| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 01/11/2012 | EP2404989A1 Method for wafer dicing and composition useful therefor |
| 01/11/2012 | CN202106480U Infrared temperature control device applied on laser crystal cutting machine |
| 01/11/2012 | CN102311863A Method for wafer dicing and composition useful thereof |
| 01/11/2012 | CN102310491A Rotary joint of solar monocrystalline silicon cutting machine and using method thereof |
| 01/11/2012 | CN102310490A Poly-silicon splitting process and silicon ingot overturning mechanism |
| 01/11/2012 | CN102310489A Cutting wire with composite structure, and manufacturing method and manufacturing equipment thereof |
| 01/05/2012 | WO2012001698A1 Multiple diamond planning and bruting machine |
| 01/04/2012 | EP2402984A1 Semiconductor element manufacturing method |
| 01/04/2012 | EP2402131A1 Scribing apparatus and scribing method |
| 01/04/2012 | EP2402100A1 Slotting tool, and thin film solar cell slotting method and scribing device using same |
| 01/04/2012 | CN202100675U Double-row centre chain drive device of hydraulic drill clamp |
| 01/04/2012 | CN202097854U Wire deformation correcting device for crystal cushion-adding machine |
| 01/04/2012 | CN101712186B Preparation method of guide roller used for cutting silicon chips |
| 01/04/2012 | CN101704276B Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof |
| 12/29/2011 | WO2011162392A1 Cutting method and cutting apparatus |
| 12/28/2011 | EP2400539A2 Substrate dividing method |
| 12/28/2011 | CN202088319U 工字轮快速固定装置 Quick word round fixtures |
| 12/28/2011 | CN202088318U 一种硅片切割设备 One kind of Cutting equipment |
| 12/28/2011 | CN202088317U 硅料切割设备 Silicon material cutting equipment |
| 12/28/2011 | CN202088316U 硅晶体线切割机 Cutting silicon crystals |
| 12/28/2011 | CN102301446A 材料片的操作系统和加工方法 Material sheet operating system and processing method |
| 12/28/2011 | CN102300821A 切割器及使用该切割器的脆性材料基板的切断方法 Cutter and cutting method using the cutting unit brittle material substrate |
| 12/28/2011 | CN102300688A 基板分断装置 Substrate cutting device |
| 12/28/2011 | CN102294758A 冷却介质回收方法 Coolant recovery methods |
| 12/28/2011 | CN102294757A 一种使用金刚石线切割的单晶短棒拼接方法 A method of using a single crystal diamond wire cutting rod splicing method |
| 12/27/2011 | US8083115 Substrate cutting device and method |
| 12/22/2011 | WO2011158672A1 Laser processing method |
| 12/21/2011 | CN202079691U 一种单晶棒切断机用的夹具 Single crystal rod cutter jig |
| 12/21/2011 | CN202079689U 一种多线切割机的导辊结构 A multi-wire cutting guide roller structure |
| 12/21/2011 | CN202079686U 一种多线切割机的工件夹紧机构 A multi-wire cutting workpiece clamping mechanism |
| 12/21/2011 | CN102285011A 一种使用金刚石线切割的太阳能级多晶硅片的方法 A method of using a diamond wire cutting solar grade polysilicon sheet |
| 12/21/2011 | CN102285010A 一种使用金刚石线切割的太阳能级硅晶薄片及其切割方法 A method of using a diamond wire cutting of solar grade silicon sheet and cutting methods |
| 12/21/2011 | CN102285009A 脆性材料用划线轮及脆性材料的划线方法及装置、工具 Brittle materials scribing method and apparatus for scribing wheel and brittle materials, tools |
| 12/21/2011 | CN102285008A 脆性材料用划线轮及脆性材料的划线方法及装置、工具 Brittle materials scribing method and apparatus for scribing wheel and brittle materials, tools |
| 12/21/2011 | CN102284970A 非金属材料多丝线切割用的旋转超声换能器 Rotary ultrasonic multi-wire cutting non-metallic materials used in transducers |
| 12/21/2011 | CN101740353B 切割模片接合膜和生产半导体器件的方法 The method of dicing die bonding film and a semiconductor device production |
| 12/21/2011 | CN101193732B 用于定位和保持切开的衬底块上的薄衬底的装置和方法 Means for positioning and holding a thin substrate and a method of cutting the substrate block of |
| 12/21/2011 | CN101032843B 晶片分割方法 Segmentation wafers |
| 12/15/2011 | WO2011155314A1 Method for cutting glass sheet |
| 12/15/2011 | US20110303210 Wiresaw cutting method |
| 12/15/2011 | US20110302959 Precious stone setting |
| 12/14/2011 | CN202071234U 硅片加工用导轮装置 Wafer processing equipment with guide wheel |
| 12/14/2011 | CN202071231U 数控线锯切片磨床 CNC wire cutting piece grinder |
| 12/14/2011 | CN202071230U 多晶锭或单晶棒的开方工具 Polycrystalline or monocrystalline ingot bars prescribing tool |
| 12/14/2011 | CN202071229U 晶棒粘接校正仪 Ingot bonding Calibrator |
| 12/14/2011 | CN102280410A 基于玻璃基的plc晶圆切割方法 Based plc glass substrate wafer cutting method |
| 12/14/2011 | CN102280380A 通过加工单晶而制造多个半导体晶片的方法 The method of processing a single crystal is manufactured by a plurality of semiconductor wafers |
| 12/14/2011 | CN102275233A 一种切割170μm硅片的方法 A cutting method 170μm wafers |
| 12/14/2011 | CN102275232A 一种硅块切割方法 A silicone block cutting method |
| 12/14/2011 | CN102275231A 三维超声波振动切削加工工作头 Three-dimensional ultrasonic vibration cutting working head |
| 12/14/2011 | CN102275229A 脆性材料基板的切割方法 The method of cutting a brittle material substrate |
| 12/14/2011 | CN101596719B 基板分断系统 Substrate cutting system |
| 12/14/2011 | CN101559627B 粒子束辅助单晶脆性材料超精密加工方法 Beam assisted single crystal brittle material ultra-precision machining method |
| 12/08/2011 | WO2011151022A1 Wire saw having wire-break monitoring |
| 12/07/2011 | EP2392024A2 Material sheet handling system and processing methods |
| 12/07/2011 | CN202062528U 切割装置 Cutting device |
| 12/07/2011 | CN202062527U 一种多线切割机两轴三向导向轮布线装置 A multi-axis EDM three to two guide wheels wiring devices |
| 12/07/2011 | CN202062517U 一种开方机中多晶硅锭的放置结构 An evolution machine placed Polysilicon Ingot |
| 12/07/2011 | CN102268616A 一种非晶态合金改性切割钢线 Modification of an amorphous alloy steel wire cutting |
| 12/07/2011 | CN102267198A 划片机的刀具冷却装置及划片机 Dicing machine tool cooling device and dicing machine |
| 12/07/2011 | CN102267197A 一种硅料切割方法 A silicone material cutting method |
| 12/07/2011 | CN102267196A 一种多线切割机的布线方法 A multi-wire cutting wiring method |
| 12/07/2011 | CN102267195A 用于切割的表面附着碳化硅颗粒的钢线 For cutting silicon carbide particles attached to the surface of the steel wire |
| 12/07/2011 | CN102267194A 切削装置 Cutting device |
| 12/07/2011 | CN101838838B 一种复合金刚石线锯的制备方法 Method for preparing a composite diamond wire saw |
| 12/07/2011 | CN101486231B 黄铜矿类负单轴晶体制备红外非线性光学元件的定向切割方法 Directional cutting method chalcopyrite negative uniaxial crystal preparation class infrared nonlinear optical element |
| 12/07/2011 | CN101146657B 划线装置 Scribing device |
| 12/07/2011 | CN101128294B 脆性材料制板切割方法及其设备 Brittle material plate cutting method and apparatus |
| 12/01/2011 | WO2011148559A1 Apparatus for separating semiconductor wafers |
| 11/30/2011 | EP1541311B1 Pasted base board cutting system and base board cutting method |
| 11/30/2011 | CN202058704U 高速晶圆劈裂装置 High-speed wafer splitting device |
| 11/30/2011 | CN202053395U 一种单晶棒切断机用的夹具 Single crystal rod cutter jig |
| 11/30/2011 | CN202053390U 太阳能硅片切片机用快拆式喷嘴 Solar wafer slicing machine nozzle with quick release |
| 11/30/2011 | CN202053389U 线切割装置 Wire cutting device |
| 11/30/2011 | CN202053388U 单晶硅棒切方装置 Silicon rods squaring device |
| 11/30/2011 | CN102264659A 脆性材料基板的割断方法、装置及车辆用窗玻璃 Brittle material substrate division method, apparatus and vehicle window glass |
| 11/30/2011 | CN102264516A 划线装置及划线方法 Apparatus and method for scribing crossed |
| 11/30/2011 | CN102259391A 钎焊金刚石锯片 Brazed diamond saw blade |
| 11/30/2011 | CN101819927B 一种微纳结构硅材料的制备系统与制备方法 Preparation System and method for preparing micro- and nanostructures of silicon material |
| 11/30/2011 | CN101474830B 太阳能级6寸单晶硅片切割工艺方法 6-inch solar-grade silicon chip cutting process method |
| 11/30/2011 | CN101226892B 测量装置及激光加工机 Measuring devices and laser processing machine |
| 11/23/2011 | EP2388809A1 Wafer separating apparatus, wafer separating/transferring apparatus, wafer separating method, wafer separating/transferring method and solar cell wafer separating/transferring method |
| 11/23/2011 | EP1692719B1 Methods for preparing semiconductor substrates and dicing the same |
| 11/23/2011 | CN202045770U Mortar filtering apparatus for producing solar energy silicon chips |
| 11/23/2011 | CN202045769U Multi-thread cutting machine de-winding device |
| 11/23/2011 | CN202045768U Cutting line tension control device |
| 11/23/2011 | CN202045767U Multi-wire cutting machine |
| 11/23/2011 | CN202045766U Multi-wire cutting machine |
| 11/23/2011 | CN202045513U Electrode machining fixture structure |
| 11/23/2011 | CN102254863A Breaking apparatus and breaking method for substrate made of brittle materials |
| 11/23/2011 | CN102248613A Wheel retaining tool, a manufacturing method thereof and knife flywheel retaining mechanism using wheel retaining tool |
| 11/23/2011 | CN102248612A Ultrathin monocrystalline silicon wafer and linear cutting device and cutting method for making same |
| 11/23/2011 | CN102248611A Crystalline silicon core cutting device |
| 11/23/2011 | CN102248610A Zirconium-based amorphous alloy modified cutting steel wire |
| 11/23/2011 | CN102248609A Self-centering synchronously clamped silicon rod butting machine |
| 11/23/2011 | CN102248608A Plate object dividing device |
| 11/23/2011 | CN102248607A Sapphire wafer dividing method |
| 11/23/2011 | CN102248606A Processing method for cutting sapphire wafer surface by ultraviolet lasers |
| 11/17/2011 | WO2011142464A1 Cutting method and cutting device |
| 11/17/2011 | WO2011141543A1 Wire sawing device for producing wafers |