H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2011
08/17/2011	CN102157509A Light mixing type light-emitting diode encapsulation structure capable of improving color rendering
08/17/2011	CN102157508A Novel LED packaging light-reflecting method and device
08/17/2011	CN102157507A White LED integration module with adjustable color temperature and color rendering indexes
08/17/2011	CN102157506A Light emitting device
08/17/2011	CN102157505A Light-emitting module
08/17/2011	CN102157504A Light emitting diode package and light unit having the same
08/17/2011	CN102157503A Light-emitting diode structure capable of emitting light and enhancing heat radiation efficiency and LED (light-emitting diode) lamp
08/17/2011	CN102157502A System-in-package structure
08/17/2011	CN102157501A 三维系统级封装结构 Three-dimensional system-level package structure
08/17/2011	CN102157500A 半导体封装 The semiconductor package
08/17/2011	CN102157499A Hybrid integrated circuit module based on low temperature co-fired ceramic technology and manufacturing method thereof
08/17/2011	CN102157498A Hybrid integrated circuit module and manufacturing method thereof
08/17/2011	CN102157480A Bridge rectifier
08/17/2011	CN102157474A Wafer level stack die package
08/17/2011	CN102157471A Dual-layer laminated patch rectifying full bridge
08/17/2011	CN102157457A Pressure-contacted power semiconductor module with tape-like load connection elements
08/17/2011	CN102157453A Stack-type package structure and manufacturing method thereof
08/17/2011	CN102157391A Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint
08/17/2011	CN102157187A 3D chip arrangement including memory manager
08/17/2011	CN101752277B System-in-a-package method and structure thereof
08/17/2011	CN101740421B Wafer and manufacturing method, system-level package structure and package method thereof
08/17/2011	CN101677098B 集成电路装置 The integrated circuit device
08/17/2011	CN101621105B LED flip chip integration encapsulation method and LED encapsulated by same
08/17/2011	CN101593748B Cascade connected thyristor valve section in jacking connection
08/17/2011	CN101477982B Photoconverter, manufacturing process thereof, and LED
08/17/2011	CN101432876B Semiconductor device and semiconductor device manufacturing method
08/17/2011	CN101355080B Semiconductor integrated circuit and semiconductor device with the same
08/17/2011	CN101345235B Production method of LED chip with electrostatic protection function
08/16/2011	US7999570 Enhanced permutable switching network with multicasting signals for interconnection fabric
08/16/2011	US7999397 Microelectronic packages and methods therefor
08/16/2011	US7999378 Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
08/16/2011	US7998792 Semiconductor device assemblies, electronic devices including the same and assembly methods
08/11/2011	WO2011097630A2 Systems and methods providing arrangements of vias
08/11/2011	WO2011097559A1 Rule-based semiconductor die stacking and bonding within a multi-die package
08/11/2011	WO2011097464A1 Surface preparation of die for improved bonding strength
08/11/2011	WO2011097302A2 Semiconductor electronic components and circuits
08/11/2011	WO2011096542A1 Substrate for power module, and power module
08/11/2011	WO2011096164A1 Semiconductor device
08/11/2011	WO2011095708A1 Method for assembling at least one chip using a fabric, and fabric including a chip device
08/11/2011	WO2010112478A3 Pressure support for an electronic circuit
08/11/2011	US20110195530 Semiconductor device and a method of manufacturing the same
08/11/2011	US20110193622 Pulse output circuit, shift register, and display device
08/11/2011	US20110193209 Semiconductor package
08/11/2011	DE10221891C5 Leistungshalbleitervorrichtung Power semiconductor device
08/11/2011	DE102011000623A1 Halbleitervorrichtung mit einem Halbleitermodul, das von Wärmesenken mit vergrößerter thermischer Masse gekühlt wird A semiconductor device comprising a semiconductor module that is cooled by heat sink with increased thermal mass
08/11/2011	DE102010007605A1 Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals
08/11/2011	DE102010007086A1 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung Arrangement with power semiconductor modules and a liquid cooling device
08/11/2011	DE102010001711A1 Halbleiter-Bauelement und entsprechendes Herstellungsverfahren Semiconductor device and manufacturing method thereof
