Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
06/2012
06/20/2012CN101462312B Method for processing diamond
06/20/2012CN101444934B Multi-wire sawing reciprocating cutting method and device thereof
06/14/2012WO2012076139A1 Method for cutting and/or comminuting silicon blocks, silicon disks, or silicon rods
06/13/2012EP1906438B1 Method for cutting workpiece
06/13/2012CN202271455U 一种高速切割用金刚石线锯 A high speed cutting with a diamond wire saw
06/13/2012CN202271454U 一种数控高速金刚石带锯床 A digital variable-speed diamond with Saw
06/13/2012CN202271453U 一种led蓝宝石数控切割机 One kind of led sapphire CNC cutting machine
06/13/2012CN202271452U 一种线锯恒力切割硬脆材料装置 A wire saw cutting hard and brittle materials Constant device
06/13/2012CN202271451U 一种钢线切割机 Type of steel cutting machine
06/13/2012CN202271450U 取料钻床及其取料钻头 Reclaimer drill bit and reclaimer
06/13/2012CN1678439B Pasted base board cutting system and base board cutting method
06/13/2012CN102496602A Chip cutting method
06/13/2012CN102492367A Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion
06/13/2012CN102490280A Method for applying diamond wire to mortar square cutting device
06/13/2012CN102490279A X-ray diffraction oriented cutting method for wire cutting crystal
06/13/2012CN102490278A Directional cutting method of crystal linear cutting laser instrument
06/13/2012CN102490277A Graphic directional cutting method for wire cutting crystal
06/07/2012WO2012073428A1 Ingot cutting method
06/07/2012WO2012050307A3 Apparatus and method for sawing single crystal ingot
06/07/2012US20120141808 2-dimensional line-defects controlled silicon ingot, wafer and epitaxial wafer, and manufacturing process and apparatus therefor
06/06/2012EP2460634A1 Method for cutting object to be processed
06/06/2012EP2460633A1 Method for cutting processing target
06/06/2012CN102487045A Production method of semiconductor device
06/06/2012CN102486989A Method and loading plate for degumming cleaning silicon wafer
05/2012
05/31/2012US20120132188 Holding/cleaning device and method for the zonal cleaning of sawed wafers
05/30/2012EP2458626A1 Retaining cleaning device and method for batch cleaning sawn wafers
05/30/2012EP2456601A1 Device for cleaning substrates on a carrier
05/30/2012CN202241661U Linear cutting clamp
05/30/2012CN202241660U Fixture for cutting silicon wafer
05/30/2012CN202241659U Clamping device for cutting crystal rod
05/30/2012CN202241657U On-line rapid mortar recycling device used in mortar cutting
05/30/2012CN202241652U Spool for winding cut steel wires
05/30/2012CN202241649U Multi-linear cutting workpiece connection plate structure
05/30/2012CN202241646U Filler strip for cutting solar silicon chip
05/30/2012CN202241645U Improved silicon rod cutting device
05/30/2012CN202241644U Microprocessor control crystal line cutting machine
05/30/2012CN202241643U Novel photovoltaic silicon material diamond bandsaw blade
05/30/2012CN202241642U Vacuum crystal bar cutting machine
05/30/2012CN202241641U Mortar cylinder with filtering hopper
05/30/2012CN202241640U Wire saw and wire saw roll with adhesive
05/30/2012CN202241639U Multi-hole drill suitable for processing silicon material
05/30/2012CN202241638U Bar material for cutting SC (Scandium) quartz wafer
05/30/2012CN202241637U Bar material for cutting AT45-DEG optical chip
05/30/2012CN202241636U Splicing and fixing device
05/30/2012CN102482613A 硅锭切片用水溶性切削液 Silicon ingot slicing with a water-soluble cutting fluid
05/30/2012CN102479675A 单晶片加工方法及单晶片 Single wafer processing method and single chip
05/30/2012CN102476405A Method for improving precise processing precision through particle beams
05/30/2012CN102476403A Method for precisely cutting single crystal silicon by optical fiber laser
05/30/2012CN101934558B Silicon rod slicing method
05/30/2012CN101687306B Multi-wire saw and method of cutting ingot
05/30/2012CN101664970B Monocrystal silicon-rod butting technique
