B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor

Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
11/2011
11/17/2011	WO2011106203A3 Spalling for a semiconductor substrate
11/16/2011	CN202042467U Wafer floating pressure plate
11/16/2011	CN202037744U Multi-wire cutting machine
11/16/2011	CN202037743U Riving knife fixing structure
11/16/2011	CN202037742U Special-shaped cutting steel wire with abrasive coating
11/16/2011	CN202037741U A cutting wire possessing an abrasive coating
11/16/2011	CN202037740U Seed crystal cutter
11/16/2011	CN202037739U Hot cutting device for rolled microcrystal plates
11/16/2011	CN202036892U High-pressure air filter unit used for polysilicon slicing machine
11/16/2011	CN102241084A Double-cutterhead horizontal ultra-precision hydrostatic motorized spindle system
11/16/2011	CN102241083A Isoviscous mortar cutting method and device used for wire-electrode cutting of solar silicon wafer
11/16/2011	CN102241082A Nickel-based amorphous alloy modified cutting steel wire
11/16/2011	CN102241081A Method and device for improving non-uniform thickness in blade-feeding position during multi-line cutting of silicon chip
11/16/2011	CN102241080A Steel wire leading-in end device for multi-wire cutting machine
11/16/2011	CN102241079A Crystal bar cutting mechanism with saw
11/16/2011	CN102241078A Work cutting device and work cutting method
11/16/2011	CN102241077A Method for manufacturing similar mono-crystal silicon ingot seed crystal by adopting casting process
11/16/2011	CN101758565B Bonding device of direction-finder
11/09/2011	EP2385026A1 Cutter and method for cutting brittle material substrate using same
11/09/2011	CN202029263U Slicer pulley
11/09/2011	CN202029258U Composite plating diamond wire rope taking pre-deforming wire as base line
11/09/2011	CN202029257U Diamond wire saw device
11/09/2011	CN202029256U Solar-powered polycrystalline silicon multi-line slicer
11/09/2011	CN202029255U Silicon wafer scribing machine
11/09/2011	CN202029254U Crystal bar line square sectioning machine
11/09/2011	CN102239034A Splitting apparatus and cleavage method for brittle material
11/09/2011	CN102237308A Semiconductor chip cutting method
11/09/2011	CN102233620A Method for controlling multi-wire cutting load
11/09/2011	CN102233619A Process for slicing eight-inch solar single crystal silicon
11/09/2011	CN101391464B Home roll for line cutting machine
11/09/2011	CN101356047B Apparatus and method for separating and transporting substrates
11/03/2011	US20110265514 Method of cutting diamonds
11/02/2011	EP2383088A1 Breaking apparatus and breaking method for substrate made of brittle material
11/02/2011	EP2382291A2 Methods to recover and purify silicon particles from saw kerf
11/02/2011	CN202021707U Double-cutter head horizontal ultra-precision liquid static pressure electric spindle system
11/02/2011	CN202021704U Special multi-wire cutter for sapphire
11/02/2011	CN202021703U New silicon slice cutting device
11/02/2011	CN202021702U Macromolecular resin tooth saw drum
11/02/2011	CN1667798B Method and apparatus for cleaving a wafer, method and apparatus for manufacturing semiconductor device
11/02/2011	CN102229792A Solar silicon wafer cutting mortar
11/02/2011	CN102229216A Shaft drawer for multi-wire cutting machine
11/02/2011	CN102229215A Y-axis directional sliding platform arranged on multi-wire cutter
11/02/2011	CN102229214A Nozzle for production of silicon chip and silicon chip production system
11/02/2011	CN102229213A Silicon block wire saw machine tool and silicon block fixing device thereof
11/02/2011	CN102229212A Wet silicon carbide sand for solar silicon chip wire cutting
11/02/2011	CN102229211A Crystalline material grinding and boring drill capable of removing chips automatically
11/02/2011	CN102229210A Brittle large-size single crystal cutting and fixing equipment and working method thereof
11/02/2011	CN102229209A Method for using non-standard sand aggregates generated in manufacturing process of silicon carbide sand aggregates in solar silicon wafer cutting mortar
11/02/2011	CN101596749B Production method of brazed diamond wire saw
