| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/14/2012 | CN102371629A Tip holder for hand cutter |
| 03/14/2012 | CN102371628A Holder fitting unit |
| 03/14/2012 | CN102371627A Tip holder for hand cutter, and hand cutter having the tip holder |
| 03/08/2012 | WO2011145856A3 Wire tool |
| 03/07/2012 | CN202155964U 晶体硅芯切割装置 Crystalline silicon core cutting device |
| 03/07/2012 | CN202155963U 用于切割晶体硅棒的金刚线切片机 Crystal silicon rod for cutting diamond wire slicer |
| 03/07/2012 | CN202155962U 一种太阳能电池片自动吸附机构 A solar cell sheet automatic adsorption mechanism |
| 03/07/2012 | CN202155961U 一种双片独立式的导线轮 A two-piece freestanding wire wheels |
| 03/01/2012 | WO2012026437A1 Silicon wafer processing solution and silicon wafer processing method |
| 03/01/2012 | US20120048906 Substrate cutting device and method |
| 03/01/2012 | US20120048255 Wire saw |
| 03/01/2012 | US20120047950 Single crystal diamond gemstones and methods therefor |
| 02/29/2012 | EP2422916A1 Laser machining method |
| 02/29/2012 | CN202153245U 一种金刚线断线检测装置 One kind of diamond wire break detection device |
| 02/29/2012 | CN202151885U 单晶/多晶硅片多线切割自动脱胶装置 Mono / polycrystalline silicon sheet multi-wire cutting device automatically unglued |
| 02/29/2012 | CN102363330A Cutting method for ultra-thin silicon chips |
| 02/29/2012 | CN102363329A Evolution cutting deviation preventing tool for polycrystalline silicon ingot and using method thereof |
| 02/29/2012 | CN102363328A A silicon wafer cutting device |
| 02/29/2012 | CN102363327A Cutting machine for cutting silicon chips |
| 02/29/2012 | CN102363326A Silicon chip cutting machine |
| 02/29/2012 | CN102363325A Support plate for silicon chip cutting machine |
| 02/22/2012 | CN202147323U 改善多线切割硅片入刀口处厚薄不均匀的装置 Improve multi-line cutting wafers into uneven thickness incision device |
| 02/22/2012 | CN202147321U 减少断线率的多晶硅棒的切割工装 Reduce the polysilicon rod breakage rate cut tooling |
| 02/22/2012 | CN202147320U 一种高速石英晶体开条装置 A high speed quartz open bar means |
| 02/22/2012 | CN102357930A Photovoltaic silicon material diamond band saw blade and processing method thereof |
| 02/22/2012 | CN101318359B 切削装置 Cutting device |
| 02/22/2012 | CN101244613B 保护晶片正面结构及进行晶片切割的方法 The wafer front side protection structure and method of cutting the wafer |
| 02/16/2012 | WO2012020947A2 Wire tool |
| 02/15/2012 | EP2418180A1 Glass plate scribing method and scribing device |
| 02/15/2012 | CN102350743A Silicon ingot processing method for slicing |
| 02/15/2012 | CN102350742A Four-roller direct-driving type diamond wire numerical control slicer |
| 02/15/2012 | CN102350741A Silicon block cutting method |
| 02/15/2012 | CN101969038B 支承一组集成电路单元的支承装置 Supporting means for supporting a set of integrated circuit units |
| 02/15/2012 | CN101659089B 一种多线切割机导轮开槽方法 A multi-wire cutting guide wheel slotting method |
| 02/15/2012 | CN101623898B 一种线切割工艺中砂浆的化学回收方法 A wire cutting process mortar chemical recovery process |
| 02/15/2012 | CN101296787B 脆性材料基板的划线形成方法及划线形成装置 Means forming a brittle material substrate scribing method for forming a scribe line, and |
| 02/14/2012 | US8113401 Apparatus for cutting liquid crystal display panel |
| 02/09/2012 | WO2012017988A1 Method for cutting glass film |
| 02/09/2012 | WO2012017947A1 Aqueous processing solution for fixed abresive grain wire saw |
| 02/09/2012 | DE102004044946B4 Verfahren zum Trennen eines Halbleiterwafers A method for separating a semiconductor wafer |
| 02/08/2012 | EP2415070A2 Self-cleaning wiresaw apparatus and method |
| 02/08/2012 | EP2414132A1 Component having an overlapping laser track; method for producing such a component |
| 02/08/2012 | CN202137860U 一种往复式线锯切割硬脆材料的自适应系统 A reciprocating wire saw cutting hard and brittle materials adaptive system |
| 02/08/2012 | CN202137859U 金刚石线锯 Diamond Wire Saw |
| 02/08/2012 | CN202137858U 金属复合线 Metal composite wire |
| 02/08/2012 | CN102347276A Cutting method |
| 02/08/2012 | CN102344776A Cutting fluid for cutting of scroll saw |
| 02/08/2012 | CN102343634A Overheat protecting device and method of motorized spindle and cutter |
| 02/08/2012 | CN102343633A Slicing device |
| 02/08/2012 | CN102343632A Line breakage detection method for multi-line cutting of silicon wafers |
