| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/04/2012 | CN102306647A LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer |
| 01/04/2012 | CN101964341B Light-emitting structure with a plurality of backup welding pads for improving lead welding success rate and manufacture method thereof |
| 01/04/2012 | CN101859755B Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) package body and package method thereof |
| 01/04/2012 | CN101764127B Semiconductor package without outer pins and stacked structure thereof |
| 01/04/2012 | CN101764073B Manufacturing process for a quad flat non-leaded chip package structure |
| 01/04/2012 | CN101752275B Packaging method and packaging structure of light emitting diode (LED) module |
| 01/04/2012 | CN101728374B Dual panel type organic electroluminescent display device and method of fabricating the same |
| 01/04/2012 | CN101651106B Manufacturing method of stacked chip package structure |
| 01/04/2012 | CN101630675B High pressure and high power series thyristor self-cold and hot pipe radiator unit and method therefor |
| 01/04/2012 | CN101594730B Circuit board with conductive structure |
| 01/04/2012 | CN101477954B LED chip encapsulation method and construction having high efficient lateral direction light emission effect |
| 01/04/2012 | CN101325195B Semiconductor light emitting apparatus |
| 01/04/2012 | CN101226976B LED device and locating structure thereof |
| 01/04/2012 | CN101114640B Semiconductor device |
| 01/03/2012 | US8089301 Inverter and logic device comprising the same |
| 01/03/2012 | US8089142 Methods and apparatus for a stacked-die interposer |
| 01/03/2012 | CA2539419C Pv wind performance enhancing methods and apparatus |
| 12/29/2011 | WO2011161717A1 Electronic device and method for manufacturing electronic device |
| 12/29/2011 | WO2011161337A1 Chip elements mounted on wires having an incipient breaking point |
| 12/29/2011 | WO2011161336A1 Inclusion of chip elements in a sheathed wire |
| 12/29/2011 | WO2011161183A1 Optoelectronic semi-conductor component |
| 12/29/2011 | WO2011160968A1 Optoelectronic semiconductor component |
| 12/29/2011 | WO2011160897A1 Encapsulated control module for a motor vehicle |
| 12/29/2011 | WO2011160321A1 Data storage device |
| 12/29/2011 | WO2011160311A1 Memory device |
| 12/29/2011 | US20110317387 Integrated Voltage Regulator with Embedded Passive Device(s) for a Stacked IC |
| 12/29/2011 | US20110316164 Corrugated die edge for stacked die semiconductor package |
| 12/29/2011 | US20110316158 Method and system for thin multi chip stack package with film on wire and copper wire |
| 12/29/2011 | DE102010054761A1 Abgedichtete elektronische Steuereinrichtung und Verfahren zum Herstellen derselben Sealed electronic control device and method for manufacturing the same |
| 12/29/2011 | DE102010025315A1 Elektronisches Bauelement Electronic component |
| 12/29/2011 | DE102009024369B4 Leistungselektronisches System Power Electronic System |
| 12/29/2011 | DE102006021959B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation |
| 12/28/2011 | EP2400568A2 Light emitting device package including several lenses and lighting system |
| 12/28/2011 | EP2400566A1 Semiconductor light emitting device, lighting module, lighting apparatus |
| 12/28/2011 | CN202094121U 一种存储模块 A memory module |
| 12/28/2011 | CN202094120U 智能发光数码管 Intelligent LED digital tube |
| 12/28/2011 | CN202094119U 凸杯结构led光源模组封装结构 Convex structure led cup light module package structure |
| 12/28/2011 | CN202094118U 一种用于照明的led光模组和led芯片 Led light module and led chip for lighting |
| 12/28/2011 | CN202094117U High-current high-voltage high-frequency high-performance IGBT (insulated gate bipolar transistor) module |
| 12/28/2011 | CN202093756U LED (light-emitting diode) display |
| 12/28/2011 | CN1985371B 包含集成电路的电子器件 Integrated circuits containing electronic devices |
| 12/28/2011 | CN102299244A 大功率led无缝异型光源 Shaped seamless power led light |
| 12/28/2011 | CN102299238A 发光装置和使用该发光装置的led照明器具 Light-emitting device and use led lighting fixtures that light-emitting device |
| 12/28/2011 | CN102299232A 发光二极管及光源模组 Light-emitting diodes and light module |
| 12/28/2011 | CN102299231A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method |
| 12/28/2011 | CN102299168A 功率用半导体装置 Power semiconductor device |
| 12/28/2011 | CN102299148A 资料储存装置 Data storage device |
| 12/28/2011 | CN102299147A Solid-state imaging device and electronic apparatus |
| 12/28/2011 | CN102299146A 一种提高光效柔化光照的led封装结构 A light effect softens the lighting led package structure to improve |
