| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/31/2011 | CN101653056B Elecric device-installed apparatus and its noise reduction method |
| 08/31/2011 | CN101308841B Semiconductor light emitting diode |
| 08/30/2011 | USRE42658 Gate driver multi-chip module |
| 08/30/2011 | US8009847 Hat with music player |
| 08/30/2011 | US8008897 Boost converter with integrated high power discrete FET and low voltage controller |
| 08/30/2011 | US8008699 Semiconductor device with circuit for reduced parasitic inductance |
| 08/30/2011 | US8008677 Light emitting device and fabrication method thereof and light emitting system using the same |
| 08/30/2011 | US8008129 Method of making semiconductor device packaged by sealing resin member |
| 08/30/2011 | US8008126 Castellation wafer level packaging of integrated circuit chips |
| 08/26/2011 | DE202008018068U1 Leuchtelement mit Kunststoffhalterung Lamp unit with plastic holder |
| 08/25/2011 | WO2011102101A1 Stacked semiconductor device |
| 08/25/2011 | WO2011102100A1 Semiconductor device and stacked-type semiconductor device |
| 08/25/2011 | WO2011101257A1 Light-emitting means and method for producing same |
| 08/25/2011 | WO2011101170A1 Method and assembly for producing a semiconductor module |
| 08/25/2011 | US20110204968 Demodulation circuit and rfid tag including the demodulation circuit |
| 08/25/2011 | US20110204505 Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier |
| 08/25/2011 | US20110204500 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same |
| 08/25/2011 | US20110204499 Semiconductor device assemblies |
| 08/25/2011 | DE102011004480A1 Stromsensoren und Verfahren Current sensors and methods |
| 08/25/2011 | DE102010047646A1 Harz versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben A resin sealed electronic control apparatus and method for producing same |
| 08/25/2011 | DE102010031009A1 Leistungsmodulanordnung mit versetzten Kühlkanälen Power module assembly with offset cooling channels |
| 08/25/2011 | DE102010008876A1 Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz Light source array LEDs for direct operation on AC power |
| 08/25/2011 | DE102010008603A1 Elektrisches Widerstandselement Electrical resistance element |
| 08/25/2011 | DE102010002227A1 Schutz von LEDs gegen Überhitzung und zu hohem Durchgangsstrom Protection of LEDs from overheating and excessive through current |
| 08/25/2011 | DE102007061598B4 Trägeraufbau für einen Leistungsbaustein mit einer Bodenplatte und Verfahren zu dessen Herstellung Support structure for a power module having a base plate and process for its preparation |
| 08/25/2011 | DE102007046451B4 Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung A device for detection of thermal radiation with high resolution, methods of making and using the apparatus |
| 08/24/2011 | EP2361005A1 Circuit module |
| 08/24/2011 | EP2360417A2 Light-emitting device and illumination device |
| 08/24/2011 | CN201946625U High power light-emitting diode (LED) |
| 08/24/2011 | CN201946598U 一种led发光晶元芯片封装结构 A light-emitting Epistar led chip package |
| 08/24/2011 | CN201946597U 带有红色led芯片的基于金属平板散热的led装置 Based on the flat metal plate cooling device with a red led led chip |
| 08/24/2011 | CN201946596U 一种具有热能与电能分离式散热的led光源封装结构 Led light package structure having a separate heat and cooling energy |
| 08/24/2011 | CN201946595U 一种整体封装式led A monolithic packaged led |
| 08/24/2011 | CN201946594U 一种阵列式led模组 One kind of led module array |
| 08/24/2011 | CN201946593U 一种组合式led器件 A modular led Devices |
| 08/24/2011 | CN201946592U 白光led封装结构 White led package structure |
| 08/24/2011 | CN201946591U 一种双晶led封装结构 A dual crystal led package structure |
| 08/24/2011 | CN201944602U Multi-functional lighting light-emitting diode (LED) fluorescent lamp |
| 08/24/2011 | CN102165589A Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package |
| 08/24/2011 | CN102165588A Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components and method for the production thereof |
| 08/24/2011 | CN102165502A Optoelectronic component |
| 08/24/2011 | CN102164258A Circuit-substrate laminated module and electronic apparatus |
| 08/24/2011 | CN102163928A Special ultrahigh-power rectification power electronic device module for ultrasonic welding machine |
| 08/24/2011 | CN102163677A Package system |
| 08/24/2011 | CN102163671A Optical semiconductor device and manufacture method thereof, optical semiconductor module |
| 08/24/2011 | CN102163670A Light emitting device, light emitting device package, and lighting system |
| 08/24/2011 | CN102163663A Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof |
| 08/24/2011 | CN102163656A Method for preparing light emitting diode (LED) packaging module |
| 08/24/2011 | CN102163655A Preparation method of LED (light-emitting diode) packaging module |
| 08/24/2011 | CN102163640A Ultraviolet light sensing display device |
| 08/24/2011 | CN102163603A Packaging structure for system level fan-out wafer |
| 08/24/2011 | CN102163602A Light-emitting device and lighting apparatus provided with the same |
| 08/24/2011 | CN102163601A LED (light emitting diode) packaging module |
| 08/24/2011 | CN102163600A LED (light emitting diode) packaging module |
| 08/24/2011 | CN102163599A Light emitting diode (LED) encapsulation module |
| 08/24/2011 | CN102163598A LED (light emitting diode) packaging module |
| 08/24/2011 | CN102163597A Diode series-parallel connection protection component for solar cell array |
| 08/24/2011 | CN102163596A Integrated circuit device and its forming method |
| 08/24/2011 | CN102163595A 堆叠半导体封装 Stacked semiconductor package |
| 08/24/2011 | CN102163594A Resin-sealed electronic control device and method of fabricating the same |
| 08/24/2011 | CN102163581A Semiconductor module |
| 08/24/2011 | CN102163578A Semiconductor device, chip-on-chip mounting structure, method of manufacturing the semiconductor device, and method of forming the chip-on-chip mounting structure |
| 08/24/2011 | CN102163560A Wireless communication device for remote authenticity verification of semiconductor chips, multi-chip modules and derivative products |
| 08/24/2011 | CN102162591A Novel LED (light-emitting diode) luminous device and method thereof for emitting white light |
| 08/24/2011 | CN101728379B Organic light-emitting diode display device and its manufacture method |
| 08/24/2011 | CN101587867B Substrate for insulated gate bipolar type transistor module |
| 08/24/2011 | CN101399259B Circuit device and method of manufacturing the same |
| 08/23/2011 | US8004869 Memory circuit arrangement and method for the production thereof |
| 08/23/2011 | US8003895 Electronic parts packaging structure and method of manufacturing the same |
| 08/23/2011 | US8003438 Circuit module and manufacturing method thereof |
| 08/18/2011 | WO2011100351A1 Semiconductor die package structure |
| 08/18/2011 | WO2011099356A1 Package component |
| 08/18/2011 | WO2011098342A1 Substrate for a lighting module and lighting module |
| 08/18/2011 | WO2011075265A3 Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 08/18/2011 | US20110201178 Semiconductor device and process for fabricating the same |
| 08/18/2011 | US20110198735 Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly |
| 08/18/2011 | DE102010001893A1 Substrat für ein Leuchtmodul und Leuchtmodul Substrate for a light module and light module |
| 08/17/2011 | EP2357668A1 Package for housing a semiconductor element and semiconductor device using the same |
| 08/17/2011 | EP2356894A1 Power converter module having a cooled busbar |
| 08/17/2011 | EP1636842B1 Stackable semiconductor device and method of manufacturing the same |
| 08/17/2011 | DE202009018419U1 LED-Modul mit verbesserter Lichtleistung LED module with improved light output |
| 08/17/2011 | CN201937484U Ultrathin surface-mount bridge rectifier |
| 08/17/2011 | CN201936882U 一种led光源的封装结构 A packaged structure of the light source led |
| 08/17/2011 | CN201936881U 一种led灯 One kind of led lights |
| 08/17/2011 | CN201936880U 太阳电池阵列用二极管串并联保护组件 Solar arrays in parallel with the diode string protection components |
| 08/17/2011 | CN201936879U Chip stacking and packaging structure without outer pin |
| 08/17/2011 | CN201936614U Double-rate synchronous dynamic random access memory DDR (double-data-rate) device with piling packaging structure |
| 08/17/2011 | CN201935736U 双通道热释电红外传感器 Dual pyroelectric infrared sensor |
| 08/17/2011 | CN1873973B Envelope for luminous elements of semiconductor in large power |
| 08/17/2011 | CN102160177A Method for manufacturing semiconductor device |
| 08/17/2011 | CN102160176A Solar panel |
| 08/17/2011 | CN102159876A Colour mixing method for consistent colour quality |
| 08/17/2011 | CN102158275A Photoreceiving device |
| 08/17/2011 | CN102158175A Power amplifier tube and power amplifying method |
| 08/17/2011 | CN102158077A Semiconductor device and power source device |
| 08/17/2011 | CN102157671A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 08/17/2011 | CN102157630A Single-substrate multi-chipset high-power LED (Light-Emitting Diode) encapsulation one-step bonding method |
| 08/17/2011 | CN102157512A Chip package and manufacturing method thereof |
| 08/17/2011 | CN102157511A Optocoupler devices |
| 08/17/2011 | CN102157510A Contact sensor packaging structure and manufacture method thereof |