08/11/2011	DE102010001666A1 Electrical or electronic composite component e.g. junction FET (JFET) has connection layer and interlayer whose active compound is arranged on attaching layers along opposite side of sinter layers
08/11/2011	DE10066443B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components
08/10/2011	EP2355177A2 Light emitting device, method of manufacturing the same
08/10/2011	EP2355151A2 Semiconductor light emitting device and image forming apparatus
08/10/2011	EP2355150A1 Multi-tiered integrated circuit package
08/10/2011	EP2354631A2 LED Module and Backlight Unit having the Same
08/10/2011	EP2354629A1 LED lamp for wide area lighting
08/10/2011	EP1547131B1 Large-diameter sic wafer and manufacturing method thereof
08/10/2011	CN201927635U 表贴式封装led结构 Surface mount package led structure
08/10/2011	CN201927609U 一种半导体三极管 A semiconductor triode
08/10/2011	CN201927606U 一种带静电保护的发光二极管 A light-emitting diode with electrostatic protection
08/10/2011	CN201927605U 一种集成大功率三极管 An integrated power transistor
08/10/2011	CN201927604U LED (light-emitting diode) light source
08/10/2011	CN201927603U 一种图形化led器件 A graphical led Devices
08/10/2011	CN201927602U 一种包含特殊功率端子的功率模块 Special power terminals comprising a power module
08/10/2011	CN201927601U Electronic component
08/10/2011	CN201927600U 具有内屏蔽的红外线接收头 Having an inner shield infrared receiver
08/10/2011	CN102150266A Systems and methods for enabling ESD protection on 3-D stacked devices
08/10/2011	CN102150246A Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate
08/10/2011	CN102149960A Integrated lED-based luminare for general lighting
08/10/2011	CN102148316A Light-emitting die package with electric surface mounting
08/10/2011	CN102148311A LED (light-emitting diode) packaging method
08/10/2011	CN102148310A Support structure for packaging light-emitting device
08/10/2011	CN102148305A Light emitting device, light emitting device package
08/10/2011	CN102148299A Method of dispensing fluorescent glue on LED (light-emitting diode) based on COB (Chip On Board) technology
08/10/2011	CN102148260A Integrated trench guarded Schottky diode structure compatible with power chip and method
08/10/2011	CN102148224A Led模块 Led Module
08/10/2011	CN102148223A Integrated package type LED (Light Emitting Diode) light source circuit arrangement method
08/10/2011	CN102148222A Semiconductor structure and semiconductor packaging structure having proximity communication signal input ends
08/10/2011	CN102148221A Electronic component package and manufacturing method therefor
08/10/2011	CN102148220A Semiconductor device
08/10/2011	CN102148219A Power module of insulated gate bipolar transistor
08/10/2011	CN102148206A Semiconductor packaging structure and producing method thereof
08/10/2011	CN102148172A Semiconductor process, semiconductor component and package structure with semiconductor component
08/10/2011	CN102148169A Silicon carbide power module and packaging method thereof
08/10/2011	CN102148167A Method for manufacturing stackable packaging structure
08/10/2011	CN102148166A Method and structure for filling clearances among stacked multi-layer wafers
08/10/2011	CN101681887B Method for producing a set of chips mechanically interconnected by means of a flexible connection
08/10/2011	CN101681850B Bonding apparatus, and bonding method
08/10/2011	CN101626016B Wafer treating method
08/10/2011	CN101432870B Semiconductor device with double-sided electrode structure and its manufacturing method
08/10/2011	CN101211902B 半导体装置 Semiconductor device
08/10/2011	CN101136396B Power electronic packing member including two pieces of substrate with multiple semiconductor chips and electronic elements
08/10/2011	CN101136395B Power electronic packing member including two pieces of substrate with multiple electronic elements
08/09/2011	US7995830 Method and apparatus for automating an inspection process with training
08/09/2011	US7995352 Printed circuit board
08/09/2011	US7994526 Light emitting diode package and light emitting diode system having at least two heat sinks
08/09/2011	US7994480 Visible light and IR combined image camera
08/09/2011	US7994048 Method of manufacturing a through electrode
08/09/2011	US7993969 Method for producing a module with components stacked one above another
08/09/2011	DE202010007032U1 LED-Modul für Strahler LED module for radiator
08/05/2011	DE20122947U1 Lichtquelle mit einem lichtemittierenden Element Light source with a light emitting element

1 ... 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 ... 409