| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/18/2012 | CN102324425A Novel integrated light-emitting diode (LED) package structure |
| 01/18/2012 | CN102324424A White-light LED (Light Emitting Diode) packaged by fluorescent transparent ceramic lens |
| 01/18/2012 | CN102324423A Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
| 01/18/2012 | CN102324422A Light-emitting diode module and display employing the light-emitting diode module |
| 01/18/2012 | CN102324416A Integrated shielding film and semiconductor packaging member of antenna |
| 01/18/2012 | CN101819963B Semiconductor photoelectric element and square flat pin-free photoelectric element |
| 01/18/2012 | CN101789416B Semiconductor package body structure with guard bars |
| 01/18/2012 | CN101553923B Edge connect wafer level stacking and manufacturing method thereof |
| 01/18/2012 | CN101281894B Semiconductor component bearing structure and splicing structure |
| 01/18/2012 | CN101232009B Mounting structures for integrated circuit modules |
| 01/17/2012 | USRE43112 Stackable ball grid array package |
| 01/17/2012 | US8098309 Solid-state imaging apparatus and camera using the same |
| 01/17/2012 | US8098082 Multiple data rate interface architecture |
| 01/17/2012 | US8098081 Optimization of interconnection networks |
| 01/17/2012 | US8098080 Semiconductor programmable device |
| 01/17/2012 | US8097954 Adhesive layer forming a capacitor dielectric between semiconductor chips |
| 01/17/2012 | US8097889 Light emitting device having light emitting elements with a shared electrode |
| 01/17/2012 | US8096691 Optical irradiation device |
| 01/12/2012 | WO2012005079A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 01/12/2012 | WO2012004049A1 Light-emitting diode |
| 01/12/2012 | WO2012003705A1 Three dimensional integrated circuit structure and method for detecting chip structure alignment |
| 01/12/2012 | WO2012003700A1 Manufacturing method of led integrated structure |
| 01/12/2012 | US20120007227 High density chip stacked package, package-on-package and method of fabricating the same |
| 01/12/2012 | US20120006469 Printed circuit board and method of manufacturing printed circuit board |
| 01/12/2012 | DE102010043446B3 Leistungshalbleitersystem Power semiconductor system |
| 01/12/2012 | DE102010026344A1 Leuchtdiode Light-emitting diode |
| 01/12/2012 | DE102006039975B4 Niederinduktives Leistungshalbleitermodul für stromeingeprägte Leistungsschaltungen Niederinduktives power semiconductor module for power-embossed power circuits |
| 01/11/2012 | EP2405490A1 Light-emitting apparatus, light-emitting apparatus unit, and light-emitting apparatus production method |
| 01/11/2012 | EP2405479A1 Antifuse device |
| 01/11/2012 | EP2405182A2 Light emitting device |
| 01/11/2012 | EP1088470B1 Ic stack utilizing flexible circuits with bga contacts |
| 01/11/2012 | CN202111153U Light-emitting diode (LED) light source |
| 01/11/2012 | CN202111092U Light-emitting diode (LED) preventing static damage |
| 01/11/2012 | CN202111091U Led集成封装结构 Led integrated package structure |
| 01/11/2012 | CN202111090U Warm white LED with high color rendering index |
| 01/11/2012 | CN202111089U COB LED structure capable of modulating light and colors |
| 01/11/2012 | CN202111088U Packaging structure of high power LED chip |
| 01/11/2012 | CN202111087U LED module and LED display |
| 01/11/2012 | CN202111086U Small-scale jumper-type double-row bridge rectifier |
| 01/11/2012 | CN202111084U Electronic component mounting structure and frequency conversion equipment possessing the mounting structure |
| 01/11/2012 | CN202111080U Lead frame used for packaging power IC and packaging structure comprising lead frame thereof |
| 01/11/2012 | CN102318061A Lighting module and method for producing a lighting module |
| 01/11/2012 | CN102315380A Connection structure of elements and connection method |
| 01/11/2012 | CN102315372A Light-emitting module and illumination device |
| 01/11/2012 | CN102315371A Light emitting device |
| 01/11/2012 | CN102315362A Light emitting diode capable of improving picture fineness and arrangement method thereof |
| 01/11/2012 | CN102315280A Schottky diode with combined field plate and guard ring |
| 01/11/2012 | CN102315210A Semiconductor device including semiconductor packages stacked on one another |
| 01/11/2012 | CN102315209A 功率半导体模块 Power semiconductor module |
| 01/11/2012 | CN102315208A LED (Light-Emitting Diode) light-source packaging structure with inlaid ceramic plate |
