| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/14/2011 | CN101467252B 半导体装置 Semiconductor device |
| 09/14/2011 | CN101361182B Interposer with built-in passive part |
| 09/14/2011 | CN101253627B Circuit device and method for manufacturing same |
| 09/14/2011 | CN101211906B Packaged chip structure |
| 09/13/2011 | US8018739 Apparatus for shielding integrated circuit devices |
| 09/13/2011 | US8017862 Solar-cell single-crystal silicon substrate, solar cell element, and method for producing the same |
| 09/13/2011 | US8017444 Adhesive sheet, semiconductor device, and process for producing semiconductor device |
| 09/09/2011 | WO2011109595A1 Dummy tsv to improve process uniformity and heat dissipation |
| 09/09/2011 | WO2011109044A1 Multi-chip integrated circuit |
| 09/09/2011 | WO2011108327A1 Method for producing reconstituted wafers and method for producing semiconductor devices |
| 09/09/2011 | WO2011108051A1 Semiconductor device |
| 09/09/2011 | WO2011107612A1 Customizable interconnections between electronic circuits |
| 09/09/2011 | WO2011078404A3 Hybrid circuit |
| 09/08/2011 | US20110215863 Integrated Voltage Regulator with Embedded Passive Device(s) |
| 09/08/2011 | US20110215476 Method for fabricating circuit component |
| 09/08/2011 | US20110215471 Package On Package |
| 09/08/2011 | US20110215464 Semiconductor package with embedded die and its methods of fabrication |
| 09/08/2011 | US20110215453 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods |
| 09/08/2011 | US20110215451 Stacked Semiconductor Packages |
| 09/08/2011 | US20110215449 Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package |
| 09/08/2011 | US20110215443 Multichip semiconductor device, chip therefor and method of formation thereof |
| 09/08/2011 | DE102010002627A1 Niederinduktive Leistungshalbleiterbaugruppe The low-power semiconductor module |
| 09/08/2011 | DE102009042434A1 Leuchtvorrichtung, Lampe mit der Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung Lighting device, lamp with the lighting device and method of manufacturing a light emitting device |
| 09/07/2011 | EP2363884A1 Lighting unit and display device having the same |
| 09/07/2011 | CN201966241U LED chip and LED wafer |
| 09/07/2011 | CN201966210U 一种白光led封装结构 One kind of white led package |
| 09/07/2011 | CN201966209U Polycrystal packing structure of mixed light type |
| 09/07/2011 | CN201966208U Led封装模块 Led package module |
| 09/07/2011 | CN1823561B Packaging of semiconductor devices for incrased reliability |
| 09/07/2011 | CN1691342B 半导体器件 Semiconductor devices |
| 09/07/2011 | CN102177467A Lighting device |
| 09/07/2011 | CN102176452A High-density chip system-in-package structure |
| 09/07/2011 | CN102176451A LED packaging base |
| 09/07/2011 | CN102176450A High-density system in package (SIP) structure |
| 09/07/2011 | CN102176449A High-density system-in-package structure |
| 09/07/2011 | CN102176448A Fan-out system-in-package structure |
| 09/07/2011 | CN102176447A Three-dimensional high-density system in package (SIP) structure |
| 09/07/2011 | CN102176446A Three-dimensional high-integration level system-in-package structure |
| 09/07/2011 | CN102176445A Fan-out high-density packaging structure |
| 09/07/2011 | CN102176444A High integration level system in package (SIP) structure |
| 09/07/2011 | CN102176439A Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 09/07/2011 | CN102176432A Photodetector with digital three-dimensional package assembly |
| 09/07/2011 | CN101771031B Photoelectric element-packaging structure with electrostatic protection function |
| 09/07/2011 | CN101692446B Organic electro-stimulation luminous element encapsulation and encapsulating method thereof |
| 09/07/2011 | CN101690424B Electronic module and method for producing an electronic module |
| 09/07/2011 | CN101615610B Organic light emitting diode display and method of manufacturing the same |
| 09/07/2011 | CN101546760B Inverse parallel double diode |
| 09/07/2011 | CN101494219B High-power LED aluminum substrate integrated module |
| 09/07/2011 | CN101467505B Electronic component module |
| 09/07/2011 | CN101452922B Light emitting unit |
| 09/07/2011 | CN101330080B High on-stage voltage right-handed LED integrated chip and manufacturing method thereof |
| 09/06/2011 | US8015419 Method and apparatus for soft start power gating with automatic voltage level detection |
| 09/06/2011 | US8013430 Semiconductor device including DC-DC converter |
