H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2011
12/08/2011	DE102010023548A1 Photovoltaic generator, has 2-wire field bus comprising two terminals through which data and electric power is transmitted to slaves from master, and data and electrical power transmitted to master from slaves
12/08/2011	DE102009017733B4 Leistungshalbleitermodul mit einer Verbindungseinrichtung und mit als Kontaktfeder ausgebildeten internen Anschlusselementen Power semiconductor module with a connection device and designed as a contact spring with internal connection elements
12/08/2011	DE102007058703B4 Lichtemittierende Vorrichtung mit hohem Farbwiedergabeindex A light emitting device having a high color rendering index
12/08/2011	DE102007058700B4 Lichtemittierende Vorrichtung mit hohem Farbwiedergabeindex A light emitting device having a high color rendering index
12/08/2011	DE102004014709B4 Halbleiteranordnung mit Abstrahlungsteilen A semiconductor device having radiating parts
12/07/2011	EP2393134A2 Encapsulating sheet for optical semiconductor
12/07/2011	EP2393114A2 Light emitting device package
12/07/2011	EP2392026A2 Method and apparatus for performing rlc modeling and extraction for three-dimensional integrated circuit (3d-ic) designs
12/07/2011	EP1352432B9 Light-emitting diode and method for the production thereof
12/07/2011	CN202067818U A-type module non-tracking trough-type condenser
12/07/2011	CN202067803U Solar battery slice and solar battery string
12/07/2011	CN202067790U 圆片级玻璃型腔的硅通孔led封装结构 Silicon vias led glass wafer level package cavity
12/07/2011	CN202067301U 双基板式存储卡封装构造 Dual memory card package substrate structure
12/07/2011	CN1959982B 半导体发光装置 Semiconductor light emitting device
12/07/2011	CN102272925A 用于制造照明用具的方法 Method for manufacturing lighting appliances
12/07/2011	CN102272923A 固态照明部件 Solid-state lighting components
12/07/2011	CN102272919A 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统 Semiconductor device and manufacturing method of the millimeter-wave dielectric transmission device and its manufacturing method, and a millimeter-wave dielectric transmission power in the system
12/07/2011	CN102272916A 具有熔丝型硅通孔的3d芯片叠层 3d chip stack has a fuse-type silicon vias
12/07/2011	CN102272904A 通过用于晶圆到晶圆结合的化学机械抛光工艺来形成沟道式电容器和通孔连接的方法 A method of forming a trench capacitor and a through hole for connection by a wafer-to-wafer bonding chemical mechanical polishing process of
12/07/2011	CN102270731A 具框架的模板，其制造方法及应用 Template with the framework, its manufacturing method and application
12/07/2011	CN102270730A 一种无金线的led器件 Kim led a non-line devices
12/07/2011	CN102270729A 一种白光led封装结构及封装方法 One kind of white led package structure and packaging method
12/07/2011	CN102270634A 一种cob模块化led点胶结构 One kind cob led dispensing modular structure
12/07/2011	CN102270633A 大功率倒装阵列led芯片及其制造方法 Power flip-chip arrays led its manufacturing method
12/07/2011	CN102270632A 高压发光二极管及其制造方法 A light emitting diode and method of manufacturing the high-pressure
12/07/2011	CN102270631A 发光装置 Light-emitting device
12/07/2011	CN102270630A 发光器件封装 Light emitting device package
12/07/2011	CN102270629A 发光器件封装及照明系统 Light emitting device package and a lighting system
12/07/2011	CN102270628A 光源模组 Light module
12/07/2011	CN102270627A 发光二极管封装结构 Light emitting diode package structure
12/07/2011	CN102270626A 多晶封装发光二极管 Polycrystalline package emitting diodes
12/07/2011	CN102270621A 包括多个管芯和引线取向的管芯封装 Includes a plurality of dies and the leads of the die package orientation
12/07/2011	CN102270615A 功率半导体装置 Power semiconductor device
12/07/2011	CN101894834B Bridge drive circuit chip
12/07/2011	CN101866892B 芯片的布局结构与方法 Chip layout structure and methods
12/07/2011	CN101789423B U盘结构及其封装方法 U disk structure and packaging method
12/07/2011	CN101501847B 半导体装置 Semiconductor device
12/07/2011	CN101494207B 半导体芯片及具有该半导体芯片的叠层半导体封装 The semiconductor chip and a semiconductor package having a laminate of the semiconductor chip
12/07/2011	CN101286492B 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
12/07/2011	CN101236946B 布线板和半导体器件 Wiring boards and semiconductor devices
12/07/2011	CN101211897B 多芯片半导体封装结构及封装方法 Multi-chip semiconductor package structure and encapsulation method
12/06/2011	US8072260 Configurable clock network for programmable logic device
12/06/2011	US8072237 Computer-aided design tools and memory element power supply circuitry for selectively overdriving circuit blocks
12/06/2011	US8072070 Low fabrication cost, fine pitch and high reliability solder bump
12/06/2011	US8071988 White light emitting device comprising a plurality of light emitting diodes with different peak emission wavelengths and a wavelength converter
12/06/2011	US8070311 Solar LED lamp
12/06/2011	DE202011106595U1 LED-Leuchtvorrichtung mit hoher Farbwiedergabe LED lighting device with high color rendering
12/06/2011	CA2459968C Power efficient led driver quiescent current limiting circuit configuration
12/01/2011	WO2011149017A1 Semiconductor module substrate and semiconductor module
