| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/21/2011 | WO2011086613A1 Semiconductor device and method for fabricating same |
| 07/21/2011 | WO2011086611A1 Semiconductor device and method for manufacturing same |
| 07/21/2011 | WO2011086176A1 Illumination device |
| 07/21/2011 | US20110175863 Data line driver and apparatuses having the same |
| 07/21/2011 | US20110175219 Method for modular arrangement of a silicon based array and modular silicon based array |
| 07/21/2011 | US20110175216 Integrated void fill for through silicon via |
| 07/21/2011 | DE10333329B4 Leistungshalbleitermodul mit biegesteifer Grundplatte Power semiconductor module, rigid base plate |
| 07/21/2011 | DE102011002795A1 Signalübertragungsanordnung, Verfahren zu dessen Herstellung und Spannungswandler Signal transmission arrangement, process for its preparation and voltage transformer |
| 07/21/2011 | DE102010056484A1 Licht emittierende Vorrichtung Light emitting device |
| 07/21/2011 | DE102010005047A1 Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung Arrangement with at least one power semiconductor module and with a transport packaging |
| 07/21/2011 | DE102010002570A1 LED-lighting device e.g. infrared LED lighting device, manufacturing method, involves performing selection of optic element such that luminosity and/or coordinate is approximated to value, and placing selected element behind light source |
| 07/21/2011 | DE102010000908A1 Power semiconductor module has external terminal guards that are screwed on regions of terminal tabs, so that external terminal guards are made to press contact the spring elements |
| 07/20/2011 | EP2346309A2 Light emitting module, backlight unit, and display apparatus |
| 07/20/2011 | EP2346100A2 Light emitting apparatus and lighting system |
| 07/20/2011 | EP2345078A1 Lighting device using solid state light emitting devices having a transparent heat sink |
| 07/20/2011 | EP1774372B1 Textured transparent film having pyramidal patterns that can be associated with photovoltaic cells |
| 07/20/2011 | CN201904372U Bottom connection-type integrated power LED with heat dissipation effect |
| 07/20/2011 | CN201904368U LED (light emitting diode) surface-mounting package structure based on silicon substrate integrated with functional circuit |
| 07/20/2011 | CN201904337U Luminescent device with integrated circuit |
| 07/20/2011 | CN201904336U LED die set |
| 07/20/2011 | CN201904335U Liquid-packaged high-power LED device |
| 07/20/2011 | CN201904334U LED module |
| 07/20/2011 | CN201904333U Ceramic substrate integrated package power LED light source |
| 07/20/2011 | CN201904332U Power module applied to boost converter |
| 07/20/2011 | CN201904331U Module for power device sets |
| 07/20/2011 | CN1763982B Light source with a light-emitting element |
| 07/20/2011 | CN102132424A Solid state lighting component |
| 07/20/2011 | CN102132409A Semiconductor device and method of manufacturing same |
| 07/20/2011 | CN102132401A Method for integrating heat transfer members, and led device |
| 07/20/2011 | CN102132376A Adhesive injection device |
| 07/20/2011 | CN102130510A Signal transmission arrangement |
| 07/20/2011 | CN102130269A Solid-state luminous element and light source module |
| 07/20/2011 | CN102130268A Solid-state light-emitting component and light source module |
| 07/20/2011 | CN102130266A Packaging structure and light emitting diode packaging structure |
| 07/20/2011 | CN102130261A Semiconductor light-emitting element with protection layer |
| 07/20/2011 | CN102130257A Light emitting device, light emitting device package, and lighting system |
| 07/20/2011 | CN102130247A Light emitting diode chip and package incorporating the same |
| 07/20/2011 | CN102130236A Packaging method of LED (light-emitting diode) chip and packaging device |
| 07/20/2011 | CN102130235A Method and device for packaging LED chip |
| 07/20/2011 | CN102130227A Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens |
| 07/20/2011 | CN102130226A Light emitting device and method of manufacture |
| 07/20/2011 | CN102130225A Packaging method for improving light efficiency of integrated LED light source |
| 07/20/2011 | CN102130197A Light-reflecting low-resistance crystalline silicon solar cell assembly and connection welding belt thereof |
| 07/20/2011 | CN102130196A Low-resistance crystalline silicon solar cell component |
| 07/20/2011 | CN102130116A Power module applied to booster convertor |
| 07/20/2011 | CN102130115A White LED (light emitting diode) planar light source device |
| 07/20/2011 | CN102130114A Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device |