| 01/11/2012 | CN102315207A Light emitting device package |
| 01/11/2012 | CN102315206A Luminous device and method for driving a luminous device |
| 01/11/2012 | CN102315205A Chip type differential geminate transistor |
| 01/11/2012 | CN102315204A Three-dimensional chip device and three-dimensional chip successively decrease type layer identifying number detecting circuit |
| 01/11/2012 | CN102315203A Combination structure of chip and substrate |
| 01/11/2012 | CN102315202A Substrate strip with circuit and making method for substrate strip |
| 01/11/2012 | CN102315197A Three-dimensional (3D) integrated circuit structure and method for detecting alignment of chip structures |
| 01/11/2012 | CN102315187A Conductor package structure |
| 01/11/2012 | CN102315184A 半导体器件 Semiconductor devices |
| 01/11/2012 | CN102313211A Surface illumination device |
| 01/11/2012 | CN101777550B 半导体装置 Semiconductor device |
| 01/11/2012 | CN101752353B Packaging structure of multi-chip semiconductor |
| 01/11/2012 | CN101661894B Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device |
| 01/11/2012 | CN101656249B Multilayer interconnection structure of wafer level package, manufacturing method and application |
| 01/11/2012 | CN101088160B Arrangement of a semiconductor module and an electrical busbar |
| 01/11/2012 | CN101050846B Method for producing flexible light source and flexible base board and flexible solid state light source |
| 01/10/2012 | US8094846 Deep sub-micron MOS preamplifier with thick-oxide input stage transistor |
| 01/10/2012 | US8093923 Semiconductor device |
| 01/10/2012 | US8093634 In situ formed drain and source regions in a silicon/germanium containing transistor device |
| 01/10/2012 | US8093614 LED array |
| 01/10/2012 | CA2609252C Cu-mo substrate and method for producing same |
| 01/05/2012 | WO2012003169A1 Stacked ic comprising integrated voltage regulator with embedded passive device (s) |
| 01/05/2012 | WO2012003087A1 Electro-static discharge protection for die of a multi-chip module |
| 01/05/2012 | WO2012003008A1 Integrated circuit for and method of testing die -to -die bonding |
| 01/05/2012 | WO2012002844A1 Method for manufacturing a light emitting diode lamp |
| 01/05/2012 | WO2012002454A1 Power module and power converter using same |
| 01/05/2012 | WO2012002294A1 Stacked semiconductor device with heat dissipating member |
| 01/05/2012 | WO2012001805A1 Power semiconductor module, electricity transformer device, and railway car |
| 01/05/2012 | WO2012001477A1 Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof |
| 01/05/2012 | US20120001671 5v tolerant circuit for cml transceiver in ac-couple |
| 01/05/2012 | DE102010060269A1 Optoelectronic device e.g. LED for e.g. indicator light of instrument, has semiconductor units that is provided with electrodes arranged on semiconductor layers and formed with extension regions |
| 01/04/2012 | EP2402993A2 Lead frame used in a light emitting device package |
| 01/04/2012 | EP2402991A2 Semiconductor component with improved heat dispersion |
| 01/04/2012 | EP2402797A2 Uniform illumination system |
| 01/04/2012 | EP2401763A1 Photovoltaic devices including controlled copper uptake |
| 01/04/2012 | EP1350270B1 Stacked die package |
| 01/04/2012 | CN202103572U Chopping wave module distribution parameters absorber with three insulated gate bipolar transistors |
| 01/04/2012 | CN202103571U Chopping wave module distribution parameters absorber with double insulated gate bipolar transistors |
| 01/04/2012 | CN202103048U Surface mounting device |
| 01/04/2012 | CN202103047U LED luminescence module group |
| 01/04/2012 | CN202103046U Light emitting diode radiating structure and backlight module |
| 01/04/2012 | CN202103045U Modular LED light source structure |
| 01/04/2012 | CN202103044U Small double-row bridge rectifier |
| 01/04/2012 | CN202103043U Switch structure |
| 01/04/2012 | CN202103042U Stackable digital and radio frequency system on chip with integral isolation layer |
| 01/04/2012 | CN1971896B Macromolecule conductive film structure and its semiconductor assembly encapsulation structure |
| 01/04/2012 | CN102308384A Improved packaging for LED combinations |
| 01/04/2012 | CN102306700A Light and color regulable COBLED structure |
| 01/04/2012 | CN102306699A Integrated light-emitting diode (LED) packaging structure |
| 01/04/2012 | CN102306648A Optical coupler |