| 09/06/2011 | US8012803 Vertically stacked pre-packaged integrated circuit chips |
| 09/02/2011 | DE202011000722U1 Dreifarben-LED-Modulstruktur Three-color LED module structure |
| 09/01/2011 | WO2011106346A1 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-d packaged integrated circuits |
| 09/01/2011 | WO2011105961A1 Method of stacking chips |
| 09/01/2011 | WO2011105242A1 Semiconductor device and method for manufacturing same |
| 09/01/2011 | WO2011104996A1 Thermosetting resin composition, b-stage thermally conductive sheet, and power module |
| 09/01/2011 | WO2011104777A1 Semiconductor device and production method thereof |
| 09/01/2011 | WO2011104774A1 Semiconductor device |
| 09/01/2011 | WO2011103752A1 Led lamp |
| 09/01/2011 | WO2011084362A3 Semiconductor chip device with solder diffusion protection |
| 09/01/2011 | US20110210436 Integrated circuit packaging system with encapsulation and method of manufacture thereof |
| 09/01/2011 | US20110210251 Infrared solid-state imaging device |
| 09/01/2011 | DE102011000120A1 Elektronische lichtemittierende Anordnung und Verfahren zu ihrer Herstellung Electronic light emitting device and method for their preparation |
| 09/01/2011 | DE102010009718A1 Verfahren zur Gruppierung oder Kennzeichnung von Lumineszenzdiodenbauelementen und Lumineszenzdiodenbauelement A method for grouping or labeling of Lumineszenzdiodenbauelementen and Lumineszenzdiodenbauelement |
| 09/01/2011 | DE102010000951A1 Power semiconductor module for use on printed circuit board, has planar, structured metallization arranged on insulating substrate, where metallization has connected portion, and bonding wire bonded at bonding areas at connected portion |
| 08/31/2011 | EP2362416A2 Multi-die module and method thereof |
| 08/31/2011 | EP2361439A2 Ultra-thin chip packaging |
| 08/31/2011 | EP1979945B1 Light emission device with chromatic control |
| 08/31/2011 | CN201957336U 高散热性电路载板及相关的发光模组 High heat load circuit boards and related LED modules |
| 08/31/2011 | CN201956917U 低热阻gbu整流全桥 Low thermal resistance gbu full bridge rectifier |
| 08/31/2011 | CN201956886U Electrical layout structure of modular high-power low-voltage inverter unit |
| 08/31/2011 | CN201956351U 全彩led封装结构 Full color led package |
| 08/31/2011 | CN201956350U Led模组 Led Module |
| 08/31/2011 | CN201956349U 分离式全彩贴片发光二极管 Separate full-color SMD LEDs |
| 08/31/2011 | CN201956348U 一种高光量led反射杯 Led a high-amount of light reflected Cup |
| 08/31/2011 | CN201956347U 大功率led Power led |
| 08/31/2011 | CN201956346U 瞬变电压抑制二极管和肖特基二极管组合的晶体管 Transient voltage suppression diodes and Schottky diode combination of transistors |
| 08/31/2011 | CN201956345U GPP (glass passivation pellet) high-voltage diode |
| 08/31/2011 | CN201955603U 用于投影机的led模组 Led module for projectors |
| 08/31/2011 | CN102171825A Power module and encapsulation and integration method thereof |
| 08/31/2011 | CN102171824A Electrostatic discharge (ESD) shielding for stacked ICs |
| 08/31/2011 | CN102169941A Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus |
| 08/31/2011 | CN102169939A Light emitting device, light emitting device package, and lighting system |
| 08/31/2011 | CN102169938A Light emitting device, light emitting device package and lighting system |
| 08/31/2011 | CN102169937A Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system |
| 08/31/2011 | CN102169934A Semiconductor light emitting device having multi-cell array and method for manufacturing the same |
| 08/31/2011 | CN102169933A Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus |
| 08/31/2011 | CN102169879A Highly integrated wafer fan-out packaging structure |
| 08/31/2011 | CN102169878A Spliced light emitting diode module |
| 08/31/2011 | CN102169877A Circuit module, electronic device including the same, and circuit module manufacturing method |
| 08/31/2011 | CN102169876A Resin-sealed electronic control device and method of fabricating the same |
| 08/31/2011 | CN102169875A Semiconductor device and producing method thereof |
| 08/31/2011 | CN102169874A Semiconductor integrated circuit |
| 08/31/2011 | CN102169873A Semiconductor packing structure applied to power switcher circuit |
| 08/31/2011 | CN102169843A Method for manufacturing optical device, optical device, and biological information detector |
| 08/31/2011 | CN102169842A Techniques and configurations for recessed semiconductor substrates |
| 08/31/2011 | CN102169841A Recessed semiconductor substrate and associated technique |