substrate made of brittle material |
| 12/08/2010 | CN101909806A Laser processing apparatus |
| 12/08/2010 | CN101906346A Aqueous cutting fluid and aqueous cutting agent |
| 12/08/2010 | CN101905491A Diamond wire saw and manufacturing method thereof |
| 12/08/2010 | CN101905490A Breaking bar |
| 12/08/2010 | CN101301734B Microcomputer control multiline cutting machine |
| 12/08/2010 | CN101195259B Cutter mechanism of sheet type multi-layer ceramic capacitance inductance cutting machine |