H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2011
11/02/2011	CN202025796U Light-emitting diode (LED) lamp strip board
11/02/2011	CN202025795U Directly-conductive and heat-dissipating LED and electronic device made by combining same
11/02/2011	CN202025756U Semiconductor LED secondary packaging piece adopting gold-plated bonding copper wires for connection
11/02/2011	CN202025755U LED chip and display device both packaged by drive circuit in hybrid manner
11/02/2011	CN202025754U Circuit board for LED (Light Emitting Diode) module
11/02/2011	CN202025753U LED (light-emitting diode) module
11/02/2011	CN202025752U Pressure plate used for LED module group
11/02/2011	CN202025751U Efficient white light LED package with controllable junction temperature and adjustable color temperature
11/02/2011	CN202025750U Large power LED packaging structure
11/02/2011	CN202025749U Three-dimensional high-density system level packaging structure
11/02/2011	CN202025748U High-density system-on-package structure
11/02/2011	CN202025747U Fan-out system-on-package structure
11/02/2011	CN202025746U High integrated level SiP structure
11/02/2011	CN202024287U Packaging structure of airtight multilayered array light-emitting diode
11/02/2011	CN102231419A LED (light-emitting diode) packaging method and LED device packaged by using same
11/02/2011	CN102231378A Light-emitting diode (LED) packaging structure and preparation method thereof
11/02/2011	CN102231377A High color rendering light emitting diode and manufacture method thereof
11/02/2011	CN102231376A Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method
11/02/2011	CN102231375A Semiconductor device and storage card
11/02/2011	CN102231371A Semiconductor chip and storage device
11/02/2011	CN102231369A High-power heat-dissipation module
11/02/2011	CN101685816B Light-emitting module, light-emitting device having the light-emitting module, and lighting apparatus having the light-emitting device
11/02/2011	CN101419962B LED, production method therefore and illuminator manufactured by the LED
11/02/2011	CN101308836B Light emitting diode, light emitting diode component and llight emitting diode lamp string
11/01/2011	US8049531 General purpose input/output system and method
11/01/2011	US8049342 Semiconductor device and method of fabrication thereof
11/01/2011	US8049331 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
11/01/2011	US8048766 Integrated circuit on high performance chip
11/01/2011	US8048715 Multi-chip module and methods
11/01/2011	US8046912 Method of making a connection component with posts and pads
10/2011
10/27/2011	WO2011132736A1 Semiconductor module and cooler
10/27/2011	WO2011132145A1 Lamp with increased eye safety and method for operating a lamp
10/27/2011	WO2011109310A3 Thermal vias in an integrated circuit package with an embedded die
10/27/2011	US20110263121 Manufacturing method for semiconductor device containing stacked semiconductor chips
10/27/2011	US20110260320 Method of making a connection component with posts and pads
10/27/2011	US20110260319 Three-dimensional stacked substrate arrangements
10/27/2011	DE202007019330U1 Beschichtung/Abdeckung für optoelektronische Bauteile Coating / cover for optoelectronic devices
10/27/2011	DE102011007227A1 Leistungsblock und ihn verwendendes Halbleiterleistungsmodul Power block and him-use semiconductor power module
10/27/2011	DE102010028121A1 Method for manufacturing e.g. application-specific integrated switching circuit, involves removing connector of plastic mass and chips from carrier by thermal decomposition of thermoplastic material at temperature
10/26/2011	EP2381478A2 Integrated circuit device
10/26/2011	EP2381475A2 Silicon photomultiplier device
10/26/2011	EP2381472A1 Method for manufacturing a microelectronic device and microelectronic device thus manufactured
10/26/2011	EP2381156A1 Lamp with increased eye safety and method for operating a lamp
10/26/2011	EP2380415A1 Chip packages with power management integrated circuits and related techniques
10/26/2011	EP2380194A1 Face-to-face (f2f) hybrid structure for an integrated circuit
10/26/2011	EP1609339B1 Method for manufacturing an electronic module and an electronic module
10/26/2011	EP1032114B1 Electric module for vehicle alternator, in particular car alternator, and assembly featuring such an alternator and such a module
10/26/2011	CN202018998U Semiconductor light emitting diode secondary package part with nickel-plated bonding copper wires for connection
10/26/2011	CN202018997U Semiconductor LED secondary enclosure adopting palladium-plated bonding copper wire for connection
