Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2012
03/29/2012US20120074587 Semiconductor Device and Method of Bonding Different Size Semiconductor Die at the Wafer Level
03/29/2012US20120074502 Use of contacts to create differential stresses on devices
03/29/2012US20120074378 Memory element having elastically deformable active region
03/29/2012US20120074321 Variable waveband infrared imager
03/29/2012DE202012002417U1 Leuchtvorrichtung Lighting device
03/29/2012DE102011082781A1 Halbleitervorrichtung Semiconductor device
03/29/2012DE102011053871A1 Multichip-Halbleitergehäuse und deren Zusammenbau Multi-chip semiconductor package and assembly thereof
03/29/2012DE102010046963A1 Multi-Chip Package Multi-Chip Package
03/29/2012DE102010046790A1 Optoelectronic semiconductor component comprises two semiconductor chips, a conversion element, a prefabricated housing having a cavity, and a continuous emission spectrum, where the semiconductor chips comprise an active layer
03/29/2012DE102010046648A1 LED device, has LED including two terminals that are electrically contacted with heat conducting metal block and electrical component respectively, where metal block is arranged in heat conducting contact with inside wall of through-opening
03/29/2012DE102010041420A1 Lichtsystem mit erhöhter Effizienz Light system with increased efficiency
03/29/2012DE102007041926B4 Verfahren zur elektrischen Isolierung beziehungsweise elektrischen Kontaktierung von ungehäusten elektronischen Bauelementen bei strukturierter Verkapselung Method for electrical insulation or electrical contact of bare electronic components in a structured encapsulation
03/28/2012EP2434554A2 Light-emitting device
03/28/2012EP2434541A1 Method for bonding high heat conductive insulating resin
03/28/2012CN202178295U 发光二极管封装件 Light emitting diode package
03/28/2012CN202178255U 一种led模组及照明装置 A modular and lighting equipment led
03/28/2012CN202178254U 直立堆叠式发光二极管结构 Upright stacked light emitting diode structure
03/28/2012CN202178253U 阵列式发光二极管 An array of light-emitting diodes
03/28/2012CN102396063A Transparent OLED device with high intensity
03/28/2012CN102394236A LED (light-emitting diode) luminous module and manufacturing method thereof
03/28/2012CN102394235A Insulated gate bipolar transistor (IGBT) module and manufacturing method thereof
03/28/2012CN102392961A LED (light emitting diode) and OLED (organic light emitting diode) composite surface luminescent device
03/28/2012CN101894903B 光电转换装置 The photoelectric conversion device
03/28/2012CN101661930B Electronic element wafer module and method for manufacturing electronic element wafer module and electronic information device
03/28/2012CN101595563B Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same
03/28/2012CN101521196B Light-emitting diode (LED) and method for preparing LED and base of LED
03/27/2012US8145021 Cable for concentrating photovoltaic module
03/27/2012US8143914 Semiconductor integrated circuit
03/27/2012US8143727 Adhesive on wire stacked semiconductor package
03/27/2012US8143716 Semiconductor device with plate-shaped component
03/27/2012US8143100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
03/22/2012WO2012037216A2 Staged via formation from both sides of chip
03/22/2012WO2012035972A1 Semiconductor package and semiconductor device
03/22/2012WO2012035484A1 Embedded transient voltage suppression for light emitting devices
03/22/2012WO2012034827A1 Method for combining leds in a packaging unit and packaging unit having a multiplicity of leds
03/22/2012WO2012034332A1 Led integral structure with cooling equipment
03/22/2012US20120069230 Solid-state imaging apparatus and camera using the same
03/22/2012US20120068763 Semiconductor integrated circuit device
03/22/2012US20120068177 Measuring apparatus
03/22/2012DE102011082706A1 Gleichspannungs-Gleichspannungs-Wandler DC-DC converter
03/22/2012DE102011081426A1 Halbleitervorrichtung Semiconductor device
03/22/2012DE102011053519A1 Elektronisches Bauelement Electronic component
03/22/2012DE102010046257A1 Method for manufacturing LED chip mounted on circuit board, involves providing carrier with adhesive surface, applying molding material on adhesive film, and cutting molding material between semiconductor chips
03/22/2012DE102010041114A1 Leuchtvorrichtung Lighting device
