| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 04/21/2011 | WO2010058009A3 Method for rotating a sawed wafer block and device therefor |
| 04/21/2011 | US20110088678 Method for resuming operation of wire saw and wire saw |
| 04/21/2011 | DE102009045614A1 Method for cutting e.g. workpiece block from e.g. silicon, involves laterally forming rectangular groove with depth on rear side of workpiece and offset to separation line formed perpendicular to front side of workpiece |
| 04/20/2011 | CN201800144U Combined clamp for cutting off monocrystalline silicon bar stock |
| 04/20/2011 | CN201800142U Cutting fixture for processing strip workpieces |
| 04/20/2011 | CN201800141U Aluminum busbar moving mechanism on crystal processing equipment |
| 04/20/2011 | CN201800140U Holding device of band saw |
| 04/20/2011 | CN201800139U Multi-wire saw mortar storage tank with ultrasonic generator |
| 04/20/2011 | CN102026926A Method of machining vulnerable material substrate |
| 04/20/2011 | CN102026925A Method for processing fragile material substrate |
| 04/20/2011 | CN102024886A Method for processing wafer |
| 04/20/2011 | CN102019648A Cutting device |
| 04/20/2011 | CN101488474B System and method for scribing substrate |
| 04/14/2011 | WO2011043177A1 Method for cutting silicon ingot using wire saw, and wire saw |
| 04/14/2011 | WO2011042057A1 Device and method for removing coatings from solar modules |
| 04/14/2011 | US20110083655 Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device |
| 04/14/2011 | DE112009000187T5 Rundschleifvorrichtung und Verfahren zum Schleifen Cylindrical grinding apparatus and method for grinding |
| 04/13/2011 | CN201792431U Sapphire crystal axial positioning bonding device |
| 04/13/2011 | CN201792429U Wafer cutting device |
| 04/13/2011 | CN201792428U Sapphire with central square hole |
| 04/13/2011 | CN102017063A Wafer stack cleaning |
| 04/13/2011 | CN102015233A Brittle material breaking apparatus and brittle material breaking method |
| 04/13/2011 | CN101325178B Cutting device |
| 04/13/2011 | CN101062576B Vacuum suction pencil and protection method for wafer conveying applying the same |
| 04/07/2011 | WO2010057671A3 Method and device for handling a cut wafer block |
| 04/06/2011 | EP2303776A1 Method for purification and compaction of feedstock for photovoltaic applications |
| 04/06/2011 | EP2303497A1 Wire spool |
| 04/06/2011 | CN201788953U Wafer splitting tool device |
| 04/06/2011 | CN201784062U Polycrystalline work panel of detachable combination wire break welding machine |
| 04/06/2011 | CN201784061U Numerical control band sawing machine for processing mono-crystalline silicon round stick with overlarge diameter and polycrystalline silicon cast ingot |
| 04/06/2011 | CN201784060U Square-sectioned sapphire with rectangular hole at center |
| 04/06/2011 | CN1914014B Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel |
| 04/06/2011 | CN102006976A Method of, and apparatus for, separating wafers from a wafer stack |
| 04/06/2011 | CN102001137A Connecting device of cutting tool |
| 04/06/2011 | CN101327622B Mortar recovery technique for cutting single-crystal and polycrystalline silicon wire |
| 03/31/2011 | WO2011016996A3 Method for recycling abrasive slurry |
| 03/30/2011 | CN201780982U Photovoltaic panel laminated part edger |
| 03/30/2011 | CN201776845U Wire wheel device for wire cutting |
| 03/30/2011 | CN1890074B Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| 03/30/2011 | CN101992507A Wafer cutting tool and method for cutting wafer by using same |
| 03/30/2011 | CN101992506A Erodible spacer dicing blade gang assembly |
| 03/30/2011 | CN101992505A Cutting device |
| 03/30/2011 | CN101992504A Cutting device |
| 03/30/2011 | CN101227999B Laser processing method and laser processing device |
| 03/24/2011 | WO2011034439A1 Sawing of blocks into wafers using diamond coated wires |
| 03/24/2011 | WO2011032600A1 Method for operating a wire saw device |
| 03/24/2011 | WO2011032599A1 Wire saw work piece support device, support spacer and method of sawing using same |
| 03/24/2011 | WO2011032553A1 Method and separating system having a device for separatively processing crystalline materials and use thereof |
| 03/23/2011 | EP2298521A1 Proton beam assisted ultraprecise processing method for processing single-crystal fragile material |
| 03/23/2011 | EP2298520A1 Method and device for cleaning wafers |
| 03/23/2011 | EP1814817B1 Method of etching using a sacrificial substrate |
| 03/23/2011 | EP1670046B1 Semiconductor substrate cutting method |
| 03/23/2011 | EP1116563B1 Method of cutting ceramic honeycomb molded article |
| 03/23/2011 | CN101504914B Improved cooling apparatus for silicon chip cutting liquor |
| 03/23/2011 | CN101043992B Brittle material scribing method and scribing apparatus |
| 03/23/2011 | CN101001729B Vertical crack forming method and vertical crack forming device in substrate |
| 03/17/2011 | WO2011030802A1 Laser processing method and laser processing device |
| 03/17/2011 | DE112005003549B4 Verfahren zur Herstellung von Siliziumblöcken und Siliziumwafern A process for producing silicon ingots and silicon wafers |
| 03/16/2011 | CN201760976U Machine seat for four-roller guide wheel |
| 03/16/2011 | CN201760975U Wire guide device of multi-wire cutting machine |
| 03/16/2011 | CN201760974U Silicon ingot supporting device of line ingot cutting machine |
| 03/16/2011 | CN101985226A Method of generating cracks in polycrystalline silicon rod and crack generating apparatus |
| 03/15/2011 | US7906437 System and method for the manufacture of surgical blades |
| 03/10/2011 | WO2011026473A1 Method and device for recovering exhausted machining slurries |
| 03/10/2011 | US20110059679 Method for slicing workpiece |
| 03/09/2011 | EP2292398A1 Scribing wheel and method for scribing brittle material substrate |
| 03/09/2011 | CN201755871U Silicon bar cutting machine special fixture capable of turning around |
| 03/03/2011 | WO2011024910A1 Silicon wafer for solar cells and production method therefor |
| 03/03/2011 | WO2011024486A1 Water-soluble cutting fluid for slicing silicon ingots |
| 03/03/2011 | WO2011023749A1 Method for producing wafers |
| 03/03/2011 | WO2010132637A3 Methods for cutting a fragile material |
| 03/03/2011 | US20110048396 Wire saw device |
| 03/02/2011 | EP2288481A1 Process for fastening a silicon block on a support intended therefor and corresponding arrangement |
| 02/24/2011 | WO2010135616A3 Method for separating a sheet of brittle material |
| 02/24/2011 | DE102004051180B4 Waferteilungsverfahren Wafer dividing method |
| 02/23/2011 | EP2286972A1 Method for chamfering brittle material substrate |
| 02/23/2011 | EP2285543A1 Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device |
| 02/23/2011 | CN101979230A Method for cutting silicon carbide crystal in sections by using multi-line cutter |
| 02/22/2011 | US7892946 Device and method for cutting an assembly |
| 02/17/2011 | WO2011018989A1 Laser machining device and laser machining method |
| 02/17/2011 | US20110037149 Method of cutting a wafer-like object and semiconductor chip |
| 02/17/2011 | US20110036339 Apparatus and method for multiple substrate processing |
| 02/16/2011 | EP2284872A2 Method for cutting semiconductor substrate |
| 02/16/2011 | EP2284871A1 Scribe apparatus for thin film solar cell |
| 02/16/2011 | EP2283518A1 Dicing a semiconductor wafer |
| 02/16/2011 | CN101973086A Clamp for cutting silicon wafer |
| 02/16/2011 | CN101973085A Clamping device for clamp used for cutting silicon wafer |
| 02/16/2011 | CN101973084A Automatic winding device with swinging mechanism for multi-wire cutting machine, |
| 02/16/2011 | CN101973083A Cutting wire guide wheel component of silicon rod cut square machine |
| 02/16/2011 | CN101973082A Single crystal butting machine featuring precise positioning |
| 02/16/2011 | CN101973081A Method for cutting head other than tail of 8-inch polycrystalline block by MB wire saw |
| 02/16/2011 | CN101973080A Quartz bar cutting technique |
| 02/16/2011 | CN101973079A Tool set for positioning tension arm of silicon block or silicon bulk cutting apparatus |
| 02/16/2011 | CN101973078A Clamping device of silicon slice cutting device |
| 02/16/2011 | CN101973077A Cutting knife for processing silicon sheet |
| 02/16/2011 | CN101973076A Precise technology for correcting cutting angles of quartz crystal wafers in large scale |
| 02/16/2011 | CN101973075A Silicon rod pad |
| 02/16/2011 | CN101973074A Silicon rod glue joint machine with single clamping bracket |
| 02/16/2011 | CN101973073A Prevention device in cutting sapphire wafer |
| 02/16/2011 | CN101973072A Method for manufacturing silicon rod for slicing by processing polycrystalline silicon ingot |