H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2011
11/30/2011	CN101714541B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
11/30/2011	CN101685764B 系统级封装模块结构的制造方法 The method of manufacturing the modular structure of the system in package
11/30/2011	CN101626015B 封装结构及其形成、量产方法与芯片堆叠结构 Package structure and formation, production methods and chip stack structure
11/30/2011	CN101542726B 具有硅通孔和侧面焊盘的半导体芯片 A semiconductor chip having a silicon vias and side pads
11/30/2011	CN101452860B 多芯片堆叠结构及其制法 Multi-chip stack structure Jiqizhifa
11/29/2011	US8068346 Circuit board with high density power semiconductors
11/29/2011	US8067979 Semiconductor device and power supply device using the same
11/29/2011	US8067827 Stacked microelectronic device assemblies
11/29/2011	US8067824 Integrated circuit module package and assembly method thereof
11/29/2011	US8067268 Stacked integrated circuit package system and method for manufacturing thereof
11/29/2011	US8067251 Semiconductor device and a method of manufacturing the same
11/29/2011	US8065792 Method for packaging circuits
11/29/2011	CA2463981C Light-emitting or light-receiving semiconductor module, and method for manufacturing the same
11/24/2011	WO2011146350A1 Large-area flexible oled light source
11/24/2011	WO2011145294A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board
11/24/2011	WO2011145219A1 Power semiconductor module
11/24/2011	WO2011145159A1 Semiconductor device, and process for production thereof
11/24/2011	WO2011144226A1 Method for producing chip stacks, and a carrier for carrying out the method
11/24/2011	WO2011143934A1 Inductive loop formed by interconnecting through-silicon -via
11/24/2011	WO2011091963A3 Illumination device and sensor for checking valuable documents
11/24/2011	US20110287585 Semiconductor device including semiconductor elements mounted on base plate
11/24/2011	US20110287250 Adhesive sheet, semiconductor device, and process for producing semiconductor device
11/24/2011	US20110285459 Semiconductor device
11/24/2011	US20110285007 Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
11/24/2011	DE102011050406A1 Halbleitermoduleinrichtung und Antriebsvorrichtung, welche dieselbe aufweist A semiconductor device module and drive device, which has the same
11/24/2011	DE102011050405A1 Halbleitermoduleinrichtung und Antriebsvorrichtung, welche dieselbe aufweist A semiconductor device module and drive device, which has the same
11/24/2011	DE102011007624A1 Halbleitervorrichtung Semiconductor device
11/24/2011	DE102007044795B4 Elektronisches Modul mit einem Bauelementstapel Electronic module with a component stack
11/23/2011	EP2388818A2 Light emitting device package
11/23/2011	EP2388817A2 Press-pack module with power overlay interconnection
11/23/2011	EP2388816A1 Semiconductor sensor device, method of manufacturing semiconductor sensor device, package, method of manufacturing package, module, method of manufacturing module, and electronic device
11/23/2011	EP2388811A2 Carrier body for compnents or circuits
11/23/2011	EP1856727B1 Method of manufacturing a wafer assembly with junction-isolated vias
11/23/2011	EP1825511B1 Semiconductor switching module
11/23/2011	EP1776002B1 Composite electronic component and method for manufacturing the same
11/23/2011	EP1508157B1 High efficiency solid-state light source and methods of use and manufacture
11/23/2011	EP1088350B1 Lighting system
11/23/2011	CN202050364U Bridge rectifier
11/23/2011	CN202050352U IGBT (Insulated Gate Bipolar Transistor) power system
11/23/2011	CN202049994U White light LED packaging device applied to desk lamp
11/23/2011	CN202049955U Polycrystalline packaging structure using constant voltage power supply and used for increasing magnitude of current
11/23/2011	CN202049954U Light-emitting module
11/23/2011	CN202049953U LED and display screen
11/23/2011	CN202049952U LED and display screen
11/23/2011	CN202049951U Transparent fluorescent ceramic integrated high-power LED light source
11/23/2011	CN202049950U Integrated LED light source with liquid metal for conducting heat
11/23/2011	CN202049949U Three-phase arc-shaped semi-bridge rectifier module
11/23/2011	CN1909367B Ceramic packaging piece for crystal oscillator and its preparation method
11/23/2011	CN1790691B Semiconductor device
11/23/2011	CN1542990B LED device and portable telephone, digital camera and LCD apparatus using the same