05/30/2012CN101605642B Endless chipping belt
05/30/2012CN101596723B Substrate-cutting method
05/30/2012CN101337400B Cutter
05/30/2012CN101279453B Producing technique of slicing bamboo single board surface container floor
05/24/2012DE10327360B4 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
05/23/2012EP1475357B1 Fragile material substrate parting system
05/23/2012CN202225313U Rotating ultrasonic transducer for cutting nonmetallic multifilaments
05/23/2012CN202225312U Silicon material cutting machine
05/23/2012CN202225311U Special mechanical hand for processing, loading and unloading crystal bars
05/23/2012CN102470551A Method for cutting processing target
05/23/2012CN102470550A Method for cutting object to be processed
05/23/2012CN102470549A 脆性材料基板的切割方法、切割装置以及通过该切割方法获得的车辆用窗玻璃 A brittle material substrate cutting method, the cutting device and a vehicle obtained by the cutting method using the window glass
05/23/2012CN102470501A Method for preparing a suspension
05/23/2012CN102470484A 激光加工装置及激光加工方法 The laser processing method and laser processing apparatus
05/23/2012CN102468382A 一种GaAs衬底AlGaInP发光二极管的制备方法 A substrate AlGaInP light emitting diodes prepared GaAs
05/23/2012CN101740351B Dicing die-bonding film and process for producing semiconductor device
05/23/2012CN101388326B Method of manufacturing device
05/22/2012US8183131 Method of cutting an object to be processed
05/16/2012EP2451884A1 Suspension of abrasive grains
05/16/2012EP2451611A1 Gemstone alignment
05/16/2012EP2451610A1 Method for preparing a suspension
05/16/2012CN102458754A 分离脆性材料板的方法 Brittle material plate separation method
05/16/2012CN102452133A High-precision machine tool
05/09/2012EP2450169A1 Cutting method and cutting device for brittle material substrate, and vehicle window glass obtained by the cutting method
05/09/2012EP1742253B1 Laser processing method
05/09/2012CN202213071U Quartz gluing table
05/09/2012CN202213067U Multi-wire wafer cutting tooling
05/09/2012CN202213066U Special clamp for single crystal silicon rod rolling milling and hole digging
05/09/2012CN102448659A Component having an overlapping laser track
05/09/2012CN102442770A Laser dividing apparatus
05/09/2012CN102441946A Line-breaking repairing system in line cutting
05/09/2012CN102441945A Gluing equipment used in process of slicing single crystal silicon
05/09/2012CN102441944A Squaring method of polycrystalline ingot
05/09/2012CN101516566B Laser processing method and laser processing apparatus
05/09/2012CN101502983B Silicon chip cutter
05/09/2012CN101005021B Manufacturing method of semiconductor device
05/03/2012WO2012056513A1 Polishing pad and method for producing same
05/03/2012WO2012056512A1 Polishing pad and method for producing same
05/03/2012WO2012055052A1 Device for clamping a fixture attachment to a wire saw cutting machine
05/03/2012US20120103016 Custom stones and methods for producing custom stones for jewelry
05/02/2012CN202208068U Main wheel structure of wire cutting device and wire cutting device
05/02/2012CN202208067U Cutting wire in composite structure and manufacturing equipment thereof
05/02/2012CN202208066U Silicon carbide mortar immersion type multi-wire cast ingot cutting machine
05/02/2012CN102438791A Carrier for a silicon block and method for producing such a carrier and arrangement
05/02/2012CN102432997A Squarer roller and using method thereof
05/02/2012CN102431099A Cutting device
04/2012
04/25/2012CN202200410U 一种新型硅片切割浆料搅拌装置 A new wafer cutting slurry mixing device
04/25/2012CN202200409U 切割区线张力控制、碳化硅砂浆浸泡钢线式多线铸锭切割机 Cutting zone wire tension control, silicon carbide mortar soaking ingot steel wire multi-wire cutting machine
04/25/2012CN202200408U 电路及包含该电路的水冷式硅片切片机 Circuit and the circuit containing water-cooled silicon wafer slicing machine
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