11/02/2011	CN101502984B Structure for deploying and retracting cutting line for silicon chip cutter
11/02/2011	CN101362365B Steel wire tightening apparatus of hard material slicing apparatus
11/01/2011	US8048774 Methods and systems for laser machining a substrate
10/2011
10/26/2011	EP1461190B1 Device for cutting a substrate layer and corresponding method
10/26/2011	CN202016135U Bobbin charging wagon for solar silicon wafer slicing machine
10/26/2011	CN202016134U Quick release type flow guide rod for solar silicon wafer slicing machine
10/26/2011	CN202016132U Nose anti-sticking structure of splitting machine and anti-sticking splitting machine
10/26/2011	CN202016131U Three-roller multi-wire cutting machine
10/26/2011	CN202016130U Gas mixing valve, fire pipe and crystal material bonding machine
10/26/2011	CN1931551B Cutting apparatus and processing method
10/26/2011	CN1810480B Method for manufacturing a doughnut-shaped glass substrate
10/26/2011	CN102225599A Method for bonding polysilicon ingot and tray
10/26/2011	CN102225598A Solar silicon wafer wire cutting guide roller and manufacturing method and special film coating machine and electroplating machine
10/26/2011	CN102225597A Continuous wire used for cutting hard and crisp materials and preparation method thereof
10/26/2011	CN102225596A Solar silicon wafer wire cutting steel wire and manufacturing method thereof
10/26/2011	CN102225595A Steel rope for stringed bead type diamond wire saw and manufacturing method thereof
10/26/2011	CN102225594A Multi-wire cutting machine for cutting curved surface
10/26/2011	CN102225593A Diamond wire saw device
10/26/2011	CN102225592A Method for improving sapphire crystal ingot bar taking yield
10/26/2011	CN102225591A Method for improving sapphire crystal ingot bar taking yield by utilizing 8-shaped cutting
10/20/2011	WO2011129265A1 Apparatus and method for processing glass sheet
10/19/2011	EP2377823A1 Method and device for cutting brittle-material plate, and window glass for vehicle
10/19/2011	EP2377662A1 Single crystal
10/19/2011	EP2376587A1 Slurry composition containing non-ionic polymer and method for use
10/19/2011	EP2376586A2 Cutting fluid composition for wiresawing
10/19/2011	CN202011080U Brick master for avoiding sagging of mortars
10/19/2011	CN102219369A Disjunction method of brittle material substrate and substrate disjunction device applied in the method
10/19/2011	CN102218778A Processing method of brittle material substrate and laser processing device applied in the method
10/19/2011	CN102218777A Disjunction method of brittle material substrate
10/19/2011	CN101901740B Electronic component cutting and stripping machine and method thereof
10/18/2011	US8037878 Method for slicing workpiece by using wire saw and wire saw
10/13/2011	WO2011054510A3 Wafer processing
10/12/2011	CN202008985U Packaging and cutting jig
10/12/2011	CN202006520U Monocrystalline silicon slice running car
10/12/2011	CN202006518U Main shaft parallel degree adjusting mechanism on crystal processing equipment
10/12/2011	CN102214606A Cutting device
10/12/2011	CN102214566A Optical device wafer processing method
10/12/2011	CN102214555A Method for thinning sapphire wafer
10/12/2011	CN102211362A Three-roller multi-wire cutting machine
10/12/2011	CN102211361A Binding structure of structural member
10/06/2011	WO2011122144A1 Main roller for wire saw
10/06/2011	US20110244657 Semiconductor die singulation method
10/06/2011	US20110240002 Cutting fluid composition for wiresawing
10/06/2011	US20110239705 Decorative jewel and method for cutting decorative jewel
10/05/2011	EP2372448A1 Method of manufacturing a wavelength converter
10/05/2011	EP1983557B1 Laser beam machining method
10/05/2011	EP1579971B1 Method for dividing a substrate and a panel production method
10/05/2011	CN201998336U Wavy cutting steel wire
10/05/2011	CN102205563A Spiral waveform cutting metal wire as well as manufacturing method and equipment thereof
10/05/2011	CN102205562A Cutting device and cutting method
09/2011
09/29/2011	WO2011118864A1 Method for slicing synthetic corundum single-crystal ingot

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