| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
|---|
| 09/29/2011 | DE112009001747T5 Verfahren zur Wiederaufnahme des Betriebs einer Drahtsäge und Drahtsäge Process for the resumption of the operation of a wire saw and wire saw |
| 09/29/2011 | DE102010013253A1 Verfahren zum Strukturieren von CIGS-Dünnschichtsolarzellen Method for structuring of CIGS thin-film solar cells |
| 09/28/2011 | EP1973696B1 Drilling device |
| 09/28/2011 | CN201989250U 硅棒切割底座 Ingot cutting base |
| 09/28/2011 | CN201989249U 多线晶片切割机旋转罗拉 Multi-line wafer dicing machine rotating rollers |
| 09/28/2011 | CN201989248U 手提式晶托 Portable crystal care |
| 09/28/2011 | CN201989247U 多线晶片切割机主轴 Multi-line wafer dicing machine spindle |
| 09/28/2011 | CN1819159B Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device |
| 09/28/2011 | CN102198702A Wire unreeling device of multi-wire cutting machine |
| 09/28/2011 | CN102198701A Method for processing facet silicon carbide jewel finished product |
| 09/28/2011 | CN102198700A Device for knocking and splitting diamond synthetic block |
| 09/28/2011 | CN101628452B Method for cutting silicon chips |
| 09/28/2011 | CN101360592B Slurry for silicon ingot slicing and silicon ingot slicing method using the same |
| 09/28/2011 | CN101345212B Wafer dividing method |
| 09/21/2011 | CN201985077U 一种用于半导体晶片加工的化蜡装置 Wax apparatus for processing a semiconductor wafer |
| 09/21/2011 | CN201979616U 硅片多线切割断线检测装置 Multi-line cutting wafer breakage detection device |
| 09/21/2011 | CN201979614U 硅棒的对接夹具 Silicon rod butt fixture |
| 09/21/2011 | CN102194931A Optical device wafer processing method |
| 09/21/2011 | CN102194762A Semiconductor device and manufacturing method thereof |
| 09/21/2011 | CN102190973A Film for manufacturing semiconductor device and method of manufacturing semiconductor device |
| 09/21/2011 | CN102189612A Multi-wire cutter special for sapphire |
| 09/21/2011 | CN102189611A Equidensity mortar cutting method and device for linear cutting of solar wafer |
| 09/15/2011 | WO2011110430A1 Method for machining a semiconductor wafer |
| 09/15/2011 | DE102010010887A1 Method for separating semiconductor silicon wafers from e.g. polycrystalline crystal block for electronic application, involves choosing lengths of saw wire moved in respective directions such that wire point completes number of cycles |
| 09/14/2011 | EP1595668B1 Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 09/14/2011 | CN201970414U Wire guide wheel for square cutting machine |
| 09/14/2011 | CN201970410U High-efficiency four-spindle slicing machine |
| 09/14/2011 | CN201970409U 一种开方对线校对检具 One kind of evolution for wire gage calibration |
| 09/14/2011 | CN201970408U 一种晶体硅块切割夹具 A crystalline silicon block cutting jig |
| 09/14/2011 | CN201970407U 硅晶片多线切割机的冷却装置 Silicon wafer cooling device MWS |
| 09/14/2011 | CN102186644A Method for separating wafers from a wafer support and device therefor |
| 09/14/2011 | CN102181916A Method for improving uniformity of resistivity in N type 111 crystal direction |
| 09/14/2011 | CN102179880A Multi-wire cutting machine |
| 09/14/2011 | CN102179879A Numerically controlled wire saw slicing grinder |
| 09/14/2011 | CN101652849B Method and device for separation of silicon wafers |
| 09/14/2011 | CN101618519B Method and device thereof for linearly cutting silicon slice |
| 09/14/2011 | CN101612743B Saw blade swing limiting device of thread sawing machine |
| 09/14/2011 | CN101524875B Process for multi-wire cutting of bismuth telluride by cutting machine |
| 09/14/2011 | CN101168270B Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers |
| 09/07/2011 | CN201960675U 点切割式大尺寸蓝宝石专用带锯切割机 Point Cutting large-size sapphire dedicated band saw cutting machine |
| 09/07/2011 | CN201960674U 一种具有磨料涂层的多股切割钢丝 Multi-strand cutting wire having an abrasive coating |
| 09/07/2011 | CN201960673U 一种晶硅片多线切割机的装载机构 A crystalline silicon wafer loading mechanism MWS |
| 09/07/2011 | CN1956814B Device and method for conditioning and monitoring of a saw blade |
| 09/07/2011 | CN1817603B Wafer dividing method |
| 09/07/2011 | CN102176335A Method for manufacturing crystal array of gamma-ray detector |
| 09/07/2011 | CN102174749A Free edge material cutting line with aramid core wire and preparation method thereof |
| 09/07/2011 | CN102172999A Aramid fiber core wire saw and preparation method thereof |
| 09/07/2011 | CN102172998A Steel core wire free cutting line and manufacture method thereof |
| 09/07/2011 | CN102172997A Silicon crystal line cutting equipment |
