H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2011
10/19/2011	CN102222756A Packaging structure for light emitting diode light source
10/19/2011	CN102222754A LED (light-emitting diode) chip packaging structure and packaging method thereof
10/19/2011	CN102222753A LED (Light Emitting Diode) chip packaging structure and packaging method thereof
10/19/2011	CN102222749A Light emitting component and module thereof
10/19/2011	CN102222746A Light emitting device, light emitting device package and illumination system
10/19/2011	CN102222741A Light emitting device and light emitting device package
10/19/2011	CN102222737A LED (Light Emitting Diode) encapsulating body and encapsulating method thereof
10/19/2011	CN102222736A Method for packaging double-side-luminous semiconductor luminous tube
10/19/2011	CN102222667A LED (light-emitting diode) light source module and packaging process thereof
10/19/2011	CN102222666A White light LED (Light Emitting Diode) base plate and packaging method thereof
10/19/2011	CN102222665A Integrated LED (light emitting diode) module with thin fly's-eye lens
10/19/2011	CN102222664A High-current high-voltage high-frequency high-performance IGBT (Insulated Gate Bipolar Transistor) module
10/19/2011	CN102222663A Stack package having flexible conductors
10/19/2011	CN101656250B Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
10/19/2011	CN101558492B Integrated circuit with signal bus formed by cell abutment of logic cells
10/19/2011	CN101024481B Micro electro mechanical system, semiconductor device, and manufacturing method thereof
10/18/2011	US8041759 Specialized processing block for programmable logic device
10/18/2011	US8039953 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
10/18/2011	US8039852 Thin film transistor for a liquid crystal device in which a sealing pattern is electrically connected to a common electrode wiring
10/18/2011	US8039730 System and method for prevention of open loop damage during or immediately after manufacturing
10/13/2011	WO2011126547A2 Photovoltaic window assembly with solar control properties
10/13/2011	WO2011125784A1 Electric vehicle control device
10/13/2011	WO2011125780A1 Power module and power conversion device provided with said power module
10/13/2011	WO2011124393A1 Luminaire with optical plate
10/13/2011	WO2011124191A1 Power converter
10/13/2011	US20110248410 Stack packages using reconstituted wafers
10/13/2011	US20110248400 Semiconductor device and method of manufacturing the same
10/13/2011	US20110248397 Semiconductor device having stacked components
10/13/2011	US20110248396 Bow-balanced 3d chip stacking
10/13/2011	US20110248391 Integrated circuit package stacking system with lead overlap and method of manufacture thereof
10/13/2011	DE102010014611A1 Shining module for lamp, has current feed terminals and current dissipation terminals that are arranged facing each other
10/12/2011	EP2375444A1 Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system
10/12/2011	EP2374151A1 Parallel plane memory and processor coupling in a 3-d micro-architectural system
10/12/2011	EP1525621B1 Method of operating a trench gate semiconductor device
10/12/2011	CN202009341U High-voltage high-power inverter module
10/12/2011	CN202009039U Novel LED illuminator
10/12/2011	CN202008999U Power MOS bridge-type circuit
10/12/2011	CN202008998U High-power optical coupling isolated drive module
10/12/2011	CN202008997U Light emitting device
10/12/2011	CN202008996U PCB arrangement layout structure with single high-voltage diode replacing circuit
10/12/2011	CN102217066A Parallel plane memory and processor coupling in a 3-d micro-architectural system
10/12/2011	CN102217065A Optoelectronic component
10/12/2011	CN102214776A Light emitting diode package, lighting device and light emitting diode package substrate
10/12/2011	CN102214775A Substrate for mounting light-emitting element and light-emitting device employing the substrate
10/12/2011	CN102214771A Lead-frame-type multi-chip bearing module for precast mold molding
10/12/2011	CN102214766A Encapsulating structure for light-emitting diode
10/12/2011	CN102214762A LED (light-emitting diode) chip and packaging structure thereof
10/12/2011	CN102214760A Light emitting device and light emitting device package
10/12/2011	CN102214759A Light emitting diode, light emitting diode package, and lighting system
