| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/13/2011 | CN201898134U High-voltage fast-recovery rectifying silicon stack |
| 07/13/2011 | CN201898133U Combined positioning structure of heat radiator and heat source |
| 07/13/2011 | CN102124563A Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 07/13/2011 | CN102124562A 3D integrated circuit device fabrication using interface wafer as permanent carrier |
| 07/13/2011 | CN102124550A Metal nano-ink, process for producing the metal nano-ink, and die bonding method and die bonding apparatus using the metal nano-ink |
| 07/13/2011 | CN102122653A Production process of bipolar light-emitting diode |
| 07/13/2011 | CN102122652A Package |
| 07/13/2011 | CN102122623A Press-mounting mechanism for converter valve thyristor |
| 07/13/2011 | CN102122622A Light-emitting diode module, substrate used for light-emitting diode module and manufacturing method thereof |
| 07/13/2011 | CN101521192B Package structure of light emitting diode and the packaging method thereof |
| 07/13/2011 | CN101471335B Light emitting module and method for manufacturing the same |
| 07/13/2011 | CN101459160B Diode needle contact member for voltage stabilization |
| 07/13/2011 | CN101393871B Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 07/13/2011 | CN101364580B Package and semiconductor device |
| 07/13/2011 | CN101127348B Plastic overmolded packages with molded lid attachments |
| 07/12/2011 | US7978478 Printed circuit board |
| 07/12/2011 | US7978006 Quantum interference transistors and methods of manufacturing and operating the same |
| 07/12/2011 | US7977974 Integrated circuit device and electronic instrument |
| 07/12/2011 | US7977159 Memory chip and semiconductor device using the memory chip and manufacturing method of those |
| 07/12/2011 | US7977156 Chipstack package and manufacturing method thereof |
| 07/12/2011 | US7977127 Optical transmission module and manufacturing method of the same |
| 07/12/2011 | CA2353326C Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 07/07/2011 | WO2011080409A2 Process for fabricating an electronic component combining an electromechanical system and an electronic circuit |
| 07/07/2011 | WO2011079474A1 White light luminescent device based on purple light leds |
| 07/07/2011 | WO2011054336A3 Method for producing an arrangement |
| 07/07/2011 | US20110163458 Method for manufacturing electronic device and electronic device |
| 07/07/2011 | DE102009060759A1 Strahlungsemittierende Vorrichtung, Modul mit einer strahlungsemittierenden Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung Radiation-emitting device module having a radiation-emitting device and method of manufacturing a radiation-emitting device |
| 07/07/2011 | DE102009046258B3 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module |
| 07/07/2011 | DE10158395B4 LED-Beleuchtungssystem LED lighting system |
| 07/06/2011 | EP2341563A2 Light emitting device package and lighting system |
| 07/06/2011 | EP2341543A1 Light emitting device and method of fabricating the same |
| 07/06/2011 | EP2341536A2 Lighting apparatus |
| 07/06/2011 | EP2341535A1 Pressure-contacted high performance semiconductor module with hybrid pressure accumulator |
| 07/06/2011 | EP2341534A1 Power semiconductor module |
| 07/06/2011 | EP2341532A1 Power semiconductor module and semiconductor power converter provided with the same |
| 07/06/2011 | EP2341530A1 Production method of semiconductor device arrays |
| 07/06/2011 | EP2341356A1 Method and device for measuring inter-chip signals |
| 07/06/2011 | EP2340560A1 Power switching module |
| 07/06/2011 | EP2340554A1 Methods and systems for material bonding |
| 07/06/2011 | EP2206150B1 Ready-to-connect led module body |
| 07/06/2011 | CN201893339U Integrated type LED light source |
| 07/06/2011 | CN201893338U LED (Light-Emitting Diode) packaging structure and LED light-emitting display module |
| 07/06/2011 | CN201893337U Plate-type differential pair transistor |
| 07/06/2011 | CN201892054U Annular LED light source |
| 07/06/2011 | CN102117876A 半导体封装结构 The semiconductor package structure |
| 07/06/2011 | CN102117801A High-power light-emitting diode module structure and manufacturing method thereof |
| 07/06/2011 | CN102117800A Semiconductor chip stack and production method thereof |
| 07/06/2011 | CN102117799A Buried multi-chip semiconductor package structure and manufacturing method thereof |
