Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2015
03/05/2015WO2015030673A1 Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
03/05/2015WO2015029638A1 Semiconductor device for power generation, method for manufacturing same, and solder therefor
03/05/2015WO2015029635A1 Method for manufacturing wide band gap semiconductor device, method for manufacturing semiconductor module, wide band gap semiconductor device and semiconductor module
03/05/2015WO2015029630A1 Electronic control device
03/05/2015WO2015029629A1 Vehicular electronic control device
03/05/2015WO2015029446A1 Stacked cooler
03/05/2015WO2015029004A1 Semiconductor die and package jigsaw submount
03/05/2015WO2015028512A1 Optoelectronic module and method for the production thereof
03/05/2015WO2015028213A1 Die with a crack detecting structure and manufacturing method thereof
03/05/2015US20150064846 Semiconductor Device
03/05/2015US20150064844 Multichip Power Semiconductor Device
03/05/2015US20150064843 Stacked semiconductor package and method for manufacturing the same
03/05/2015US20150063760 Small form factor transceiver compatible with solder processing
03/05/2015US20150062437 Semiconductor device
03/05/2015US20150061513 Multichip package structure
03/05/2015US20150061162 Semiconductor structure and manufacturing method thereof
03/05/2015US20150061160 Semiconductor device and method of manufacturing the semiconductor device
03/05/2015US20150061157 High yield semiconductor device
03/05/2015US20150061152 Package module with offset stack device
03/05/2015US20150061150 Stacked semiconductor chip device with phase change material
03/05/2015US20150061144 Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
03/05/2015US20150061142 ULTRA FINE PITCH PoP CORELESS PACKAGE
03/05/2015US20150061130 Chip arrangement and a method for manufacturing a chip arrangement
03/05/2015US20150061120 Stack packages and methods of manufacturing the same
03/05/2015US20150061118 Three-Dimensional Chip Stack and Method of Forming the Same
03/05/2015US20150061110 Stacked chip layout and method of making the same
03/05/2015US20150061103 Embedded die package
03/05/2015US20150061101 Semiconductor packages and methods of packaging semiconductor devices
03/05/2015US20150061100 Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
03/05/2015US20150061099 Dense-pitch small-pad copper wire bonded double ic chip stack packaging piece and preparation method therefor
03/05/2015US20150061095 Package-on-package devices, methods of fabricating the same, and semiconductor packages
03/05/2015US20150061043 Compact sensor module
03/05/2015US20150060940 Electronic device
03/05/2015US20150060932 Liquid-filled packaging structure of heating component
03/05/2015US20150060907 Led lamp using blue and cyan leds and a phosphor
03/05/2015US20150060905 Light source module and manufacturing method thereof, and backlight unit
03/05/2015US20150060902 Package of light emitting diode chips
03/05/2015US20150060879 GaN-Based LED
03/05/2015DE102014216742A1 MEMS-Vorrichtung MEMS device
03/05/2015DE102014212519A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
03/05/2015DE102014112429A1 Halbleiterpackage mit Mehrebenen-Chipblock Semiconductor package with multilevel chip block
03/05/2015DE102014112330A1 Überspritzte Substrat-Chip-Anordnung mit Wärmesenke Overmolded substrate chip assembly with heat sink
03/05/2015DE102013217802A1 Halbleiteranordnung, verfahren zur herstellung einer halbleiterbaugruppe, verfahren zur herstellung einer halbleiteranordnung und verfahren zum betrieb einer halbleiteranordnung A semiconductor device, method for manufacturing a semiconductor module, process for manufacturing a semiconductor assembly and method for operating a semiconductor arrangement
03/05/2015DE102013217801A1 Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen, verfahren zur herstellung einer halbleiteranordnung und verfahren zum betrieb einer halbleiteranordnung A semiconductor device, method for manufacturing a number of chip modules, process to manufacture a semiconductor assembly and method for operating a semiconductor arrangement
03/05/2015DE102013217301A1 Bauteil Component
03/04/2015EP2843704A1 Light emitting module and lighting device
03/04/2015EP2843703A1 Light emitting module and lighting device