| 09/07/2011 | CN102172996A Crystal immersing and cutting method |
| 09/07/2011 | CN102172995A Metal composite wire and preparation method thereof |
| 09/07/2011 | CN102172994A Metal composite wire, preparation method thereof and metal wire |
| 09/07/2011 | CN102172993A Method for cutting silicon bar by using separate line net |
| 09/07/2011 | CN102172992A Designing method for chamfered ball tube |
| 09/07/2011 | CN102172799A Laser processing method and laser processing device |
| 09/07/2011 | CN101502913B Laser beam machining method and laser beam machining device |
| 09/07/2011 | CN101486232B Oriented cutting method for preparing infrared non-linear optics element from yellow copper positive uni-axial crystal |
| 09/06/2011 | US8011546 Scribing and breaking apparatus and system therefor |
| 09/01/2011 | WO2011106203A2 Spalling for a semiconductor substrate |
| 09/01/2011 | WO2011105450A1 Method for designing resin-coated saw wire |
| 09/01/2011 | WO2011105339A1 Base wire for coated saw wire |
| 09/01/2011 | WO2011104097A1 Method for producing a plurality of optoelectronic semiconductor chips |
| 09/01/2011 | CA2783380A1 Spalling for a semiconductor substrate |
| 08/31/2011 | CN201950736U 一种自动切片机用电容瓷片粘料板 An automatic slicer with a sticky material plate capacitor tiles |
| 08/31/2011 | CN1906002B Scribe forming structure, scribe head and scribe device |
| 08/31/2011 | CN102168296A Method for regenerating waste diamond wire saw |
| 08/31/2011 | CN102167924A Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
| 08/31/2011 | CN102166793A Multiwire cutting machine dedicated to LEDs (light emitted diode) |
| 08/31/2011 | CN102166792A Diamond fret saw and manufacture method thereof |
| 08/31/2011 | CN102166791A Silicon rod multi-wire cutting machine guide wheel slotting one-time molding combined machine tool and application thereof |
| 08/31/2011 | CN102166790A Processing method for removing rough surface and scars of sapphire substrate |
| 08/31/2011 | CN101200102B Method for slicing a multiplicity of wafers from a workpiece |
| 08/24/2011 | EP2360734A2 Silicon substrate for solar battery, manufacturing apparatus thereof, manufacturing method thereof, and solar battery |
| 08/24/2011 | EP2359976A1 Method of processing an object with formation of three modified regions as starting point for cutting the object |
| 08/24/2011 | CN1788965B Apparatus and method for slicing an ingot |
| 08/17/2011 | EP1806202B1 Method and device for forming crack |
| 08/17/2011 | CN102157449A Wafer processing method |
| 08/17/2011 | CN102157446A Method for processing wafer |
| 08/17/2011 | CN102157366A Method for reducing warping degree of thinned wafer |
| 08/17/2011 | CN102157355A Method of cleaning and micro-etching semiconductor wafers |
| 08/17/2011 | CN102152425A Fixing device assisting multi-wire cutting machine in cutting of silicon single crystal rods |
| 08/17/2011 | CN102152422A Automatic deviation-correcting unwinding guider |
| 08/17/2011 | CN102152421A Device and method for preparing linear cutting steel wires for solar silicon wafers |
| 08/17/2011 | CN102152420A Low-loss oriented cutting method of large-size sapphire crystal blanks |
| 08/17/2011 | CN102152419A Process for carrying out multiline cutting on silicon slices |
| 08/17/2011 | CN102152418A Multi-axis cutting machine |
| 08/17/2011 | CN102152417A Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material |
| 08/17/2011 | CN102152416A Diamond fretsaw and manufacture method thereof |
| 08/17/2011 | CN102152415A Cutting line winding method and transmission device for multi-thread cutting machine |
| 08/17/2011 | CN102152414A Substrate separation device |
| 08/17/2011 | CN102152413A Wafer processing method |
| 08/17/2011 | CN102152412A Borer capable of grinding and boring holes on silicon core or other crystal materials |
| 08/17/2011 | CN102152411A Method for reducing impurity ratio of polycrystalline ingot |
| 08/17/2011 | CN102152410A Cutting method for adjusting crystal orientation excursion by rotating single crystal rod |
| 08/17/2011 | CN102151985A Laser processing method |
| 08/17/2011 | CN101559629B Coaxial image system applied to LED laser cutting device |
| 08/17/2011 | CN101284402B Multi-line cutting machine |
| 08/17/2011 | CN101284401B Multi-line cutting machine in-phase servo drive and constant tension control system |
| 08/16/2011 | US7997956 Quartz glass tool for heat treatment of silicon wafer and process for producing the same |
| 08/16/2011 | US7997262 Method of improving nanotopography of surface of wafer and wire saw apparatus |