H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2011
11/16/2011	EP2387071A2 Carrier body for components or circuits
11/16/2011	EP2387069A2 Carrier body for components or circuits
11/16/2011	EP2387068A2 Carrier body for components or circuits
11/16/2011	EP2387067A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition
11/16/2011	EP2386122A2 Multi-junction pv module
11/16/2011	EP2226841A9 Interposer and manufacturing method of the interposer
11/16/2011	CN202043208U Camera module
11/16/2011	CN202043071U Power module
11/16/2011	CN202042523U Copper particles and crystal particles combined prewelding plate for manufacturing diode
11/16/2011	CN202042483U Package structure of power semiconductor device
11/16/2011	CN202042482U High-voltage large power driver module
11/16/2011	CN202042481U Power module
11/16/2011	CN1531093B Microminiature power converter with multiple output
11/16/2011	CN102246615A Power converter module having a cooled busbar
11/16/2011	CN102246322A Method for producing a photovoltaic module and photovoltaic module
11/16/2011	CN102246299A Method for making via interconnection
11/16/2011	CN102244189A LED encapsulated by ceramic substrate in integrated mode
11/16/2011	CN102244186A High-power LED (light emitting diode) light emitting device package structure
11/16/2011	CN102244178A Encapsulation structure of LED (light emitting diode)
11/16/2011	CN102244155A Method for integrally packaging LED (light-emitting diode) light source curved surface
11/16/2011	CN102244075A Method of increasing light emergent effect in LED (Light-emitting diode) luminous lamp panel matrix type package
11/16/2011	CN102244074A Package structure of LED (light emitting diode) light source module of convex cup structure
11/16/2011	CN102244073A Light emitting device array
11/16/2011	CN102244072A Light emitting device module
11/16/2011	CN102244071A Light-emitting device, light-emitting array unit, print head, image forming apparatus and light-emission control method
11/16/2011	CN102244066A Power semiconductor module
11/16/2011	CN102244053A Semiconductor light emitting device and power semiconductor device
11/16/2011	CN102244040A Double-substrate type storage card capsulation method and construction thereof
11/16/2011	CN101834177B SOC (System On a Chip) chip device
11/16/2011	CN101663925B 电子电路装置 Electronic circuit means
11/16/2011	CN101657911B Light emitting diode for harsh environments
11/16/2011	CN101621056B Multi-chip module for power supply circuit and voltage regulator using same
11/16/2011	CN101471361B Image sensor and method for manufacturing the sensor
11/16/2011	CN101465300B LED optical strip and method of manufacturing the same
11/16/2011	CN101409266B Package structure
11/16/2011	CN101356584B Volatile memory elements with elevated power supply levels for programmable logic device integrated circuits
11/16/2011	CN101252109B Optoelectronic module provided with at least one photoreceptor cell
11/16/2011	CN101128942B Led阵列 Led Array
11/16/2011	CN101127349B Plastic overmolded packages with mechanically decoupled lid attach attachment
11/15/2011	US8058897 Configuration of a multi-die integrated circuit
11/15/2011	US8058146 Peeling method
11/15/2011	US8058104 Reversible leadless package and methods of making and using same
11/10/2011	WO2011140438A2 High performance cable connector
11/10/2011	WO2011138707A1 Light source
11/10/2011	WO2011137733A2 Power supply module and packaging and integrating method thereof
11/10/2011	WO2011137676A1 Wireless communication module product
11/10/2011	US20110275176 Method of Assembly and Assembly Thus Made
11/10/2011	US20110273228 Multiple e-probe waveguide power combiner/divider
11/10/2011	US20110273154 Semiconductor Device
11/10/2011	US20110272776 Standard cell, semiconductor device having standard cells, and method for laying out and wiring the standard cell
11/10/2011	US20110271757 Wiring substrate, piezoelectric oscillator, gyrosensor and manufacturing method of wiring substrate
11/09/2011	CN202034980U Super-long infrared receiver module
11/09/2011	CN202034888U Power supply module of integrated inductor
11/09/2011	CN202034391U Large-scale amorphous silicon solar battery component