| 07/20/2011 | CN102130113A Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 07/20/2011 | CN102130112A LED (light-emitting diode) support, LED lamp with support and packaging method |
| 07/20/2011 | CN102130111A Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
| 07/20/2011 | CN102130110A Multi-chipset high-power LED encapsulation structure |
| 07/20/2011 | CN102130109A Light emitting device and light unit using the same |
| 07/20/2011 | CN102130108A Transparent ceramic packaged light emitting diode (LED) light source |
| 07/20/2011 | CN102130107A Step array high-voltage light-emitting diode and preparation method thereof |
| 07/20/2011 | CN102130106A Solar cell capable of simultaneously performing photoelectric conversion and thermoelectric conversion |
| 07/20/2011 | CN102130105A Light emitting device and light unit using the same |
| 07/20/2011 | CN102130104A Light emitting device and method of manufacture |
| 07/20/2011 | CN102130103A External storage device and method of manufacturing external storage device |
| 07/20/2011 | CN102130102A Electronic device and method of producing the same |
| 07/20/2011 | CN102130101A Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area |
| 07/20/2011 | CN102130100A Package |
| 07/20/2011 | CN102130099A Package |
| 07/20/2011 | CN102130098A Double-tube-core semiconductor package |
| 07/20/2011 | CN102130097A Semiconductor element |
| 07/20/2011 | CN102130084A Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 07/20/2011 | CN102130082A Power semiconductor module |
| 07/20/2011 | CN102130078A Heat-conducting insulated composite film and chip stacking structures |
| 07/20/2011 | CN102130070A Power electronics substrate for direct substrate cooling |
| 07/20/2011 | CN102130025A Wafer, processing method thereof and method for manufacturing semiconductor device |
| 07/20/2011 | CN102130022A Method of forming a semiconductor die |
| 07/20/2011 | CN102130021A Silicon carbide power module and packaging method thereof |
| 07/20/2011 | CN102129966A Methods of forming a thermal conduction region in a semiconductor structure and structures resulting therefrom |
| 07/20/2011 | CN102129820A Light-emitting diode device and display |
| 07/20/2011 | CN102125469A Toothbrush with severable electrical connections |
| 07/20/2011 | CN101777504B System level packaging method of flip chip and attached passive element on support plate chip |
| 07/20/2011 | CN101675520B Semiconductor module for electric power |
| 07/20/2011 | CN101640194B Semiconductor device and method of designing the same |
| 07/20/2011 | CN101567367B Semiconductor device |
| 07/20/2011 | CN101359657B Multi-die dc-dc boost power converter with efficient packaging |
| 07/20/2011 | CN101211903B RF module package structure and its forming method |
| 07/19/2011 | US7982497 Multiplexer-based interconnection network |
| 07/19/2011 | US7982384 Image display device and light emission device |
| 07/19/2011 | US7982317 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module |
| 07/19/2011 | US7982301 Semiconductor device |
| 07/19/2011 | US7982128 Method for regenerating photovoltaic module and photovoltaic module |
| 07/14/2011 | WO2011084362A2 Semiconductor chip device with solder diffusion protection |
| 07/14/2011 | WO2011084131A1 Saturated yellow phosphor converted led and blue converted red led |
| 07/14/2011 | WO2011083737A1 Unit for semiconductor device, and semiconductor device |
| 07/14/2011 | WO2011083722A1 Semiconductor device, solid-state imaging device, and camera system |
| 07/14/2011 | WO2011083578A1 Semiconductor module |
| 07/14/2011 | WO2011063166A3 Hybrid package construction with wire bond and through silicon vias |
| 07/14/2011 | US20110171780 Semiconductor device and manufacturing method thereof |
| 07/14/2011 | US20110169564 Integrated Circuit |
| 07/14/2011 | US20110169548 Data latch circuit, driving method of the data latch circuit, and display device |
| 07/14/2011 | DE102010000758A1 Method for manufacturing LED module with multiple LEDs in e.g. automotive engineering taillight, involves cutting freely thin sheet arrangement of carrier film along one outer contour of thin sheet arrangement in order to obtain LED module |
| 07/14/2011 | DE102010000035A1 Electronic assembly i.e. lamp, has electronic power elements soldered or welded with contacting surface at surface element, and connections soldered on or welded at assigned conductive strips or strip ends of printed circuit board |
| 07/13/2011 | EP2343737A1 Image display unit and production method for image display unit |
| 07/13/2011 | EP2342747A2 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate |
| 07/13/2011 | EP2342712A1 Mass data storage system with non-volatile memory modules |
| 07/13/2011 | EP1514459B1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |