Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
04/2012
04/25/2012CN1863740B 划线头和使用该划线头的划线装置以及划线方法 Scribing head and using the scribing head scribing apparatus and method for scribing
04/25/2012CN101863087B 多线切割机的砂浆箱 MWS mortar box
04/25/2012CN101570040B 应用于LED激光切割设备的XY-θ运动平台 Applied to the LED laser cutting equipment XY-θ motion platform
04/25/2012CN101357491B 切削装置 Cutting device
04/25/2012CN101234515B 一种仿真人造钻石的切割方法 An artificial diamond cutting method simulation
04/25/2012CN101213058B 用于减小硅晶片之间吸引力的方法和试剂 For reducing the attraction between the silicon wafers methods and reagents
04/25/2012CN101071791B 晶片的分割方法及分割装置 Segmentation of the wafer and dividing means
04/19/2012WO2012050307A2 Apparatus and method for sawing single crystal ingot
04/19/2012WO2011145858A3 Wire tool
04/18/2012CN202192696U 切片设备用的砂浆喷嘴固定装置 Slicing equipment mortar nozzle retainer means
04/18/2012CN202192694U 一种多线切割机及其砂浆回流漏斗 A multi-wire cutting and mortar reflux funnel
04/18/2012CN202192693U 一种钼丝切割机 One kind of molybdenum wire cutting machine
04/18/2012CN202192692U 硅芯切割机工件固定装置 Silicon core cutting machine a workpiece fixtures
04/18/2012CN202192691U 一种粘固硅棒的载体 One kind of cement carriers silicon rods
04/18/2012CN102421714A Methods for cutting a fragile material
04/18/2012CN102416674A 附树脂脆性材料基板的分割方法 Segmentation attached resin brittle material substrate
04/18/2012CN101745993B 形成风车形划片槽结构的方法 Forming a windmill-shaped groove structure scribe method
04/18/2012CN101351870B Laser beam machining method and semiconductor chip
04/17/2012CA2632387C Apparatus and method for cleaning a sawn wafer block
04/12/2012WO2012047114A1 A method for production of photovoltaic wafers and abrasive slurry
04/12/2012WO2012046439A1 Plate glass scoring and cutting device
04/12/2012WO2012045686A1 Method and device for producing disk-shaped elements, in particular wafers
04/12/2012WO2012020947A3 Wire tool
04/12/2012US20120085333 Apparatus and method for sawing single crystal ingot
04/12/2012US20120085332 Methods for cropping a cylindrical ingot
04/11/2012CN202185992U 多线切割机的l型夹具 MWS of l-type fixtures
04/11/2012CN202185991U 用于切片时固定晶棒的改造后玻璃板 After the transformation fixed for slicing the ingot glass
04/11/2012CN202185990U 单晶硅的切割装置 Cutting means monocrystalline silicon
04/11/2012CN202185989U 一种双工位多线硅片切割机 A duplexer bit multi-line wafer cutting machine
04/11/2012CN202185988U 一种单晶硅的切料装置 Monocrystalline silicon material cutting apparatus
04/11/2012CN202185987U 用于切削硬脆材料晶柱的带锯切削设备 For cutting hard and brittle materials boules band saw cutting equipment
04/11/2012CN202185986U 水晶烫钻模具 Crystal hot drilling mold
04/11/2012CN202185985U 一种水钻模 One kind of diamond mold
04/11/2012CN102413981A 线锯 Wire saw
04/11/2012CN101740352B Dicing die-bonding film and process for producing semiconductor device
04/11/2012CN101370628B 用于表现分离力的方法 A method for the performance of the separating force
04/05/2012WO2012043951A1 Sawing apparatus of single crystal ingot
04/04/2012EP2435228A1 Method and machine for producing a semiconductor, of the photovoltaic cell type, or a similar electronic component
04/04/2012EP2435227A1 Device and method for stacking or transporting a plurality of flat substrates
04/04/2012EP1365930B1 Method and device for mounting and preparing a gemstone or industrial diamond for the formation of a mark on the surface thereof
04/04/2012EP1338371B1 Laser beam machining method
04/04/2012CN102398318A 蓝宝石硅棒的切割方法 Sapphire Ingot cutting methods
04/04/2012CN102398317A 用于切割晶体硅棒的金刚线切片机 Crystal silicon rod for cutting diamond wire slicer
04/04/2012CN102398316A 应用于切片机的防跳线方法 Anti-jumper method applied slicer
04/04/2012CN102398315A 应用于切片机的切割方法 Microtome cutting method is applied
04/04/2012CN102398314A 金刚线切片机 Diamond wire slicer
04/04/2012CN102398313A 光器件晶片的加工方法 Optical device wafer processing method
04/04/2012CN101930909B 生产半导体晶片的方法 Method for producing a semiconductor wafer
04/04/2012CN101752217B 半导体装置制造用薄膜及其制造方法 A semiconductor device and its manufacturing method for manufacturing a thin film
04/04/2012CN101607423B 一种硅锭切割线锯 A silicone ingot cutting wire saw
04/04/2012CN101218078B 脆性材料用划线轮、划线方法、划线装置及划线工具 Brittle materials scribing wheel, crossed method, scribing device and scribing tools
03/2012
03/28/2012EP2432620A1 Carrier for a silicon block and method for producing such a carrier and arrangement
03/28/2012EP2432616A2 Method for separating a sheet of brittle material
03/28/2012CN202176610U 切方机可拆卸主轴 Removable squaring machine spindle
03/28/2012CN202174661U 微机控制晶体线切割机自流式加油装置 Computer-controlled crystal Cutting Gravity refueling device
03/28/2012CN202174660U 多线切割机的主辊 MWS's main roll
03/28/2012CN202174659U 多线切割机的硅棒工件 MWS silicon rods artifacts
03/28/2012CN202174658U 一种用于硅锭切割的带锯片 Band saw blades for cutting silicon ingots
03/28/2012CN202174657U 水冲重压工具 Flush the weight of the tool
03/28/2012CN202174656U 机门可收集砂浆的硅片切割机 The door can be collected mortar wafer cutting machine
03/28/2012CN1978167B System and method for scribing sapphire substrates with a solid state uv laser
03/28/2012CN1758986B Laser beam machining method
03/28/2012CN102390094A Solar-grade silicon wafer being cut by diamond wire and cutting method thereof
03/28/2012CN102390089A Natural stone multi-line full-hydraulic cutting machine tool
03/28/2012CN102057314B Substrate processing system
03/28/2012CN101663246B Scribing device and scribing method
03/28/2012CN101146642B Laser machining method
03/28/2012CN101110392B Laser processing method
03/22/2012US20120070605 Silicon carbide ingot, silicon carbide substrate, manufacturing method thereof, crucible, and semiconductor substrate
03/21/2012EP2429961A2 Methods for cutting a fragile material
03/21/2012EP1588793B1 Laser processing devices
03/21/2012CN202169655U 微机控制晶体线切割机钢丝线轮 Computer-controlled crystal Cutting steel wire wheels
03/21/2012CN202169654U 一种钢线卷绕控制装置 Type of steel wire winding control device
03/21/2012CN1758993B Substrate dividing apparatus and method for dividing substrate
03/21/2012CN102388121A Methods to recover and purify silicon particles from saw kerf
03/21/2012CN102387999A Glass plate scribing method and scribing device
03/21/2012CN102380915A Metal wire for cutting and capable for twisting shapes, and manufacturing device and manufacturing method thereof
03/21/2012CN102380914A Silicon block cutting method and silicon block cutting device
03/21/2012CN101834270B Production method of langasite crystal element
03/21/2012CN101585657B Substrate dividing apparatus and method for dividing substrate
03/21/2012CN101585656B Substrate dividing apparatus and method for dividing substrate
03/21/2012CN101508151B Polysilicon rod thermodynamics breaking technique and device
03/21/2012CN101232982B Device and method for cutting off substrate of fragile material
03/15/2012WO2012031942A1 Method for producing piezoelectric actuators from a material block
03/15/2012WO2012031900A1 Method and transfer appliance for loading and unloading a wire saw cutting machine
03/15/2012WO2012031828A1 Method for sawing a workpiece
03/15/2012US20120060815 Method For Shaping And Slicing Ingots Using An Aqueous Phosphate Solution
03/15/2012US20120060557 Cut Product, in Particular Diamond, with Improved Characteristics and Method for Manufacturing Such a Product
03/15/2012DE102010040535A1 Verfahren zum Sägen eines Werkstücks Method for cutting a workpiece
03/14/2012EP2428987A1 Device and method for separating and transporting substrates
03/14/2012EP2427295A1 Wire saw
03/14/2012EP1620238B1 Method for cleaning sic particles
03/14/2012CN202167499U 利用率高的太阳能硅片 High utilization of solar wafers
03/14/2012CN202162899U 一种用于硬脆材料切割的连续线材 A continuous wire for cutting hard and brittle materials
03/14/2012CN202162898U 用于切割晶体硅棒的金刚线切片机 Crystal silicon rod for cutting diamond wire slicer
03/14/2012CN102376643A Cutting method
03/14/2012CN102371633A Bar sticking device of sapphire slices
03/14/2012CN102371632A Polysilicon slicing method
03/14/2012CN102371631A Pad strip for cutting solar silicon wafer
03/14/2012CN102371630A Orientation method of large-size sapphire crystal
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