| 02/08/2012 | CN102343631A Brittle material chamfering method and device thereof |
| 02/08/2012 | CN102343630A Cutting wheel, cutting device and cutting method |
| 02/08/2012 | CN101489746B 切割装置 Cutting device |
| 02/08/2012 | CN101011846B 切削装置 Cutting device |
| 02/07/2012 | US8111480 Electronic component and tape head having a closure |
| 02/02/2012 | US20120024761 Methods to slice a silicon ingot |
| 02/01/2012 | EP2106331B1 Method for dividing of monocrystalline layers, disks or wafers |
| 02/01/2012 | CN202129878U 金属复合线以及金属线材 Metal composite wire and metal wire |
| 02/01/2012 | CN102335970A Control device of quality of slice mortar |
| 02/01/2012 | CN102335969A Slicing equipment capable of effectively controlling slicing quality |
| 02/01/2012 | CN102335968A L-shaped clamp for multi-wire cutting machine |
| 02/01/2012 | CN102335967A Home roll for multiwire cutting machine |
| 02/01/2012 | CN102335966A Method for splicing and butting solar silicon rods |
| 02/01/2012 | CN101412154B 激光加工方法 The laser processing method |
| 01/26/2012 | WO2012011446A1 Laser processing method |
| 01/26/2012 | WO2012011445A1 Glass film cutting method, glass roll production method, and glass film cutting device |
| 01/26/2012 | WO2011151022A8 Wire saw having wire-break monitoring |
| 01/26/2012 | DE102005004845B4 Wafer-Unterteilungsverfahren Wafer dividing method |
| 01/25/2012 | CN202123583U Self-centering synchronous clamping silicon rod dicer |
| 01/25/2012 | CN202123580U Crystal brick positioning device used for crystal brick head-tail cutting machine |
| 01/25/2012 | CN202123579U Steel wire leading-in end device of multi-wire cutting machine |
| 01/25/2012 | CN202123578U Flywheel knife device for cutting wafer or LED (light emitting diode) |
| 01/25/2012 | CN102329075A 分断装置 Breaking device |
| 01/25/2012 | CN102328358A Clamping device for silicon wafers |
| 01/25/2012 | CN102328357A Movable adjustable silk guide roller spindle device of numerical control multi-line silicon chip cutting machine |
| 01/25/2012 | CN102328356A Main roller for silicon wafer cutting |
| 01/25/2012 | CN102328355A Silicon chip collector |
| 01/25/2012 | CN102328354A Guide wheel for silicon wafer cutting |
| 01/25/2012 | CN102328353A Cutting process of silicon single crystal rods |
| 01/25/2012 | CN102328352A Cutting line for silicon wafer cutting |
| 01/25/2012 | CN102328351A Cutting line for silicon wafer cutting |
| 01/25/2012 | CN102328350A Main roller for cutting silicon chip |
| 01/25/2012 | CN102328349A Endless chipping belt |
| 01/24/2012 | US8101436 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
| 01/19/2012 | WO2012007956A1 Laser fire protection system (lfps) |
| 01/19/2012 | WO2012007381A1 Carrier for a silicon block, carrier arrangement having such a carrier and process for producing such a carrier arrangement |
| 01/19/2012 | WO2012007275A1 Sawing apparatus and process for producing a scintillator structured into scintillator elements and scintillator having scintillator elements |
| 01/19/2012 | US20120015799 Method for producing sapphire single crystal, and sapphire single crystal obtained by the method |
| 01/18/2012 | CN202120926U Linear cutting apparatus for making ultrathin monocrystalline silicon piece |
| 01/18/2012 | CN202119587U Hydraulic pressure alarm device and water-cooled silicon chip slicer comprising same |
| 01/18/2012 | CN202116618U Polysilicon cutting stainless steel wire annealing furnace |
| 01/18/2012 | CN202114825U Monocrystalline silicon rod cross-cutting machine tool |
| 01/18/2012 | CN202114824U Fixing device for assisting multi-line cutter to cut monocrystalline silicon sticks |
| 01/18/2012 | CN102326232A Semiconductor element manufacturing method |
| 01/18/2012 | CN102325621A Slotting tool, and thin film solar cell slotting method and scribing device using same |
| 01/18/2012 | CN102320728A Tip holder |
| 01/18/2012 | CN101855045B Method for cutting work by wire saw and wire saw |
| 01/18/2012 | CN101013680B Dicing method and dicing device |
| 01/12/2012 | WO2012004052A1 Carrier device and method for cutting a material block fixed to the carrier device |
| 01/12/2012 | US20120006312 Self-cleaning wiresaw apparatus and method |