03/04/2015EP2843702A1 Semiconductor light emitting device
03/04/2015EP2843701A1 Light emitting device
03/04/2015EP2842160A1 High resolution display architecture
03/03/2015US8971678 Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor
03/03/2015US8971087 Stacked memory with interface providing offset interconnects
03/03/2015US8971044 Semiconductor device
03/03/2015US8970251 Programmable logic device
03/03/2015US8970250 Configuration context switcher with a latch
03/03/2015US8970125 UV irradiation apparatus
03/03/2015US8970052 Semiconductor device stack with bonding layer and wire retaining member
03/03/2015US8970050 Semiconductor memory device including alignment key structures
03/03/2015US8970049 Multiple chip package module having inverted package stacked over die
03/03/2015US8970047 Method for creating a 3D stacked multichip module
03/03/2015US8970046 Semiconductor packages and methods of forming the same
03/03/2015US8970044 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
03/03/2015US8970043 Bonded stacked wafers and methods of electroplating bonded stacked wafers
03/03/2015US8970042 Circuit board, comprising a core insulation film
03/03/2015US8970025 Stacked packages having through hole vias
03/03/2015US8970024 Packages with molding material forming steps
03/03/2015US8970021 Thermally enhanced semiconductor package
03/03/2015US8970020 Semiconductor device
03/03/2015US8970000 Signal transmission arrangement
03/03/2015US8969995 Semiconductor device and rectifier system
03/03/2015US8969985 Semiconductor chip package and method
03/03/2015US8969842 Photointerrupter, method of manufacturing the same, and mounting structure of the same
03/03/2015US8969822 Two-dimensional and three-dimensional position sensing systems and sensors therefor
03/03/2015US8969140 Embedded semiconductive chips in reconstituted wafers, and systems containing same
03/03/2015US8969135 Semiconductor device and method of assembling same
03/03/2015US8969133 Package-on-package assembly with wire bonds to encapsulation surface
03/03/2015US8969121 Method for manufacturing solar cell
03/03/2015US8967829 Illumination device employing LEDS that has equivalent light distribution characteristics of incandescent lamps
03/03/2015US8967827 Lead frame, wiring board, light emitting unit, and illuminating apparatus
02/2015
02/26/2015WO2015025447A1 Semiconductor devices
02/26/2015US20150056726 Chip positioning in multi-chip package
02/26/2015US20150054169 Stack packages having token ring loops
02/26/2015US20150054144 Semiconductor package including multiple chips and separate groups of leads
02/26/2015US20150054140 Stack of semiconductor structures and corresponding manufacturing method
02/26/2015US20150054138 Semiconductor device having stacked substrates with protruding and recessed electrode connection
02/26/2015US20150054125 Chip, chip arrangement and method for producing a chip
02/26/2015US20150054099 Pressure sensor device and assembly method
02/26/2015US20150054009 Light emitting diode package and method for manufacturing same
02/26/2015US20150054005 Light emitting package
02/26/2015US20150054001 Integrated Camera Module And Method Of Making Same
02/26/2015US20150053774 Methods to fabricate integrated circuits by assembling components
02/26/2015DE112013002708T5 Netzwerk elektronischer Vorrichtungen, die auf einem flexiblen Träger angebracht sind, und Kommunikationsverfahren Network of electronic devices which are mounted on a flexible carrier, and communication method
02/26/2015DE102014111829A1 Ein Halbleitermodul und ein Verfahren zu dessen Fabrikation durch erweiterte Einbettungstechnologien A semiconductor module and a method for its manufacture by embedding Advanced Technologies
02/26/2015DE102014104716B3 Leistungshalbleitermodul The power semiconductor module
02/26/2015DE102013109031A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips A method for producing an optoelectronic semiconductor chip
02/25/2015EP2840607A1 Semiconductor module
02/25/2015EP2840604A1 Semiconductor device and cooler for semiconductor device
02/24/2015US8964483 Semiconductor device and memory system
02/24/2015US8964440 Stacked semiconductor devices including a master device
02/24/2015US8963338 III-nitride transistor stacked with diode in a package
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