Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2012
03/15/2012WO2012031703A1 Coating method for an optoelectronic chip-on-board module
03/15/2012WO2012031385A1 Warm white light led chip with high brightness and high color rendering
03/15/2012US20120064697 Method for packaging circuits
03/15/2012US20120062315 Pll circuit and semiconductor device having the same
03/15/2012US20120062314 Semiconductor integrated circuit and system of controlling the same
03/15/2012US20120061804 Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices
03/15/2012DE102011053360A1 Verfahren und system zum bereitstellen eines zuverlässigen leuchtdioden-halbleiterbauelements Method and system for providing a reliable light-emitting semiconductor component
03/15/2012DE102010045054A1 Beleuchtungsvorrichtung Lighting device
03/15/2012DE102010044987A1 Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung An optoelectronic semiconductor device and process for its preparation
03/15/2012DE102007014363B4 Halbleitermodul und Verfahren zu dessen Herstellung Semiconductor module and method for its production
03/15/2012DE102004041883B4 Halbleitervorrichtung Semiconductor device
03/14/2012EP2428991A2 Light Emitting Component with integrated control
03/14/2012EP2427922A1 Re-emitting semiconductor construction with enhanced extraction efficiency
03/14/2012EP2427912A1 Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
03/14/2012EP2427909A1 Panelized backside processing for thin semiconductors
03/14/2012EP2427905A1 Discontinuous thin semiconductor wafer surface features
03/14/2012EP1715523B1 Transparent LED head-up display
03/14/2012EP1663058B1 Illuminated electric toothbrushes
03/14/2012CN202168004U 一种大功率mosfet逆变半桥器件 One kind of half-bridge inverter power mosfet devices
03/14/2012CN202167995U 一种用于三相桥式驱动的智能功率模块 A three-phase bridge driver for intelligent power module
03/14/2012CN202167490U 分体式igbt晶体管与控制板的插接式安装结构 Split igbt transistors and plug-in control panel mounting structure
03/14/2012CN202167489U 大功率led的cob矩阵封装结构 Cob power led matrix package
03/14/2012CN202167488U 全彩led显示屏的打线结构 Wire structure full color led display
03/14/2012CN202167487U 2rgb型led显示屏封装结构 2rgb type package structure led display
03/14/2012CN202167486U 一种大功率led发光模组 One kind of led light module power
03/14/2012CN202167485U Secondary packaging piece of semiconductor light-emitting diode
03/14/2012CN202167484U 一种5050led支架及led光源 One kind 5050led bracket and led light
03/14/2012CN202167483U Igbt功率半桥模块 Igbt power half-bridge module
03/14/2012CN202165891U Led面光源 Led surface light source
03/14/2012CN102379038A Electronic device mounting structure and electronic device mounting method
03/14/2012CN102379037A Integrated circuit chip using top post-passivation technology and bottom structure technology
03/14/2012CN102376865A Light emitting diode
03/14/2012CN102376854A Light emitting device and lighting system having the same
03/14/2012CN102376850A 发光装置及图像显示单元 The light emitting device and an image display unit
03/14/2012CN102376699A LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof
03/14/2012CN102376698A High-brightness LED colorful optical module for lighting or displaying device
03/14/2012CN102376697A High color rendering white light LED (Light Emitting Diode) module
03/14/2012CN102376696A Three-friction-force piezoelectric stepper pushed by two embedded piezoelectric tubes, and stepping scanner
03/14/2012CN102376695A Stacked semiconductor device and method of fabricating the same
03/14/2012CN102376694A Light-emitting element with function of temperature compensation
03/14/2012CN102376691A Semiconductor device and stacked semiconductor apparatus
03/14/2012CN102376680A Stacked semiconductor package and stacking method thereof
03/14/2012CN102376679A Package substrate and flip chip package including the same
03/14/2012CN102376674A Packaging structure with embedded semi-conductor element
03/14/2012CN102376670A 半导体封装件 The semiconductor package
03/14/2012CN102376669A 半导体器件 Semiconductor devices
03/14/2012CN102376664A Semiconductor device, semiconductor circuit substrate, and method of manufacturing semiconductor circuit substrate
03/14/2012CN102376592A Chip size packaging part and production method thereof
03/14/2012CN102374406A Light-emitting diode (LED) chip light source module made from display chip