11/23/2011	CN102257644A Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component
11/23/2011	CN102255479A Bridge rectifier for intelligent servo transformer
11/23/2011	CN102255036A Light-Emitting Diode (LED) package structure of high-power substrate
11/23/2011	CN102255035A Multi-LED chip packaging structure on substrate
11/23/2011	CN102255029A Light-emitting chip packaging unit and forming method thereof
11/23/2011	CN102255021A Light-emitting device
11/23/2011	CN102255012A Manufacturing method and structure of high-voltage direct-current light-emitting diode chip
11/23/2011	CN102255011A Manufacturing method and structure of high-voltage direct current (DC) light-emitting diode (LED) chip
11/23/2011	CN102254910A Light emitting device package
11/23/2011	CN102254909A Light emitting device package
11/23/2011	CN102254908A Molded power-supply module with bridge inductor over other components
11/23/2011	CN102254907A LED (light-emitting diode) and packaging method thereof
11/23/2011	CN102254906A Led array
11/23/2011	CN102254905A 半导体发光装置 Semiconductor light emitting device
11/23/2011	CN102254904A Light emitting device and illumination device
11/23/2011	CN102254903A Light emitting diode package, light emitting diode module, and light emitting diode lamp
11/23/2011	CN102254902A IGBT (Insulated Gate Bipolar Translator) power half-bridge module
11/23/2011	CN102254895A Semiconductor device, semiconductor unit, and power semiconductor device
11/23/2011	CN102254892A Thin high-power semiconductor module
11/23/2011	CN102254890A Stacked semiconductor package and method for manufacturing the same
11/23/2011	CN102254886A Lead bonding-free IGBT (Insulated Gate Bipolar Translator) module
11/23/2011	CN102254881A 半导体装置 Semiconductor device
11/23/2011	CN102254877A Power module without metal baseplate
11/23/2011	CN102252219A Light-emitting diode (LED) street lamp and high-power LED device
11/23/2011	CN102252210A Illumination apparatus employing light-emitting device package
11/23/2011	CN101783380B Method for manufacturing light emitting diode package and package structure thereof
11/23/2011	CN101673802B Integrated metal matrix aluminium nitride film substrate, high-power LED module of heat pipe and manufacturing method thereof
11/23/2011	CN101373719B Manufacturing method of semiconductor device having relay board
11/23/2011	CN101322231B High density three dimensional semiconductor die package
11/23/2011	CN101150098B 半导体器件 Semiconductor devices
11/23/2011	CN101136397B Electronic part module and method of making the same
11/22/2011	US8064222 Semiconductor integrated circuit device
11/22/2011	US8064213 Module with a built-in component, and electronic device with the same
11/22/2011	US8063661 Semiconductor device having circuit blocks with mutually the same circuit configuration
11/22/2011	US8063657 Systems and devices for quantum processor architectures
11/22/2011	US8063493 Semiconductor device assemblies and packages
11/22/2011	US8063426 Fast switching power insulated gate semiconductor device
11/22/2011	US8063417 Integrated circuit device and method for forming the same
11/17/2011	WO2011143266A2 Electrical feedthrough assembly
11/17/2011	WO2011141232A1 Document and method for producing a document
11/17/2011	WO2011140940A1 Led encapsulation structure with simple structure
11/17/2011	WO2011097302A3 Semiconductor electronic components and circuits
11/17/2011	WO2010104610A8 Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads
11/17/2011	US20110278637 Light emitting device and fabrication method thereof and light emitting system using the same
11/17/2011	DE102010020749A1 Electronic device e.g. direct current (DC)-DC converter has silicon chip with metal film directly connected to electronic component that is connected to solder ball and connection elements, to serve as carrier for electronic component
11/17/2011	DE102006006424B4 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method
11/17/2011	DE102005055713B4 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements
11/16/2011	EP2387074A2 Carrier body for components or circuits
11/16/2011	EP2387073A2 Carrier body for components or circuits
11/16/2011	EP2387072A2 Carrier body for components or circuits

1 ... 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 ... 409