11/09/2011	CN202034371U Luminescent pipe with ellipsoidal-surface lens
11/09/2011	CN202034370U Minitype LED lattice module
11/09/2011	CN202034369U Packaging structure preventing light-emitting diode (LED) chip from being damaged
11/09/2011	CN102237484A Lead frame for light emitting device package, light emitting device package, and illumination apparatus
11/09/2011	CN102237482A High heat radiation LED (Light Emitting Diode) nonmetal substrate and high heat radiation LED element as well as making method thereof
11/09/2011	CN102237478A Method of mounting devices in substrate and device-mounting substrate structure thereof and electronic device
11/09/2011	CN102237476A Alternating current type light emitting element
11/09/2011	CN102237461A Light emitting device, light emitting device package and lighting system
11/09/2011	CN102237460A Light emitting diode
11/09/2011	CN102237394A Size variable type semiconductor chip and semiconductor package using the same
11/09/2011	CN102237354A Circuit board
11/09/2011	CN102237353A LED (light emitting diode) packaging structure and manufacturing method thereof
11/09/2011	CN102237352A Light-emitting diode module and light-emitting diode lamp
11/09/2011	CN102237351A Light emitting device package, light source module, backlight unit, and illumination apparatus
11/09/2011	CN102237350A Luminaire and light-emitting apparatus with light-emitting devices
11/09/2011	CN102237349A Light emitting devices
11/09/2011	CN102237348A LED microarray packaging structure and manufacturing method thereof
11/09/2011	CN102237347A Power block and power semiconductor module using same
11/09/2011	CN102237346A Rectification module having good temperature characteristic
11/09/2011	CN102237345A Semiconductor apparatus
11/09/2011	CN102237344A Press-pack module with power overlay interconnection
11/09/2011	CN102237343A Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package
11/09/2011	CN102237342A Wireless communication module product
11/09/2011	CN102237320A Electronic component packaging structure and manufacturing method thereof
11/09/2011	CN102237301A Semiconductor device and manufacture method for the same
11/09/2011	CN101656246B Chip-stacked package structure of substrate with opening and packaging method thereof
11/09/2011	CN101562175B Image sensor encapsulating structure and imaging device applied thereof
11/09/2011	CN101369575B Sheet type diode and preparation method thereof
11/09/2011	CN101188230B Package structure and its making method
11/08/2011	US8053716 Method and apparatus for determining the time and location of light flashes
11/08/2011	US8053661 Photoelectric conversion element and imaging device
11/08/2011	US8053278 Multi-chip package type semiconductor device
11/03/2011	WO2011136222A1 Power module and method for manufacturing power module
11/03/2011	US20110269272 Microelectronic packages and methods therefor
11/03/2011	US20110267094 Circuit and method for detecting a fault attack
11/03/2011	US20110266664 Integrated circuit packaging system with package-on-package and method of manufacture thereof
11/03/2011	US20110266441 Pixel-level optically transitioning filter elements for detector devices
11/03/2011	DE102010028407A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines Optoelektronischen Bauelements Optoelectronic component and method of manufacturing an optoelectronic component
11/03/2011	DE102010018997A1 Ansteuerschaltung mit Übertragungsschaltung zur kapazitiven Übertragung eines Signals und zugeordnetes Verfahren Drive circuit with transmission circuit for capacitive transmission of a signal and associated method
11/02/2011	EP2384088A2 Light emitting device for AC power operation
11/02/2011	EP2383780A1 Light emitting devices
11/02/2011	EP2382662A2 A circuit for detecting tier-to-tier couplings in stacked integrated circuit devices
11/02/2011	EP2382661A2 Integrated electronic device with transceiving antenna and magnetic interconnection
11/02/2011	EP1909329B1 Semiconductor device
11/02/2011	EP1627428B1 An integrated circuit package employing a head-spreader member
11/02/2011	CN202025799U Integrated white light LED capsulation applicable to visible light communication

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