03/14/2012CN102064166B Curved surface package structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof
03/14/2012CN101471337B Light source die set with good radiating performance
03/14/2012CN101047174B Composite semiconductor device, LED head, and image forming apparatus
03/13/2012US8136071 Three dimensional integrated circuits and methods of fabrication
03/13/2012US8134237 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
03/08/2012WO2012029489A1 Electrical connector
03/08/2012WO2012029165A1 Semiconductor module
03/08/2012WO2012029164A1 Semiconductor module
03/08/2012WO2012028509A1 Light‑emitting diode arrangement comprising a piezo‑transformer
03/08/2012WO2012028460A2 Light-emitting diode chip
03/08/2012WO2012027937A1 Led integrative structure with cooling device
03/08/2012US20120056668 High-impedance network
03/08/2012US20120056333 Layered chip package and method of manufacturing same
03/08/2012DE10227658B4 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a
03/08/2012DE102011082051A1 Halbleiteranordnung Semiconductor device
03/08/2012DE102010044471A1 Method for coating optoelectronic chip-on-board module for, e.g. high-power UV LED lamp, involves immersing optoelectronic component in carrier into silicone material, and curing and thermally cross-linking silicone material with carrier
03/08/2012DE102010044470A1 Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls und optoelektronisches Chip-On-Board-Modul A method of coating an optoelectronic chip-on-board module, and optoelectronic chip-on-board module
03/08/2012DE102007003809B4 Verfahren zum Herstellen einer Leuchtdiodenanordnung und Leuchtdiodenanordnung mit einer Mehrzahl von kettenförmig angeordneten LED-Modulen A method of manufacturing a light emitting diode array and LED assembly having a plurality of chain-shaped arrangement of LED modules
03/08/2012CA2810394A1 A light emitting apparatus
03/07/2012EP2427040A1 Electronic component mounting device and method for producing the same
03/07/2012EP2426789A1 Connection device for a semiconductor module
03/07/2012EP2426745A2 Wavelength conversion configuration for a light emitting device
03/07/2012EP2426716A2 Light emitting device
03/07/2012EP2426715A1 Power module
03/07/2012EP2426714A1 Device mounting structure and device mounting method
03/07/2012EP2426710A2 Method of Manufacturing a Wafer Assembly with Junction-Isolated Vias
03/07/2012EP2425451A1 Composite electronic circuit assembly
03/07/2012EP1851797B1 Device and method for fabricating double-sided soi wafer scale package with through via connections
03/07/2012CN202159666U 一种新型整流模块 A new rectifier
03/07/2012CN202159665U 一种抗光干扰红外线接收模组 An anti-light interference infrared receiver module
03/07/2012CN202159664U 一种led集成光源 One kind of led integrated light source
03/07/2012CN202159663U 大功率led厚膜集成面光源 Thick film integrated power led surface light source
03/07/2012CN102368497A LED (light-emitting diode) light source
03/07/2012CN102368496A Light conversion module
03/07/2012CN101645477B Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof
03/07/2012CN101110401B Interconnect structure for semiconductor package
03/06/2012US8130031 Tunable metamaterial
03/06/2012US8129729 Light emitting device having light emitting elements and an air bridge line
03/06/2012US8129201 Stacking apparatus and method for stacking integrated circuit elements
03/01/2012WO2012027616A2 Solid state light sheet or strip for general illumination
03/01/2012WO2012027081A2 Optical communication in a ramp-stack chip package
03/01/2012WO2012026822A1 Photovoltaic module and method for improved reverse bias, reverse current and hotspot protection
03/01/2012WO2012026091A1 Method for manufacturing electronic device
03/01/2012WO2012026057A1 Semiconductor chip having heater wiring
03/01/2012US20120052926 Variable Capacitance Integrated Electronic Circuit Module
03/01/2012US20120049948 Abutment structure of semiconductor cell
03/01/2012US20120049947 Method and device for measuring integrated circuit power supply noise and calibration of power supply noise analysis models
03/01/2012US20120049382 Bumpless build-up layer package with pre-stacked microelectronic devices
03/01/2012US20120049365 Semiconductor package
03/01/2012US20120049337 Semiconductor device
03/01/2012DE112007001472B4 Elektronikkomponentenmodul Electronic Component Module
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