| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 08/11/2011 | WO2011096388A1 Method for breaking brittle material substrate |
| 08/11/2011 | WO2011096019A1 Wire saw |
| 08/11/2011 | WO2011096018A1 Method of cutting workpiece with wire saw, and wire saw |
| 08/11/2011 | US20110192819 System and method for the manufacture of surgical blades |
| 08/11/2011 | US20110192388 Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material |
| 08/11/2011 | DE10236708B4 Verfahren zum Erzeugen eines durchgeschnittenen harten, spröden Wabenstrukturkörpers A method of producing a through-cut hard, brittle honeycomb structural body |
| 08/10/2011 | CN101425473B Vacuum keeping device and wafer cutting machine having the device |
| 08/10/2011 | CN101378037B Cutting method and cutting device |
| 08/04/2011 | WO2011093482A1 Method for producing member having bottomed hole, and working tool |
| 08/04/2011 | WO2011091650A1 Laser marking dust-removal device and dust-removal method |
| 08/03/2011 | EP2352163A2 Scribing apparatus for thin film solar cells |
| 08/03/2011 | CN201913716U 多线切割机断线处理装置 MWS disconnection processing device |
| 08/03/2011 | CN201913715U 多线切方机切割线保护套 Multi-line squaring machine cut line protective sleeve |
| 08/03/2011 | CN201913714U 一种适用于大直径超薄硅片切割的切割机切割线网系统 One for large diameter thin wafer cutting cutter cutting line network system |
| 08/03/2011 | CN1610068B Method of dividing a non-metal substrate |
| 08/03/2011 | CN102142485A Scribing apparatus for thin film solar cells |
| 08/03/2011 | CN102139517A Method for cutting water/oxygen-sensitive rare-earth halide crystal |
| 08/03/2011 | CN101602231B Preparation method of electroplating diamond fret saw |
| 08/02/2011 | US7988530 Slicing method |
| 07/28/2011 | US20110183582 Method for producing a semiconductor wafer |
| 07/27/2011 | EP2346658A1 Method for separating wafers from a wafer support and device therefor |
| 07/27/2011 | CN201907161U Water cooling device for multi-wire cutting machine |
| 07/27/2011 | CN102137735A Wire slicing system |
| 07/27/2011 | CN102136454A Wafer dividing apparatus and laser processing apparatus |
| 07/27/2011 | CN102133777A Wire-break processing device for multi-wire cutting machines |
| 07/27/2011 | CN102133776A Linear cutting method of polycrystal casting ingot |
| 07/27/2011 | CN102133775A Method for installing crystalline silicon briquettes |
| 07/27/2011 | CN101362364B High precision translational worktable of hard and brittle cut-off machine |
| 07/21/2011 | WO2011086170A1 Method and device for providing wafers and use thereof |
| 07/21/2011 | US20110174285 Ingot cutting apparatus and ingot cutting method |
| 07/21/2011 | DE102009045614B4 Verfahren zum Durchtrennen eines Werkstücks A method for cutting a workpiece |
| 07/20/2011 | CN201904367U Scribing platform deck special for solar battery chip |
| 07/20/2011 | CN201900691U Cutting roller of multi-wire cutting machine |
| 07/20/2011 | CN201900690U Radial balancing mechanism of automatic cable discharge device of multi-wire cutting machine |
| 07/20/2011 | CN201900689U Mortar recycling device of multi-wire cutting machine |
| 07/20/2011 | CN201900688U Multi-strand sawing wire |
| 07/20/2011 | CN201900687U Improved cutting steel wire |
| 07/20/2011 | CN201900686U Special-shaped cutting steel wire with glue coating layer |
| 07/20/2011 | CN201900685U Wavy special-shaped cutting steel wire |
| 07/20/2011 | CN201900684U Wavy cutting steel wire with glue coating layer |
| 07/20/2011 | CN201900683U Cutting steel wire with smooth glue coating |
| 07/20/2011 | CN201900682U Multi-strand cutting steel wire with glue coating |
| 07/20/2011 | CN201900681U Special-shaped cutting steel wire |
| 07/20/2011 | CN201900680U Cutoff machine |
| 07/20/2011 | CN1824482B Cutting device |
| 07/20/2011 | CN102130238A Method for cutting sapphire substrate LED chip |
| 07/20/2011 | CN102130237A Method for cutting sapphire substrate LED chip |
| 07/20/2011 | CN102130222A Manufacturing method of optical device |
| 07/20/2011 | CN102126261A Wire saw with cutting function |
| 07/20/2011 | CN102126260A Method for processing irregular PDC (Polycrystalline Diamond Composite) |
| 07/20/2011 | CN102126259A 切削装置和切削方法 Cutting apparatus and cutting method |
| 07/20/2011 | CN102126175A Method for producing a semiconductor wafer |
| 07/20/2011 | CN102126167A Method for processing diamond end face of PDC |
| 07/20/2011 | CN101602233B Method and device for circularly utilizing washing water of multi-line cutting machine |
| 07/20/2011 | CN101567303B Laser film engraving equipment and scribing method |
| 07/20/2011 | CN101391463B Multi-line cutting machine |
| 07/14/2011 | DE112009001446T5 Verfahren zum Zerschneiden eines Werkstücks A method of cutting a workpiece |
| 07/13/2011 | EP2343173A1 Groove machining tool for use with a thin-film solar cell |
| 07/13/2011 | EP2343172A1 Groove machining tool for use with a thin-film solar cell and an angle regulation structure |
| 07/13/2011 | EP2343155A1 Multi-wire saw |
| 07/13/2011 | EP1500484B1 Method and system for machining fragile material |
| 07/13/2011 | CN201895370U Polycrystalline working plate of wire-cutting machine |
| 07/13/2011 | CN201895369U Microcomputer-controlled multi-line wafer cutting machine with sand prevention devices |
| 07/13/2011 | CN201895368U Rotating roller mechanism of microcomputer-controlled multi-line wafer cutting machine |
| 07/13/2011 | CN201895367U Wire feeding and collecting device for the wire-electrode cutting of monocrystalline silicon |
| 07/13/2011 | CN102120344A Single-crystal material cutting method based on fluctuation characteristic of cutting force and fine tuning tool rest |
| 07/07/2011 | WO2011081533A1 Method for cutting a block of silicon into wafers |
| 07/07/2011 | WO2011081532A1 Sawing blocks into wafers using initially bowed wires |
| 07/07/2011 | US20110163326 Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate |
| 07/06/2011 | EP2340911A1 Laser processing method of a workpiece by forming division originating points inthere, dividing method for a workpiece, and laser processing apparatus |
| 07/06/2011 | CN1974168B Cutting device |
| 06/30/2011 | DE102009060575A1 Method for separating silicon wafer from ingot, involves deactivating or releasing connection layer between wafer and carrier plate by directed electromagnetic energy input for separation of wafer from carrier plate |
| 06/29/2011 | EP1361961B1 Forming a mark on a gemstone or industrial diamond |
| 06/29/2011 | CN201881490U Workbench of multi-wire cutting machine |
| 06/29/2011 | CN102110587A Consumption managing method of cutting blade |
| 06/29/2011 | CN102107465A Method and device for reducing cutting line mark of solar silicon slice |
| 06/29/2011 | CN102107464A Silicon ingot cutting device and cutting method |
| 06/29/2011 | CN102107463A Method for cutting wafers |
| 06/29/2011 | CN102107462A Method for processing diamond |
| 06/29/2011 | CN101716745B Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery |
| 06/29/2011 | CN101508152B Solar energy film cutting device follow-up dust suction device |
| 06/23/2011 | US20110147349 Wafer dividing apparatus and laser processing apparatus |
| 06/23/2011 | US20110146350 Round brilliant cut gemstone and method for cutting the same |
| 06/23/2011 | US20110146349 Gemstone and method for cutting the same |
| 06/22/2011 | EP1951490B1 Device and method for dividing up substrates in wafer form by using adhesion forces |
| 06/22/2011 | CN201872260U Single crystal splicing apparatus |
| 06/22/2011 | CN201872065U Rotary cutting device for rare earth permanent magnet |
| 06/22/2011 | CN102105265A Method for resuming operation of wire saw and wire saw |
| 06/22/2011 | CN102101326A Method and device for recycling multi-thread cutting machine mortar |
| 06/22/2011 | CN102101325A Radial balance mechanism for automatic wire arranging device of multi-wire cutting machine |
| 06/22/2011 | CN102101324A Ultrasonic cutting device of silicon ingot |
| 06/16/2011 | WO2011070410A1 Motor including cleft magnet and method of manufacturing the motor |
| 06/16/2011 | WO2011070386A1 Monitoring device for the wire of a wire saw device and method for operating the same |
| 06/15/2011 | EP2332687A1 Laser beam machining method using pulsed laser beam and expanded tape for cutting a machining target |
| 06/15/2011 | EP1498215B1 Laser processing method |
| 06/15/2011 | CN201863308U Treatment device of broken lines in cutting process of silicon wafers |
| 06/15/2011 | CN201863307U Traverse unit detection device of solar silicon-wafer wire cutting machine |
| 06/15/2011 | CN201863306U Feeding device for jewel processing |
| 06/15/2011 | CN201863305U Connecting device of silicon wafer cutting workbench |
| 06/15/2011 | CN1935480B Alignment method for wafer |