10/12/2011	CN102214758A Light emitting device, method for fabricating the light emitting device, and light emitting device package
10/12/2011	CN102214757A Light emitting device, light emitting device package, and lighting system
10/12/2011	CN102214756A Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
10/12/2011	CN102214653A Packaging structure of high-power LED (light-emitting diode) chip
10/12/2011	CN102214652A LED (light emitting diode) packaging structure and preparation method thereof
10/12/2011	CN102214651A LED (light emitting diode) pixel unit device structure and preparation method thereof
10/12/2011	CN102214650A Light emitting diode (LED) pixel unit device structure and preparation method thereof
10/12/2011	CN102214649A LED (light-emitting diode) packaging structure and manufacturing method thereof
10/12/2011	CN102214648A Light emitting device package and lighting system
10/12/2011	CN102214647A Surface mount device thin package
10/12/2011	CN102214646A Onboard roughening structure
10/12/2011	CN102214645A Multi-layer array type light emitting diode
10/12/2011	CN102214644A Power semiconductor device and power conversion system using the device
10/12/2011	CN102214643A Semiconductor device and storage card
10/12/2011	CN102214642A Combined type high-power semiconductor chip
10/12/2011	CN102214641A Wafer-level semiconductor device packages with stacking functionality
10/12/2011	CN102214634A Aluminium bracket for packing infrared receiver
10/12/2011	CN102214629A Semiconductor device and storage card
10/12/2011	CN102214626A Built-in type semiconductor package and manufacturing method thereof
10/12/2011	CN102214622A 功率半导体模块 Power semiconductor module
10/12/2011	CN102214621A Semiconductor device package and method of manufacturing same
10/12/2011	CN102214619A Light emitting device module
10/12/2011	CN102214615A Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
10/12/2011	CN101728280B Encapsulation structure of light-emitting diode and preparation method thereof
10/12/2011	CN101667571B Sensing module
10/12/2011	CN101290920B 半导体装置 Semiconductor device
10/11/2011	US8035974 Integrated circuit package support system
10/11/2011	US8035234 Wiring substrate, manufacturing method thereof, and semiconductor device
10/11/2011	US8035117 Multi element, multi color solid state LED/laser
10/11/2011	US8034660 PoP precursor with interposer for top package bond pad pitch compensation
10/11/2011	US8034658 Electronic module with a conductive-pattern layer and a method of manufacturing same
10/11/2011	CA2393081C Enhanced light extraction in leds through the use of internal and external optical elements
10/06/2011	WO2011122228A1 Substrate with built-in semiconductor
10/06/2011	WO2011121779A1 Multichip module, printed wiring board unit, method for manufacturing multichip module, and method for manufacturing printed wiring board unit
10/06/2011	WO2011121725A1 Electronic device and electronic system
10/06/2011	WO2011120775A1 Optoelectronic semiconductor chip
10/06/2011	US20110244651 Method and device for alternately contacting two wafers
10/06/2011	US20110242714 Semiconductor integrated circuit device
10/06/2011	US20110241538 Image display device and light emission device
10/06/2011	US20110241206 Semiconductor device
10/06/2011	US20110241194 Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof
10/06/2011	US20110241192 Wafer-Level Semiconductor Device Packages with Stacking Functionality
10/06/2011	US20110241191 Semiconductor lamination package and method of producing semiconductor lamination package
10/06/2011	US20110241062 LED lamps
10/06/2011	DE102011006591A1 Optoelektronisches Transceivermodulsystem The optoelectronic transceiver module system
10/06/2011	DE102011001405A1 Halbleiter-Kapselung und Stapel von Halbleiterkapselungen Semiconductor encapsulation and stacks of semiconductor packages
10/06/2011	DE102010016216A1 Method for wire bonding wire bonding contact region on wire bonding structure of silicon carbide junction FET of e.g. semiconductor component in e.g. integrated power switching circuit, involves cleaning wire bonding contact region
10/05/2011	EP2372801A2 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages include the same
10/05/2011	EP2372765A1 Integrated lamp with feedback and wireless control
10/05/2011	EP2372764A2 Inter-chip distance in a multi-chip LED package
10/05/2011	EP2372763A2 Power semiconductor module

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