| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/14/2012 | US8115093 Layer-to-layer interconnects for photoelectric devices and methods of fabricating the same |
| 02/14/2012 | US8114714 Electronic device and production method thereof |
| 02/14/2012 | US8114304 Method for producing electronic components |
| 02/14/2012 | US8113688 Configuration of multiple LED module |
| 02/09/2012 | WO2012018073A1 Power module and output circuit |
| 02/09/2012 | WO2012016850A1 Optoelectronic component |
| 02/09/2012 | US20120032735 Reducing coupling coefficient variation by using capacitors |
| 02/09/2012 | US20120032731 Charge pump doubler |
| 02/09/2012 | US20120032347 Chip scale package and fabrication method thereof |
| 02/09/2012 | US20120032318 Layered chip package and method of manufacturing same |
| 02/09/2012 | US20120032291 Stand-Alone Device |
| 02/09/2012 | DE102011080360A1 Halbleitervorrichtung, Halbleiterschaltungssubstrat und Verfahren zur Herstellung eines Halbleiterschaltungssubstrats A semiconductor device, semiconductor circuit substrate and method for fabricating a semiconductor circuit substrate |
| 02/09/2012 | DE102011002534A1 Chippaket umfassend eine Vielzahl von Chips und Leiterausrichtung Chip package comprising a plurality of chips and circuit alignment |
| 02/09/2012 | DE102010039057A1 Sensormodul Sensor module |
| 02/09/2012 | DE102010038879A1 Gleichrichteranordnung, welche Einpressdioden aufweist Rectifier assembly, which comprises insertion diodes |
| 02/09/2012 | DE102010033374A1 Einrichtung zur elektrischen Verbindung einer Leistungsbaugruppe mit Terminalflächenelementen Means for electrically connecting a power module with the terminal surface elements |
| 02/09/2012 | DE102008049726B4 Gestapelte Chipkonfiguration mit stromgespeistem Wärmeübertragungssystem und Verfahren zum Steuern der Temperatur in einem Halbleiterbauelement Stacked chip configuration with stromgespeistem heat transfer system and method for controlling the temperature in a semiconductor device |
| 02/09/2012 | DE102007013737B4 Verfahren zur Herstellung eines Substrats mit Substratkern für eine elektronische Baugruppe A method for producing a substrate with substrate core for an electronic assembly |
| 02/09/2012 | DE102005056872B4 Mehrchipmodul mit Leistungssystem und Durchgangslöchern Multi-chip module with a power system and through holes |
| 02/08/2012 | EP2416388A2 Light emitting device and image display unit |
| 02/08/2012 | EP2416359A2 Warm white light led lamp with high luminance and high color rendering index |
| 02/08/2012 | EP2415086A1 Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components |
| 02/08/2012 | EP1932178B1 High brightness light emitting diode device |
| 02/08/2012 | EP1275153B2 Carrier substrate for electronic components |
| 02/08/2012 | EP1157420B1 Light extractor apparatus |
| 02/08/2012 | CN202142532U 一种有效抑制浪涌电压的igbt模块 A potent inhibitor of the surge voltage igbt module |
| 02/08/2012 | CN202142531U 一种基于金属基pcb板的led模组 A metal base pcb board led module-based |
| 02/08/2012 | CN202142530U 一种基于陶瓷基pcb板的led模组 A ceramic matrix pcb board led module based |
| 02/08/2012 | CN202142529U 多晶粒led元件总成 Multi-grain led element assembly |
| 02/08/2012 | CN202142528U Light emission device displayer |
| 02/08/2012 | CN202142527U Emitter package |
| 02/08/2012 | CN202142526U 一种密集型中功率led封装模组 One kind of intensive modules in power led package |
| 02/08/2012 | CN202142525U Novel power module without base plate |
| 02/08/2012 | CN102349363A Power semiconductor module having layered insulating side walls |
| 02/08/2012 | CN102349169A LED module for modified lamps and modified LED lamp |
| 02/08/2012 | CN102349168A Led module with improved light output |
| 02/08/2012 | CN102347436A LED (Light-emitting Diode) device and wafer-level LED device as well as packaging structure of LED device and wafer-level LED device |
| 02/08/2012 | CN102347325A Integrated light-emitting device and manufacturing device thereof |
| 02/08/2012 | CN102347324A Novel LED (light-emitting diode) integrated packaging structure |
| 02/08/2012 | CN102347323A Color-temperature-tunable device |
| 02/08/2012 | CN102347322A Light-emitting element, backlight module device and illuminating device |
| 02/08/2012 | CN102347321A Sub-module and power semiconductor module |
| 02/08/2012 | CN102347320A 装置及其制造方法 Apparatus and manufacturing method thereof |
| 02/08/2012 | CN102347319A Package-on-package structures with reduced bump bridging |
| 02/08/2012 | CN102347318A All-piezoelectric abreast pushing three-friction-force stepper and scanning probe microscope body |
| 02/08/2012 | CN102347317A 半导体装置 Semiconductor device |
| 02/08/2012 | CN102347316A Three-dimensional integrated circuit structure |
| 02/08/2012 | CN102347283A Microelectronic elements having metallic pads overlying vias |
| 02/08/2012 | CN102347253A Semiconductor device and method of forming rdl over contact pad |
| 02/08/2012 | CN102347243A Semiconductor device and method for manufacturing the same |