12/01/2011	WO2011148628A1 Semiconductor-sealing epoxy resin composition and semiconductor device using same
12/01/2011	WO2011148627A1 Method for producing an esterified substance
12/01/2011	WO2011148445A1 Semiconductor device and process for production thereof
12/01/2011	WO2011147695A1 Stacked package structure for integrated circuits
12/01/2011	WO2011147124A1 Led street lamp and high power led device
12/01/2011	WO2011147063A1 Light-emitting device using ac
12/01/2011	WO2011126547A3 Photovoltaic window assembly with solar control properties
12/01/2011	US20110291275 Method of assembling chips
12/01/2011	US20110291265 Semiconductor integrated circuit having a multi-chip structure
12/01/2011	US20110291246 Semiconductor chip and semiconductor package with stack chip structure
12/01/2011	US20110290984 Integrated circuit array, and in particular a large-sized image sensor
12/01/2011	DE102011006445A1 Halbleitermodul und Verfahren zum Herstellen desselben The same semiconductor module and method of producing
12/01/2011	DE102010029526A1 Halbleiterbauelement mit einer gestapelten Chipkonfiguration mit einem integrierten Peltier-Element A semiconductor device comprising a stacked chip configuration with an integrated Peltier element
12/01/2011	DE102010029374A1 Power electronics arrangement for use in high-voltage onboard network architecture of fuel cell vehicle, has electrical terminals whose part is located on housing and on cables for attaching cables in common longitudinal extension
12/01/2011	DE102010029368A1 Elektronische Anordnung und Verfahren zum Herstellen einer elektronischen Anordnung An electronic device and method for manufacturing an electronic device
12/01/2011	DE102010029270A1 Halbleiterleuchtvorrichtung, Verfahren zum Herstellen eines Trägersubstrates und Verfahren zum Aufbringen eines Trägersubstrates auf einen Kühlkörper Semiconductor light-emitting device, method for producing a carrier substrate and method of applying a carrier substrate on a heatsink
12/01/2011	DE102010021819A1 Detektor-Modul Detector module
12/01/2011	DE102008054932B4 Leistungshalbleitermodul mit versteifter Bodenplatte Power semiconductor module with stiffened bottom plate
11/2011
11/30/2011	EP2390918A2 Light emitting device using AC and manufacturing method of the same
11/30/2011	EP2390917A2 Light emitting device and lighting apparatus
11/30/2011	EP2390916A2 Stacked light emitting devices and method of fabricating the same
11/30/2011	EP2390915A1 Light emitting device and light unit having the same
11/30/2011	EP2195843B1 Programmable rom using two bonded strata and method of operation
11/30/2011	EP1843402B1 Semiconductor lighting means and illumination panel comprising the same
11/30/2011	CN202058733U 闪烁式led封装的支架结构 Scaffold flashing type led package
11/30/2011	CN202058732U 一种芯片与荧光粉分离的大功率led白光面板 A chip with separate high power led white phosphor panel
11/30/2011	CN202058731U 可调变极性的发光二极管改良结构 Adjustable alternating polarity of light-emitting diode structure improvement
11/30/2011	CN202058730U 一种led高导热绝缘基座封装的器件 One kind of led high thermal insulation base package devices
11/30/2011	CN202058729U 高显色led模块 High color led module
11/30/2011	CN202058728U 芯片组合型半导体集成器件 Combined chip semiconductor integrated device
11/30/2011	CN202058727U Aluminum bracket for packaging infrared receiver
11/30/2011	CN202056572U 一种大角度照明的cobled封装模块 One kind of wide-angle lighting package module cobled
11/30/2011	CN102263098A 发光器件及具有该发光器件的光照单元 The light-emitting device and light emitting device having a unit
11/30/2011	CN102263097A 具有集成电路与发光二极管的异质整合结构及其制作方法 Integration of heterogeneous integrated circuit structure and method of making the light-emitting diodes
11/30/2011	CN102263096A Uv led固化组件 Uv led curing component
11/30/2011	CN102263095A 发光装置以及照明装置 The light emitting device and a lighting device
11/30/2011	CN102263094A 非互联型多芯片封装二极管 Non-interconnected multi-chip package diode
11/30/2011	CN102263093A 桥式器件的封装结构 Bridge device package
11/30/2011	CN102263092A 半导体模块及其制造方法 The semiconductor module and manufacturing method thereof
11/30/2011	CN102263091A 导线式桥接整流装置 Lead-in bridge rectifier
11/30/2011	CN102263090A 封装系统 Packaging system
11/30/2011	CN102263089A 具有多芯片结构的半导体集成电路 The semiconductor integrated circuit having a multi-chip structure
11/30/2011	CN102263088A 包含多个芯片的封装结构 The package structure comprises a plurality of chips
11/30/2011	CN102263087A 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
11/30/2011	CN102263086A 半导体封装结构 Semiconductor package structure
11/30/2011	CN102263085A 封装结构以及封装工艺 Package and packaging process
11/30/2011	CN102263078A 一种wlcsp封装件 One kind wlcsp package
11/30/2011	CN102263071A 半导体模块和使用半导体模块的电动设备 The semiconductor module and the electric device using a semiconductor module
11/30/2011	CN102263070A 一种基于基板封装的wlcsp封装件 A substrate-based package wlcsp package
11/30/2011	CN102263040A 半导体电子元件的封装方法 The semiconductor packaging method of an electronic device
11/30/2011	CN102261582A 提高输出色彩显色性的单一封装发光二极管光源 Increase the output of a single color color light-emitting diode package

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