| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/22/2011 | DE10240415B4 Halbleiteranordnung mit einem in einem Hohlraum eingebetteten Modul und Verfahren zum Herstellen derselben A semiconductor device comprising an embedded in a cavity module and method for manufacturing the same |
| 09/22/2011 | DE102010012064A1 LED arrangement used for e.g. signal transmitter, has LED arranged on circuit board, such that optical axis of LED is directed towards to circuit board |
| 09/22/2011 | DE102007061599B4 Trägeraufbau für einen Leistungsbaustein mit einem Kühlkörper und Verfahren zu dessen Herstellung Support structure for a power module to a heat sink and method for manufacturing the |
| 09/22/2011 | DE102004063039B4 Anordnung mit einem elektrischen Leistungshalbleiterbauelement und einer Zwei-Phasen-Kühlvorrichtung Arrangement with an electric power semiconductor component and a two-phase cooling device |
| 09/22/2011 | DE10066442B4 Halbleitervorrichtung mit Abstrahlungs-Struktur A semiconductor device having radiating structure |
| 09/21/2011 | EP2367400A2 Light emitting device for AC power operation |
| 09/21/2011 | EP1068638B1 Wafer-pair having chambers sealed with a deposited layer and method for forming wafer-pair |
| 09/21/2011 | CN201985175U 等距功率型led焊盘 Isometric power type led pad |
| 09/21/2011 | CN201985166U 一种led封装结构 One kind of led package structure |
| 09/21/2011 | CN201985096U Structure of lead frame capable of improving luminous efficiency |
| 09/21/2011 | CN201985095U Led集成封装器件 Led integrated package devices |
| 09/21/2011 | CN201985094U Led直插式三基色浑光结构 Led-line tricolor muddy light structure |
| 09/21/2011 | CN201985093U 一种led铜支架 One kind of led copper bracket |
| 09/21/2011 | CN201985092U Microelectronic unit, interconnecting base plate and system |
| 09/21/2011 | CN201983063U 稀土led灯具 RE led lamps |
| 09/21/2011 | CN201982991U Led面光源 Led surface light source |
| 09/21/2011 | CN1700453B Structure of forming pressure contact with power semiconductor module |
| 09/21/2011 | CN102197481A Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it |
| 09/21/2011 | CN102197475A Semiconductor module |
| 09/21/2011 | CN102195502A Semiconductor device |
| 09/21/2011 | CN102195113A Impedance transformer, integrated circuit device, amplifier, and communicator module |
| 09/21/2011 | CN102194981A Light emitting device package, and display apparatus and lighting system having the same |
| 09/21/2011 | CN102194980A Light emitting diode package and lighting system including the same |
| 09/21/2011 | CN102194963A Low thermal resistance light-emitting diode (LED) and packaging method thereof |
| 09/21/2011 | CN102194952A Light emitting device and light emitting device package having the same |
| 09/21/2011 | CN102194951A Light emitting diode, light emitting diode package, and lighting system |
| 09/21/2011 | CN102194950A Light emitting device |
| 09/21/2011 | CN102194949A Light emitting device |
| 09/21/2011 | CN102194948A Light emitting device and light emitting device package |
| 09/21/2011 | CN102194936A Light emitting device, light emitting device package, and lighting system |
| 09/21/2011 | CN102194932A Light emitting diode and fabrication method thereof |
| 09/21/2011 | CN102194929A Light emitting device |
| 09/21/2011 | CN102194813A Optical coupler and producing method thereof |
| 09/21/2011 | CN102194812A Light-emitting diode (LED) packaging piece and lamp thereof |
| 09/21/2011 | CN102194811A 热电装置 Thermoelectric devices |
| 09/21/2011 | CN102194810A Power-type light-emitting diode |
| 09/21/2011 | CN102194809A Large-area light-emitting diode module and packaging method thereof |
| 09/21/2011 | CN102194808A LED (light emitting diode) integrated packaging device with up-down power type electrodes and packaging method thereof |
| 09/21/2011 | CN102194807A Light-emitting diode packaging structure and manufacturing method thereof |
| 09/21/2011 | CN102194806A Stacked dual chip package and method of fabrication |
| 09/21/2011 | CN102194805A Semiconductor package with stacked chips and method for manufacturing the same |
| 09/21/2011 | CN102194804A Package structure |
| 09/21/2011 | CN102194803A Semiconductor structure |
| 09/21/2011 | CN102194802A Electronic assembly body |
| 09/21/2011 | CN102194801A Packaging structure of light-emitting diode emitting light in forward direction and formation method thereof |
| 09/21/2011 | CN102194800A Multi-chip package with improved signal transmission |
| 09/21/2011 | CN102194788A Multi-layer lead frame package and method of fabrication |
| 09/21/2011 | CN102194785A Leadframe circuit and method therefor |
| 09/21/2011 | CN102194779A Packaging structure |
| 09/21/2011 | CN102194711A Semiconductor device and method of forming IPD in FO-WLCSP |