| 07/06/2011 | CN102117798A Stack package |
| 07/06/2011 | CN102116455A Efficient light-emitting LED (Light Emitting Diode) packaging surface |
| 07/06/2011 | CN101546759B Method for manufacturing an electronic module and an electronic module |
| 07/06/2011 | CN101536182B 半导体器件 Semiconductor devices |
| 07/06/2011 | CN101465341B Stacked chip packaging structure |
| 07/06/2011 | CN101459163B Light emitting diode |
| 07/06/2011 | CN101385142B Semiconductor module and drive device for hybrid vehicle having the same |
| 07/06/2011 | CN101252092B Multi-chip packaging structure and making method thereof |
| 07/05/2011 | US7973407 Three-dimensional stacked substrate arrangements |
| 07/05/2011 | US7971793 Memory card |
| 07/05/2011 | CA2570366C Illuminated electric toothbrushes and methods of use |
| 06/30/2011 | WO2011077968A1 Circuit module manufacturing method, circuit module, and electronic apparatus provided with circuit module |
| 06/30/2011 | WO2011077918A1 Circuit module |
| 06/30/2011 | WO2011076934A1 Window interposed die packaging |
| 06/30/2011 | US20110156794 Gate control circuit for high bandwidth switch design |
| 06/30/2011 | US20110156608 Light tube and power supply circuit |
| 06/30/2011 | US20110156275 Integrated circuit packaging system having planar interconnect and method for manufacture thereof |
| 06/30/2011 | US20110156247 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156246 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156233 Stack package |
| 06/30/2011 | US20110156232 Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips |
| 06/30/2011 | US20110156230 Multi-stacked semiconductor dice scale package structure and method of manufacturing same |
| 06/30/2011 | US20110156204 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156094 Electrical module |
| 06/30/2011 | US20110155908 Color filter array and image obtaining apparatus |
| 06/30/2011 | DE102010009984A1 Verstärkerbaustein mit einem Kompensationselement Amplifier module with a compensation element |
| 06/30/2011 | DE102009060781A1 Lichtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs sowie Beleuchtungseinrichtung mit einem solchen Lichtmodul Light module for a lighting device of a motor vehicle and lighting device with such a light module |
| 06/29/2011 | EP2339650A1 Production method for light emitting devices |
| 06/29/2011 | EP2339627A1 Window interposed die packaging |
| 06/29/2011 | EP2339618A2 Method for assembling at least one chip with a wired element, electronic chip with deformable connection element, method for manufacturing a plurality of chips and assembly of at least one chip with a wired element |
| 06/29/2011 | EP2339614A1 Method for stacking semiconductor chips |
| 06/29/2011 | EP2339476A1 Interface connecting dies in an IC package |
| 06/29/2011 | EP2338176A1 Illumination apparatus with steps and an led array |
| 06/29/2011 | EP2338175A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it |
| 06/29/2011 | EP2338173A1 Substrate arrangement |
| 06/29/2011 | EP2338171A1 Method for making via interconnection |
| 06/29/2011 | CN201887075U Led |
| 06/29/2011 | CN201887074U LED (light-emitting diode) light-unifying chip |
| 06/29/2011 | CN201887045U Encapsulating structure for high-power LED light source module |
| 06/29/2011 | CN201887044U Encapsulating structure for LED light source module |
| 06/29/2011 | CN201887043U Multi-chip light-emitting diode module |
| 06/29/2011 | CN201887042U LED array packaging structure with microstructural silica gel lenses |
| 06/29/2011 | CN201887041U High heat radiation patch type LED module |
| 06/29/2011 | CN201884982U Novel LED (light-emitting diode) light source module encapsulation structure |
| 06/29/2011 | CN102113119A Light source with near field mixing |
| 06/29/2011 | CN102113118A System and method for utility pole distributed solar power generation |
| 06/29/2011 | CN102113117A System and method for excess voltage protection in a multi-die package |
| 06/29/2011 | CN102112807A Color tunable light source |
| 06/29/2011 | CN102111078A Rectifier bridge of automobile AC (alternating current) generator |
| 06/29/2011 | CN102110759A Structure and method for packaging light-emitting diode (LED) |
| 06/29/2011 | CN102110757A White light LED and packaging method thereof |
| 06/29/2011 | CN102110750A Method for packaging wafer level glass micro-cavity of light-emitting diode (LED) |