10/26/2011	CN202018965U Coupler with light-emitting diode (LED) and photoresistor
10/26/2011	CN202018964U Omnibearing luminous LED light source
10/26/2011	CN202018963U Integrated LED bracket
10/26/2011	CN202018962U Semiconductor light-emitting diode secondary encapsulating component connected through silver-plated bonded copper wire
10/26/2011	CN202018961U Compound wafer light emitting diode and wire rack structure thereof
10/26/2011	CN202018960U Luminous chip packaging structure of insulating bottom plate
10/26/2011	CN202018959U Low-stress grouting rectification square bridge
10/26/2011	CN202017909U Light-emitting diode (LED) light module for illumination and LED chip for illumination
10/26/2011	CN1917731B Calibrated led light module
10/26/2011	CN102227807A Radiation-emitting semiconductor chip
10/26/2011	CN102226995A LED (light-emitting diode) packaging structure and manufacturing method thereof
10/26/2011	CN102226994A Display device for integrating LED (light-emitting diode) chip on conducting glass and manufacturing method thereof
10/26/2011	CN102226993A Light source packaging composition of large power LED street lamp and packaging technology thereof
10/26/2011	CN102226504A Multi-chip integration packaged LED (light emitting diode) light source module and preparation process thereof
10/26/2011	CN101794768B Light emitting diode package and projecting device
10/26/2011	CN101789422B Light-emitting diode (LED) module
10/26/2011	CN101675535B Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
10/26/2011	CN101621053B System-in-package module and mobile terminal having the same
10/26/2011	CN101483208B LED encapsulation construction and assembling method thereof
10/26/2011	CN101312174B Line component
10/25/2011	US8046727 IP cores in reconfigurable three dimensional integrated circuits
10/25/2011	US8044518 Junction member comprising junction pads arranged in matrix and multichip package using same
10/25/2011	US8044468 Semiconductor device
10/25/2011	US8044361 Radiation detection unit and radiographic inspection apparatus
10/25/2011	US8042964 Illumination device having luminous spots formed by light emitting diodes
10/25/2011	US8042267 Method for producing microsystems
10/24/2011	DE202011051218U1 LED-Modulfixierungsanordnung LED module fixing arrangement
10/20/2011	WO2011130078A1 Dual-side interconnected cmos for stacked integrated circuits
10/20/2011	WO2011128173A1 Optoelectronic component and method for producing an optoelectronic component
10/20/2011	WO2011127909A1 Liquid reflector
10/20/2011	US20110254986 Analog-digital converter, image sensor system and camera device
10/20/2011	US20110254619 Powered Device Including a Multi-Use Detection Resistor
10/20/2011	US20110254618 Differential thermistor circuit
10/20/2011	US20110254167 Stack package having flexible conductors
10/20/2011	US20110254145 Stacked semiconductor package
10/20/2011	US20110254045 Light emitting diode package and light emitting diode system having at least two heat sinks
10/20/2011	DE102010027932A1 Verbundbauteil und Verfahren zum Herstellen eines Verbundbauteils Composite component and method of manufacturing a composite component
10/20/2011	DE102010027875A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements Optoelectronic component and method of manufacturing an optoelectronic component
10/19/2011	EP2378576A2 Light emitting diode package, lighting apparatus having the same, and method for manufacturing light emitting diode package
10/19/2011	EP2378553A1 Light emitting device and light emitting device package
10/19/2011	EP2378552A1 Power semiconductor module with connection elements
10/19/2011	EP2378547A1 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, and three-dimensional structure, on the surface of which wiring is provided and fabrication method thereof
10/19/2011	EP2377173A1 Aligned multiple emitter package
10/19/2011	CN202013885U LED (Light Emitting Diode) integrated packaging device arranged at upper and lower of electrode
10/19/2011	CN202013884U High power light-emitting diode (LED) packing support
10/19/2011	CN202013883U High-power LED (Light Emitting Diode) module sealing structure
10/19/2011	CN202013882U Packaging structure capable of enhancing LED brightness
10/19/2011	CN202013881U Integrated packaging structure with vertically structured LED chips
10/19/2011	CN102224590A Antenna integrated in a semiconductor chip
10/19/2011	CN102223065A Electronic device and semiconductor device
10/19/2011	CN102222757A Light emitting diode package, lighting apparatus having the same, and method for manufacturing light emitting diode package

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