| 09/21/2011 | CN102194709A Light emitting diode packaging element and manufacture method thereof |
| 09/21/2011 | CN102194707A Method for manufacturing semiconductor structure |
| 09/21/2011 | CN102192805A Stress detection element, tactile sensor and grasping device |
| 09/21/2011 | CN101814487B Multi-chip LED light source module group and manufacture method thereof |
| 09/21/2011 | CN101755329B Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device |
| 09/21/2011 | CN101681849B Bonding apparatus, and bonding method |
| 09/21/2011 | CN101595562B Stacked packages |
| 09/21/2011 | CN101527299B Package Structure |
| 09/21/2011 | CN101519183B Mems packaging including integrated circuit dies |
| 09/21/2011 | CN101453158B Power module used for micro frequency transformer |
| 09/21/2011 | CN101425509B High heat radiation power type electrode rack for LED |
| 09/20/2011 | US8024690 Method, system and computer program product for determining routing of data paths in interconnect circuitry providing a narrow interface for connection to a first device and a wide interface for connection to a distributed plurality of further devices |
| 09/20/2011 | US8024170 Configuration of reconfigurable interconnect portions |
| 09/20/2011 | US8022724 Method and integrated circuit for secure reconfiguration of programmable logic |
| 09/20/2011 | US8022537 Semiconductor device |
| 09/20/2011 | US8022536 Semiconductor substrate for build-up packages |
| 09/20/2011 | US8021921 Method of joining chips utilizing copper pillar |
| 09/20/2011 | US8021920 Method for producing a metal-ceramic substrate for electric circuits on modules |
| 09/15/2011 | WO2011112818A1 Processing to reduce wafer level warpage on moulding |
| 09/15/2011 | WO2011112584A1 Inverter power system |
| 09/15/2011 | WO2011111318A1 Module |
| 09/15/2011 | WO2011111300A1 Semiconductor package having electrode on side surface, and semiconductor device |
| 09/15/2011 | WO2011110900A1 Stack of molded integrated circuit dies with side surface contact tracks |
| 09/15/2011 | US20110221053 Pre-processing to reduce wafer level warpage |
| 09/15/2011 | DE102010010750A1 Multi-layer substrate for printed circuit board for mounting and connecting electrical and/or electronic components, has guide module arranged on carrier surface side, where light emitted from light source is entered into lighting module |
| 09/15/2011 | DE102010010649A1 Lamp, has bulb housing provided with tubular hollow bodies, and LEDs arranged in edge area of tubular hollow bodies, where tubular hollow bodies comprise round, oval, rectangular, quadratic or polygonal cross-sections |
| 09/15/2011 | DE102006014582B4 Halbleitermodul Semiconductor module |
| 09/14/2011 | EP2365648A2 Optical coupler and producing method thereof |
| 09/14/2011 | EP2365525A2 Illumination apparatus having an array of red and phosphour coated blue LEDs |
| 09/14/2011 | EP2364506A1 Flexible wind deflector for photovoltaic array perimeter assembly |
| 09/14/2011 | EP1997138B1 Methods and materials useful for chip stacking, chip and wafer bonding |
| 09/14/2011 | EP1597947B1 Method for manufacturing an electronic module |
| 09/14/2011 | EP1405377B1 Led-module for illuminating devices |
| 09/14/2011 | CN201976023U 高压大功率三相整流全桥装置 High power three-phase full-bridge rectifier device |
| 09/14/2011 | CN201975423U 表面粗化硅胶密封的led Surface roughening led silicone seal |
| 09/14/2011 | CN201975391U 具有散热孔的双灯杯led灯珠 Lamps led lamp beads having a cup of cooling holes |
| 09/14/2011 | CN201975390U 多led芯片的封装结构 Multi-chip package structure led |
| 09/14/2011 | CN201975389U Fixing device for high power thyristor valve string |
| 09/14/2011 | CN102187458A Interconnect structures for stacked dies, including penetrating structures for through-silicon vias |
| 09/14/2011 | CN102187400A Integrated circuit device |
| 09/14/2011 | CN102185095A Highly-efficient radiation high-power light emitting diode (LED) packaging structure |
| 09/14/2011 | CN102185078A Outdoor surface mounted light emitting diode (LED) packaging structure and packaging method |
| 09/14/2011 | CN102185076A Light emitting device and display device having the same |
| 09/14/2011 | CN102185051A Light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package |
| 09/14/2011 | CN102185042A Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system |
| 09/14/2011 | CN102184917A Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package |
| 09/14/2011 | CN102184916A Optical module and manufacturing method of the module |
| 09/14/2011 | CN102184915A High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof |
| 09/14/2011 | CN102184914A Power semiconductor module and method for operating a power semiconductor module |
| 09/14/2011 | CN101794767B Mechanical press mounting structure of group large-power flat-plate power electronic device |