03/22/2012DE102007006447B4 Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls An electronic module and method for manufacturing the electronic module
03/22/2012DE102005036116B4 Leistungshalbleitermodul The power semiconductor module
03/21/2012EP2432038A1 Light emitting diode package structure
03/21/2012EP2432014A1 Semiconductor device
03/21/2012EP2430670A1 Tandem photovoltaic cell and method using three glass substrate configuration
03/21/2012EP2430656A1 System-in packages
03/21/2012CN202172359U 一种新型mosfmt模块 A new mosfmt module
03/21/2012CN202172090U Led封装构造 Led package structure
03/21/2012CN202172068U LED (light-emitting diode) packaging piece connected through bonded filamentary silver coated with palladium layer on surface
03/21/2012CN202172067U 电子照明装置 Electrical lighting equipment
03/21/2012CN202172066U 一种igbt模块和双层铜排电连接结构 One kind igbt module and double copper electrical connection structure
03/21/2012CN202171158U 一种led柔性线光源 One kind of led flexible line source
03/21/2012CN1934720B Semiconductor light-emitting device and illuminating device
03/21/2012CN102388472A Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components
03/21/2012CN102386315A LED (Light Emitting Diode) module forming white light
03/21/2012CN102386311A Integrated light-emitting diode (LED) light source and manufacturing method thereof
03/21/2012CN102386309A Light emitting device
03/21/2012CN102386308A Light-emitting device and method for manufacturing light-emitting device
03/21/2012CN102386306A LED (light-lighting diode) chip packaging method and packaging structure
03/21/2012CN102386299A Light-emitting diode module for forming white light
03/21/2012CN102386298A Light-emitting diode (LED) module used for forming white light
03/21/2012CN102386265A Solar cell module
03/21/2012CN102386250A Photo sensor, method of manufacturing photo sensor, and display apparatus
03/21/2012CN102386180A Semiconductor integrated circuit
03/21/2012CN102386179A Light emitting apparatus and multi-surface pattern substrate
03/21/2012CN102386178A High-voltage-driving LED light-emitting device and manufacturing method thereof
03/21/2012CN102386177A Light-emitting diode (LED) lamp
03/21/2012CN102386176A 发光二极管封装件及其制造方法 A light emitting diode package and a manufacturing method
03/21/2012CN102386175A Light emitting device
03/21/2012CN102386174A LED (Light Emitting Diode) module for forming white light
03/21/2012CN102386173A Edge connect wafer level stacking microelectronic package and manufacturing method thereof
03/21/2012CN102386172A 半导体集成电路 The semiconductor integrated circuit
03/21/2012CN102386171A Multi-chip packaging structure
03/21/2012CN102386170A 场效应晶体管器件 A field effect transistor device
03/21/2012CN102386159A Power system with a flexible connection device
03/21/2012CN102386113A Semiconductor device and method of manufacturing same
03/21/2012CN102384405A LED light source unit for backlight of liquid crystal display, and liquid crystal display
03/21/2012CN102064164B Freely combined lamp wick of flip-chip power LED tube core
03/21/2012CN101924099B Light-emitting diode device
03/21/2012CN101908521B Semiconductor device and method of manufacturing the same
03/21/2012CN101853842B Package structure for chip and method for forming the same
03/21/2012CN101814486B LED and LED lamp
03/21/2012CN101711434B Led lighting device
03/21/2012CN101587886B Electronic device package and fabrication method thereof
03/21/2012CN101529590B Semiconductor electronic component and semiconductor device using the same
03/21/2012CN101443907B Assembly, chip and method of operating
03/20/2012US8138797 Integrated circuits with asymmetric pass transistors
03/20/2012US8138796 Serial configuration interface
03/20/2012US8138792 Gate drive circuit, display substrate having the same, and method thereof
03/20/2012US8138594 Semiconductor device and manufacturing method of a semiconductor device
03/20/2012US8138000 Methods for forming semiconductor light emitting devices and submounts
03/15/2012WO2012034052A1 Semiconductor chip device with polymeric filler trench
03/15/2012WO2012034034A1 Semiconductor chip with redundant thru-silicon-vias
03/15/2012WO2012032012A1 Optoelectronic semiconductor component and method for producing it
03/15/2012WO2012031932A1 Method for producing an optoelectronic semiconductor component
03/15/2012WO2012031704A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module
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