| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/05/2011 | DE20122946U1 Lichtquelle mit einem lichtemittierenden Element Light source with a light emitting element |
| 08/04/2011 | WO2011093373A1 Complex and semiconductor device using the same, semiconductor module and method for fabricating the same |
| 08/04/2011 | WO2011092859A1 Method for manufacturing semiconductor device and semiconductor device |
| 08/04/2011 | WO2011092781A1 Semiconductor device and manufacturing method therefor |
| 08/04/2011 | WO2011092072A1 Illumination device |
| 08/04/2011 | US20110187450 Output circuit of semiconductor apparatus having two different types of decoupling capacitors |
| 08/04/2011 | US20110186977 Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint |
| 08/04/2011 | DE102011003307A1 Halbleiterleistungsmodul, Inverter/Konverter mit demselben und Verfahren zur Herstellung eines Kühlmantels für das Halbleiterleistungsmodul The semiconductor power module, the inverter / converter with the same and method of manufacturing a cooling jacket for the semiconductor power module |
| 08/04/2011 | DE102011000374A1 Waterproof structure for semiconductor package installed in car generator, has radiation element that is arranged opposite to surface area of heat sink with power element and provided with projection fitted into recess of heat sink |
| 08/04/2011 | DE102010018260A1 Beleuchtungsvorrichtung Lighting device |
| 08/04/2011 | DE102010017518A1 Halbleitermodul und Motorvorrichtung mit integriertem elektronischen Schaltkreis mit demselben Semiconductor module and motor assembly with integrated electronic circuit with the same |
| 08/04/2011 | DE102009001522A1 Halbleiteranordnung mit Kondensator A semiconductor device with capacitor |
| 08/03/2011 | EP2351112A1 Multi-chip light emitting diode modules |
| 08/03/2011 | EP2351079A1 Radiation-emitting semiconductor chip |
| 08/03/2011 | EP2350520A1 Array layout for color mixing |
| 08/03/2011 | EP1815534B1 Composite LED modules |
| 08/03/2011 | EP1573816B1 Method of preparing electrically connected optoelectronic devices |
| 08/03/2011 | CN201918910U 双层叠片式贴片型整流全桥 Double laminated patch full bridge rectifier |
| 08/03/2011 | CN201918399U Photovoltaic system |
| 08/03/2011 | CN201918398U Photovoltaic system and mounting device thereof |
| 08/03/2011 | CN201918385U 一种大功率GaN基发光二极管 One kind of high-power GaN-based light emitting diode |
| 08/03/2011 | CN102142510A Solid light source based on optical wavelength conversion and application of solid light source |
| 08/03/2011 | CN102142507A LED package |
| 08/03/2011 | CN102142490A Method for gluing LED module |
| 08/03/2011 | CN102142471A Solar Module array |
| 08/03/2011 | CN102142433A Transistor combining transient voltage suppressor diode with schottky diode |
| 08/03/2011 | CN102142432A Focal plane assembly capable of realizing same viewing field splicing |
| 08/03/2011 | CN102142431A Integrated device and manufacturing method of integrated device |
| 08/03/2011 | CN102142417A Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same |
| 08/03/2011 | CN102142416A Device mounting board, semiconductor module and portable apparatus |
| 08/03/2011 | CN102142415A Integrated circuit package with embedded components |
| 08/03/2011 | CN102142409A Non-direct bond copper isolated lateral wide band gap semiconductor device |
| 08/03/2011 | CN102142406A Pressure-contacted high performance semiconductor module with hybrid pressure accumulator |
| 08/03/2011 | CN102142404A Semiconductor device and communication method |
| 08/03/2011 | CN102142401A Laminate electronic device |
| 08/03/2011 | CN102142379A Substrate for electronic device, laminated body for electronic device, electronic device, and manufacturing method thereof |
| 08/03/2011 | CN102140690A Photoluminescent wafer as well as preparation method and application thereof |
| 08/03/2011 | CN101431319B Electronic component |
| 08/03/2011 | CN101431069B Power semiconductor module with temperature sensor |
| 08/03/2011 | CN101286500B Semiconductor module and mobile apparatus |
| 08/03/2011 | CN101071809B Power semiconductor device |
| 08/03/2011 | CN101027948B Electronics module and method for manufacturing the same |
| 08/02/2011 | US7992118 Semiconductor integrated circuit and design method for semiconductor integrated circuit |
| 08/02/2011 | US7989940 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures |
| 08/02/2011 | US7989839 Method and apparatus for using light emitting diodes |
| 08/02/2011 | CA2537777C Light receiving or emitting modular sheet and production method thereof |
| 07/28/2011 | WO2011089677A1 Manufacturing method for semiconductor device |
| 07/28/2011 | WO2011089664A1 Film for forming semiconductor protection film, and semiconductor device |
| 07/28/2011 | US20110183442 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate |
| 07/28/2011 | US20110181351 Application Specific Power Controller |
| 07/28/2011 | US20110181350 High frequency semiconductor device |
| 07/28/2011 | US20110180927 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 07/28/2011 | US20110180918 Arrangement Comprising at Least One Power Semiconductor Module and a Transport Packaging |
| 07/28/2011 | US20110180913 Method of stacking flip-chip on wire-bonded chip |
| 07/28/2011 | DE112009000666T5 Verfahren zum Herstellen eines Elektronikkomponentenmoduls A method of manufacturing an electronic component module |
| 07/28/2011 | DE102011008457A1 Siliziumplättchen-Stapelpaket auf Waferebene Silicon wafer stack package at the wafer level |
| 07/28/2011 | DE102011003205A1 Halbleitervorrichtungsmodul Semiconductor device module |
| 07/28/2011 | DE102008042772B4 Verfahren zum elektrischen Verbinden eines LED-Feldes und LED-Verbindungsvorrichtung A method for electrically connecting a LED array and LED connecting device |
| 07/28/2011 | DE102005016439B4 Halbleiterbauelementpackung und Herstellungsverfahren Semiconductor device package and manufacturing method |
| 07/28/2011 | DE102004025659B4 Optoelektrisches Übertragungsmodul und Verfahren zu dessen Herstellung An opto-electrical transmission module and process for its preparation |
| 07/27/2011 | EP2348526A2 Substrate for electronic device, stack for electronic device, electronic device, and method for manufacturing the same |
| 07/27/2011 | EP2348525A1 Wiring forming method |
| 07/27/2011 | EP2347442A1 Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips |
| 07/27/2011 | EP2347441A1 Electrostatic discharge (esd) shielding for stacked ics |
| 07/27/2011 | EP2156468B1 Semiconductor device having multiple die redistribution layer |
| 07/27/2011 | EP1297572B1 Led lamp |
| 07/27/2011 | CN201910430U Solar cell component |
| 07/27/2011 | CN201910422U 5050LED (light-emitting diode) bracket and LED light source prepared by same |
| 07/27/2011 | CN201910421U Planar structure for LED (light-emitting diode) device |
| 07/27/2011 | CN201910420U Microelectronic unit and system |
| 07/27/2011 | CN201910207U High-density full-color LED (light-emitting diode) display plate |
| 07/27/2011 | CN201909675U Novel double-channel pyroeletric infrared sensor |
| 07/27/2011 | CN102136527A Preparation method of warm white diode and diode thereof |
| 07/27/2011 | CN102136508A 太阳能电池模块 The solar cell module |
| 07/27/2011 | CN102136472A Semiconductor apparatus mould |
| 07/27/2011 | CN102136471A LED (light emitting diode) element of large display screen |
| 07/27/2011 | CN102136470A Power type LED (light emitting diode) light source with low thermal resistance and high color rendering index |
| 07/27/2011 | CN102136469A Power semiconductor module and method for operating a power semiconductor module |
| 07/27/2011 | CN102136468A Thyristor valve section and crimping method thereof |
| 07/27/2011 | CN102136467A Stacked package of semiconductor device |
| 07/27/2011 | CN102136466A Electrostatic discharge test structure and system of gate-driven MOSFET (metal oxide semiconductor field effect transistor) |
| 07/27/2011 | CN102136464A Packaging structure and lead frame thereof |
| 07/27/2011 | CN102136460A Thermal matching in semiconductor devices using heat distribution structures |
| 07/27/2011 | CN102136457A Semiconductor device and method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation |
| 07/27/2011 | CN102136434A Method of stacking flip-chip on wire-bonded chip |
| 07/27/2011 | CN102136431A Light emitting diode package and manufacturing method thereof |
| 07/27/2011 | CN102136430A Semiconductor encapsulating structure and manufacturing method thereof |
| 07/27/2011 | CN102136292A Memory card and memory system including semiconductor chips in stacked structure |
| 07/27/2011 | CN101667620B White light-emitting diode (LED) |
| 07/27/2011 | CN101667545B Multi-chip stacked structure and manufacturing method thereof |
| 07/27/2011 | CN101604687B Semiconductor light emitting device |
| 07/27/2011 | CN101599517B Light emitting diode (LED) packaging structure with electrostatic protection function and manufacturing method thereof |
| 07/27/2011 | CN101246861B Package board |
| 07/27/2011 | CN101226928B Stack type chip packaging structure and manufacturing method thereof |
| 07/27/2011 | CN101005729B Interconnect assembly, transducer assembly and forming method and imaging system |
| 07/26/2011 | US7986015 Semiconductor device with STI and method for manufacturing the semiconductor device |
| 07/21/2011 | WO2011087798A1 Package assembly having a semiconductor substrate |
| 07/21/2011 | WO2011087003A1 Three-dimensional packaging method and device |
| 07/21/2011 | WO2011086896A1 Power semiconductor module |
| 07/21/2011 | WO2011086705A1 Power semiconductor module, power conversion device, and rail car |