B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor

Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
06/2011
06/15/2011	CN102099169A Kawabata takashi,sakaguchi ryota,murakami kenji
06/15/2011	CN102099168A Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device
06/15/2011	CN102097546A Method for cutting LED chip
06/15/2011	CN102097428A Integrated circuit wafer and integrated circuit wafer cutting method
06/15/2011	CN102097373A Cutting device
06/15/2011	CN102097372A Wafer processing method
06/15/2011	CN102097371A Substrate dividing device and substrate dividing method using the same
06/15/2011	CN102092103A Process for cutting wire net of silicon wafers
06/15/2011	CN102092102A Crystal-block bonding rod slicing process
06/15/2011	CN101594961B Disklike cutting tool and cutting device
06/15/2011	CN101516573B Cutting method
06/09/2011	US20110132954 Scribing wheel and method for scribing brittle material substrate
06/09/2011	US20110132345 Wire saw device and method for operating same
06/08/2011	CN201856311U Single crystal cutting accurate-positioning device of butting machine
06/08/2011	CN102089130A Device and method for sawing electronic components
06/08/2011	CN102089115A Laser working apparatus, and laser working method
06/08/2011	CN102085696A Device for manufacturing material sheet
06/08/2011	CN102085641A Anti-wire jumper sand-blasting device for multi-wire cutter
06/08/2011	CN101621026B Back laser cutting method of glass passivated silicon wafer
06/08/2011	CN101502985B Workpiece clamping and releasing device of improved multiline cutter
06/08/2011	CN101370617B 钻孔装置 Drilling equipment
06/03/2011	WO2011065373A1 Laser processing method
06/03/2011	WO2011064170A1 Method and device for treating abrasive slurries containing si/sic
06/02/2011	US20110126815 Method of stabilizing opals
06/02/2011	US20110126814 Band saw cutting apparatus and ingot cutting method
06/01/2011	CN201848934U Workbench system of multi-wire cutting machine
06/01/2011	CN102083760A Scribing apparatus
06/01/2011	CN102083598A Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar
06/01/2011	CN102082206A Special scribing and cutting worktable for solar cell chip
06/01/2011	CN102079113A Equipment and method for solving squaring quality problem of silicon ingot
06/01/2011	CN102079112A Cutting method applied in diamond wire squaring machine
06/01/2011	CN102079111A Method for cutting sapphire silicon rod
06/01/2011	CN102079110A Cutting device
06/01/2011	CN102079062A Tension adjusting mechanism of diamond wire extracting machine
06/01/2011	CN102078054A Gemstone and method for cutting the same
06/01/2011	CN101513753B Method for recovering waste slurry of multiline cut silicon chips
06/01/2011	CN101269528B Rapid disc scraping machine
05/2011
05/26/2011	WO2011061039A1 Method for separating grinding oil from grinding slurry; separating station for carrying out said method and plant according to said method
05/26/2011	US20110120441 Wire sawing device
05/25/2011	EP2324950A1 Semiconductor substrate to be cut with treated and minute cavity region
05/25/2011	EP2324948A1 Method of processing an object with formation of three modified regions as starting point for cutting the object
05/25/2011	CN201841613U Mortar jetting device of multi-line cutting machine
05/25/2011	CN201841612U Wafer cutting device
05/25/2011	CN102069533A Multi-stranded diamond wire and production process thereof
05/25/2011	CN102069532A Method and device for reducing abrasions of grooved wheels and guide wheel in multi-line cutting machine
05/25/2011	CN101517711B Cutting method
05/18/2011	CN201833495U Adapting table of sawing machine for cutting crystal silicon rods and crystal silicon ingots
05/18/2011	CN201833493U Silicon block wire cutting machine with baffle plate device
05/18/2011	CN201833492U Single open high-speed chambered edge straight ball roller
05/18/2011	CN201833491U Two-opening high-speed inverted-margin straight ball drum
05/18/2011	CN201833490U Solar silicon chip cutting main roller
05/18/2011	CN201833489U Worktable for cutting silicon chips
05/18/2011	CN201833488U Cutting tool for processing silicon wafers
05/18/2011	CN201833487U Assembled clamp for processing ornaments
05/18/2011	CN1907646B Cutting apparatus equipped with blade detection means
05/18/2011	CN102059750A Diamond wire cutting apparatus and process of silicon wafer for solar cell
05/18/2011	CN102059749A Process for cutting silicon wafer by using steel wire with diameter of 0.1mm
05/18/2011	CN102059748A Process for cutting silicon chip by using steel wire with diameter of 0.11 millimeter
05/18/2011	CN102059747A Method for forming sapphire square hole
05/12/2011	WO2010088501A3 Material sheet handling system and processing methods
05/11/2011	CN201824486U Novel sticky clump square
05/11/2011	CN201824485U Slicing device for battery plates made from multi-crystal silicon ingots
05/11/2011	CN102057314A Substrate processing system
05/11/2011	CN102056720A Process for fastening a silicon block on a support intended therefor and corresponding arrangement
05/11/2011	CN102056719A Scribing wheel and method for scribing brittle material substrate
05/11/2011	CN102056712A Method for cutting work
05/11/2011	CN102049821A Cutting rollers of multi-wire cutting machine
05/11/2011	CN102049820A Working platform of multi-wire cutting machine
05/11/2011	CN102049819A Numerical control inner circle cutting machine
05/11/2011	CN102049818A Cutting method for crystalline silicon ingot
05/11/2011	CN102049817A Wire arraying mechanism of wire winding drum of diamond wire cutting machine
05/11/2011	CN102049816A Constant tension numerical control multi-thread square cutting machine without pressure sensor
05/11/2011	CN102049815A Cut-off device
05/11/2011	CN102049612A Laser machining method, laser machining device and chip manufacturing method
05/05/2011	WO2011052193A1 Guide roller
05/05/2011	WO2011051329A1 Tilting device for cropping a sheet of laminated glass
05/05/2011	WO2011050945A1 Wire saw comprising a wire web and cleaning nozzles
05/05/2011	US20110100348 Mounting Plate For A Wire Sawing Device, Wire Sawing Device Comprising The Same, And Wire Sawing Process Carried Out By The Device
05/05/2011	US20110100347 Wire and Methodology for Cutting Materials With Wire
05/05/2011	US20110100346 Abrasive grain powder
05/04/2011	CN201816151U Cutting wire transmission guide wheel component of silicon rod cube cutting machine
05/04/2011	CN201816150U Main roll driving tension regulator of multi-wire saw
05/04/2011	CN201816149U Monocrystalline silicon wire cutting mechanism
05/04/2011	CN201816148U Automatic crystal slotting milling machine
05/04/2011	CN201816147U Semiconductor chip splitting tool
05/04/2011	CN102047392A Scribe apparatus for thin film solar cell
05/04/2011	CN102046346A Method for chamfering brittle material substrate
05/04/2011	CN102046345A Method for processing fragile material substrate
05/04/2011	CN102046344A Apparatus and method for multiple substrate processing
05/04/2011	CN102040330A Breaking apparatus and breaking method
05/04/2011	CN102039638A Cutting method for cutting substrate by utilizing cutting line
05/04/2011	CN101242927B Laser processing method
05/04/2011	CN101068666B Method and apparatus for scribing brittle material board and system for breaking brittle material board
04/2011
04/27/2011	EP2313233A2 Wire slicing system
04/27/2011	CN201808159U Broken wire remedial device in wire cutting
04/27/2011	CN201808157U Cutting line control device for multi-line cutting machine
04/27/2011	CN201808156U Cutting table
04/27/2011	CN102029656A Cutting process for Z surface X-direction angle control of Z plate seed crystal blocks
04/27/2011	CN102029655A Film for semiconductor apparatus
04/21/2011	WO2011044871A1 Method and device for removing substrates

1 ... 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 ... 67