| 12/28/2011 | CN102299145A 一种直插式多芯片led灯珠 One kind of in-line multi-chip led lamp beads |
| 12/28/2011 | CN102299144A 分立igbt模组和基板 Igbt discrete modules and substrates |
| 12/28/2011 | CN102299143A 半导体元件 Semiconductor device |
| 12/28/2011 | CN102297351A LED (light emitting diode) light source module and manufacturing method thereof |
| 12/28/2011 | CN101881419B 一种使用具有透明基材的光学器件的led光源 A method of using a transparent substrate having an optical device led light |
| 12/28/2011 | CN101740528B 增进散热的无外引脚式半导体封装构造及其组合 Enhance heat dissipation without external pin type semiconductor package and combinations |
| 12/28/2011 | CN101691910B Led封装模块及其制备方法 Led package module and its preparation method |
| 12/28/2011 | CN101546753B 发电、led照明双用聚光太阳电池组件 Power generation, led lighting double concentrator solar modules with |
| 12/28/2011 | CN101483169B 用于封装芯片的承载带及其芯片封装结构 Carrier tape and chip packaging structure for packaging chips |
| 12/28/2011 | CN101232778B 印刷布线板 A printed circuit board |
| 12/27/2011 | US8086922 Programmable logic device with differential communications support |
| 12/27/2011 | US8084866 Microelectronic devices and methods for filling vias in microelectronic devices |
| 12/27/2011 | US8084852 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 12/27/2011 | US8084774 Light emitting device having light emitting elements |
| 12/27/2011 | US8084739 Imaging apparatus and methods |
| 12/22/2011 | WO2011158803A1 Semiconductor integrated circuit device inspection method and semiconductor integrated circuit device |
| 12/22/2011 | WO2011158698A1 Process for production of semiconductor device, and semiconductor device |
| 12/22/2011 | WO2011158429A1 Converter module and method for manufacturing same |
| 12/22/2011 | US20110309881 Three-dimensional semiconductor integrated circuit |
| 12/22/2011 | US20110309509 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same |
| 12/22/2011 | US20110309499 Method of manufacturing devices |
| 12/22/2011 | US20110309406 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| 12/22/2011 | US20110309357 Measuring apparatus |
| 12/22/2011 | DE102011077769A1 Spannungsspitzenschutz für Leistungs-DMOS-Vorrichtungen Transient protection for power DMOS devices |
| 12/22/2011 | DE102010023956A1 Lichtquelle Light source |
| 12/22/2011 | DE102008057833B4 Leistungshalbleitermodul mit Steuerfunktionalität und integriertem Übertrager Power semiconductor module with control functionality and integrated transformer |
| 12/21/2011 | EP2398074A1 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 12/21/2011 | EP2398051A2 LED package structure |
| 12/21/2011 | EP2398006A2 Image Display Device and Organic Light-Emitting Display Including Image Shift Unit |
| 12/21/2011 | EP2397875A2 Uniform illumination system |
| 12/21/2011 | EP2397749A2 Light-emitting device and lighting apparatus |
| 12/21/2011 | EP2397746A2 Light-emitting module and illumination device |
| 12/21/2011 | EP1098368B1 Module component and method of manufacturing the same |
| 12/21/2011 | CN202084545U Led集成模块 Led Integration Module |
| 12/21/2011 | CN202084544U 方块式桥堆 Box type bridge rectifiers |
| 12/21/2011 | CN202084543U 直列式小型桥堆 Small-line bridge rectifiers |
| 12/21/2011 | CN202084542U 贴片直列式小型桥堆 SMD-line small bridge rectifiers |
| 12/21/2011 | CN202084541U 电焊机整流组件 Welding rectifier module |
| 12/21/2011 | CN202084540U Surface-mount type power transistor module |
| 12/21/2011 | CN202084539U 一种单颗高压二极管的替代电路 One kind of single high voltage diodes alternative circuit |
| 12/21/2011 | CN202084538U 变色二极管 Color diode |
| 12/21/2011 | CN1855476B 半导体装置 Semiconductor device |
| 12/21/2011 | CN1848423B 半导体装置和电路装置 The semiconductor device and the circuit means |
| 12/21/2011 | CN102291034A 电力转换装置 Power conversion means |
| 12/21/2011 | CN102291003A 一种用于三相桥式驱动的智能功率模块 A three-phase bridge driver for intelligent power module |
| 12/21/2011 | CN102290524A 一种led器件及其led模组器件 One kind of device and led module led Devices |
| 12/21/2011 | CN102290516A 发光模块以及照明装置 The light emitting module and a lighting device |
| 12/21/2011 | CN102290504A 基于高导热基板倒装焊技术的cob封装led模块和生产方法 Based on the high thermal conductivity of the substrate flip chip packaging technology cob led module and production methods |
| 12/21/2011 | CN102290500A 发光装置及其制造方法 A light emitting device and manufacturing method thereof |
| 12/21/2011 | CN102290495A 一种卧式光控晶闸管阀组的压装方法及晶闸管阀组 One kind of horizontal light control thyristor valve solderless method and thyristor valve |
| 12/21/2011 | CN102290411A 一种抗光干扰红外线接收模组及其制造方法 An anti-light interference infrared receiver module and manufacturing method |