| 02/08/2012 | CN102347239A Light-emitting diode assembly and packaging method thereof |
| 02/08/2012 | CN101859752B 具有内嵌式芯片及硅导通孔晶粒之堆栈封装结构及其制造方法 The embedded chip package structure having a silicon vias and the stack and the manufacturing method of the grain |
| 02/08/2012 | CN101656218B 用于生产照相机模块的方法以及相应的基底 Method for producing a camera module and the corresponding base |
| 02/08/2012 | CN101604684B 导线架的内引脚具有金属焊盘的交错堆叠式芯片封装结构 Staggered stacked chip package within the structure of a metal pin leadframe pad |
| 02/07/2012 | US8111970 Electromagnetic radiation frequency optimizing device and method with ambient heat conversion device |
| 02/07/2012 | US8111086 Methods and systems for selective implementation of progressive display techniques |
| 02/07/2012 | US8111034 Solar-powered charger with heat-dissipating surface |
| 02/07/2012 | US8110440 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure |
| 02/07/2012 | US8110427 Stacked-layered thin film solar cell and manufacturing method thereof |
| 02/02/2012 | WO2012014843A1 Power semiconductor unit, power module, production method for power semiconductor unit and production method for power module |
| 02/02/2012 | WO2012014842A1 Power converter |
| 02/02/2012 | WO2012014527A1 High-frequency module and communications device |
| 02/02/2012 | WO2012013822A1 Optoelectronic device and method for producing it |
| 02/02/2012 | WO2012013435A1 Light-emitting semiconductor component and method for manufacturing a light-emitting semiconductor component |
| 02/02/2012 | WO2011143266A3 Electrical feedthrough assembly |
| 02/02/2012 | US20120025905 Multiple circuit blocks with interblock control and power conservation |
| 02/02/2012 | US20120025365 Microelectronic packages with nanoparticle joining |
| 02/02/2012 | US20120025080 Color correction circuitry and methods for dual-band imaging systems |
| 02/02/2012 | US20120024963 Semiconductor device and method for manufacturing the same |
| 02/02/2012 | DE10342295B4 Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung Arrangement of an electrical component with an electrical insulation film on a substrate and method of manufacturing the arrangement |
| 02/02/2012 | DE102011079747A1 Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür Semiconductor device having a switch element and freewheeling diode, and control method therefor |
| 02/02/2012 | DE102010032834A1 Optoelektronische Vorrichtung und Verfahren zu deren Herstellung Optoelectronic device and process for their preparation |
| 02/02/2012 | DE102010032813A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
| 02/02/2012 | DE102007022428B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 02/01/2012 | EP2413392A2 Light-emitting diode package |
| 02/01/2012 | EP2413360A2 Multi-element LED lamp package |
| 02/01/2012 | EP2413359A2 Light emitting diode substrate, method of making the same and light source employing the same |
| 02/01/2012 | EP2413358A1 LED lamp with multiple color temperatures |
| 02/01/2012 | EP2413357A2 Power semiconductor module with at least one positioning means for a substrate |
| 02/01/2012 | EP2413356A1 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
| 02/01/2012 | EP2413355A1 An interconnect that eliminates routing congestion and manages simultaneous transactions |
| 02/01/2012 | EP2413354A1 Sub-module and power semiconductor module |
| 02/01/2012 | EP2412022A1 Optoelectronic semiconductor component and display device |
| 02/01/2012 | EP2412021A1 Light diode |
| 02/01/2012 | EP1425832B1 Method of manufacturing optical devices and related improvements |
| 02/01/2012 | EP1234339B1 Optical semiconductor housing and method for making same |
| 02/01/2012 | DE202010017509U1 Lichtemittierende Vorrichtung und Beleuchtungssystem A light emitting device and lighting system |
| 02/01/2012 | CN202135044U 智能变频复合功率模块 Intelligent Power Module Frequency complex |
| 02/01/2012 | CN202134535U Led集成封装光源模块 Led light module integrated package |
| 02/01/2012 | CN202134534U 导电性引线框和发光器件封装体 Conductive leadframe and light emitting device package |
| 02/01/2012 | CN202134533U 智能伺服变压器用桥堆 Intelligent servo transformer bridge rectifiers |
| 02/01/2012 | CN202134532U 一种功率缓冲二极管 A power snubber diode |
| 02/01/2012 | CN202132735U 一种带驱动芯片的led光源 A belt drive led light chip |
| 02/01/2012 | CN102339941A Light emitting diode packaging structure and light emitting diode module |
| 02/01/2012 | CN102339823A Photoelectric module and light-emitting method |
| 02/01/2012 | CN102339822A Structure for packaging light-emitting diodes (LEDs) |
| 02/01/2012 | CN102339821A High-power straw-hat-shaped integrated packaging light-emitting diode (LED) light source structure for automobile headlight |
| 02/01/2012 | CN102339820A Integrated encapsulated LED (light-emitting diode) lamp bulb |
| 02/01/2012 | CN102339819A Light-emitting diode package structure and method for forming same |
| 02/01/2012 | CN102339818A 功率模块 Power Modules |