| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/01/2012 | CN102339345A Method for low power semiconductor chip layout and low power semiconductor chip |
| 02/01/2012 | CN102338292A LED (Light-emitting Diode) device |
| 02/01/2012 | CN101968204B 防止led灯粒自led模块掉落的led照明装置 Prevent grain self-led module led lights led lighting devices fall |
| 02/01/2012 | CN101836293B 安装结构体 Mounting structure |
| 02/01/2012 | CN101728375B 指状交叉背电极单晶硅太阳电池在聚光应用中的封装结构 Interdigitated back contact monocrystalline silicon solar cell encapsulation structure converging applications |
| 02/01/2012 | CN101635296B 有机电致发光显示器件及其制造方法 Organic electroluminescent display device and manufacturing method thereof |
| 02/01/2012 | CN101582476B 发光二极管及其支架模块 Light-emitting diode and bracket module |
| 01/31/2012 | US8108817 Semiconductor structure and method of designing semiconductor structure to avoid high voltage initiated latch-up in low voltage sectors |
| 01/31/2012 | US8107253 Printed circuit board |
| 01/31/2012 | US8106683 One phase logic |
| 01/31/2012 | US8106682 Permutable switching network with enhanced interconnectivity for multicasting signals |
| 01/31/2012 | US8106507 Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket |
| 01/31/2012 | US8105874 Memory circuit arrangement and method for the production thereof |
| 01/30/2012 | DE202011108919U1 Beleuchtungseinrichtung Lighting device |
| 01/26/2012 | WO2012012338A1 Embedded structures and methods of manufacture thereof |
| 01/26/2012 | WO2012012108A2 Galvanic isolation transformer |
| 01/26/2012 | WO2012011936A2 Light transmission control for masking appearance of solid state light sources |
| 01/26/2012 | WO2012011210A1 Semiconductor device and method for manufacturing same |
| 01/26/2012 | WO2012011046A1 Optical interconnects in cooling substrates |
| 01/26/2012 | WO2012010519A1 Radiation-emitting component and method for producing radiation-emitting components |
| 01/26/2012 | WO2012010377A1 Optoelectronic component |
| 01/26/2012 | WO2012010352A1 Optoelectronic component |
| 01/26/2012 | WO2012009919A1 Led integrated packaging light source module |
| 01/26/2012 | US20120018886 Integrated circuit package with open substrate and method of manufacturing thereof |
| 01/26/2012 | US20120018879 Stack package and method for manufacturing the same |
| 01/26/2012 | US20120018868 Microelectronic elements having metallic pads overlying vias |
| 01/26/2012 | US20120018838 Method for modular arrangement of a silicon based array and modular silicon based array |
| 01/26/2012 | DE10357789B4 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 01/26/2012 | DE102010038396A1 Optoelektronisches Bauelement Optoelectronic component |
| 01/26/2012 | DE102010032041A1 Strahlungsemittierendes Bauelement und Verfahren zur Herstellung von strahlungsemittierenden Bauelemnenten The radiation-emitting device and method for the preparation of radiation-emitting Bauelemnenten |
| 01/26/2012 | DE102010027679A1 Optoelektronisches Bauelement Optoelectronic component |
| 01/26/2012 | DE102007016901B4 Halbleiterbauelement und elektronisches Modul Semiconductor device and electronic module |
| 01/26/2012 | DE102004062635B4 Elektrische Baugruppe mit Abstandshaltern zwischen mehreren Schaltungsträgern The electrical assembly with spacers between multiple circuit boards |
| 01/25/2012 | EP2410563A2 Stacked interconnect heat sink |
| 01/25/2012 | EP2410561A1 Circuit module and electronic device |
| 01/25/2012 | EP2410357A2 Uniform illumination system |
| 01/25/2012 | EP2409375A1 Solar powered dc load system |
| 01/25/2012 | EP2409328A1 Multi-die semiconductor package with heat spreader |
| 01/25/2012 | EP1550361B1 Three-dimensional electronic module |
| 01/25/2012 | EP1376696B1 Semiconductor device |
| 01/25/2012 | CN202127039U Light-emitting diode (LED) metallic support, LED, LED display screen and LED lamp |
| 01/25/2012 | CN202127018U Mitsubishi cooling fin structure for rectifier bridge of alternating-current generator for vehicle |
| 01/25/2012 | CN202127017U Light-emitting diode (LED) unit and LED lighting and displaying device |
| 01/25/2012 | CN1790708B Light-emitting diode flash module with enhanced spectral emission |
| 01/25/2012 | CN102334186A Semiconductor device and method of producing same |
| 01/25/2012 | CN102332832A Automobile rectification regulator and production process thereof |
| 01/25/2012 | CN102332524A Light-emitting diode (LED) bracket and LED |
| 01/25/2012 | CN102332450A Packaging structure of high-power semiconductor element module |
| 01/25/2012 | CN102332449A Assembled structure for electronic elements |
| 01/25/2012 | CN102332440A Inverted lead frame and packaging structure thereof |
| 01/25/2012 | CN102332414A Method and technology for miniaturizing film amplitude limiting LNA (low noise amplifier) |
| 01/25/2012 | CN101847622B Power chip with multi-stack package preformed vertical structure and manufacturing method thereof |
| 01/25/2012 | CN101656251B Method for lowering light attenuation of light emitting diode |
| 01/25/2012 | CN101300913B Spaced, bumped component structure |
| 01/25/2012 | CN101252122B mems package for system of air-tight device and wafer-class detection |
| 01/24/2012 | US8102043 Stacked integrated circuit and package system and method for manufacturing thereof |
| 01/24/2012 | US8102041 Integrated circuit package |
| 01/24/2012 | US8101912 Image-taking apparatus and method thereof |
| 01/24/2012 | US8101849 Tilt assembly for tracking solar collector assembly |
| 01/24/2012 | US8101459 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween |
| 01/24/2012 | CA2459970C Fault tolerant led display design |
| 01/19/2012 | WO2012009588A2 Integrated shielding for a package-on-package system |
| 01/19/2012 | WO2012009367A1 Power inverter systems with high-accuracy reference signal generation and associated methods of control |
| 01/19/2012 | WO2012007252A1 Module package and production method |
| 01/19/2012 | WO2012007241A2 Semifinished product and method for producing a light-emitting diode |
| 01/19/2012 | WO2012006796A1 Light emitting diode encapsulation structure and backlight module using the same |
| 01/19/2012 | US20120014024 Method of Testing a Structure Protected from Overvoltages and the Corresponding Structure |
| 01/19/2012 | US20120013028 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
| 01/19/2012 | US20120013027 Semiconductor and a method of manufacturing the same |
| 01/19/2012 | DE102010032807A1 Heat derivative structure for LED construction, has LED crystals provided on metallic carrier, and base board provided with printed conductor layer, where LED crystals on metallic carrier are connected with conductor layer |
| 01/19/2012 | DE102010027579A1 Leuchtdiodenmodul und Leuchte Light emitting diode module and lamp |
| 01/19/2012 | DE102010010649B4 Leuchte für die Raumbeleuchtung Lamp for room illumination |
| 01/19/2012 | DE102009022659B4 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module |
| 01/19/2012 | CA2805695A1 Apparatus and method for thermal interfacing |
| 01/19/2012 | CA2805348A1 Semifinished product and method for producing a light-emitting diode |
| 01/18/2012 | EP2408031A2 Light emitting diode package and frame shaping method of the same |
| 01/18/2012 | EP2407706A1 Warm white light LED lamp with high luminance and high color rendering index and led module |
| 01/18/2012 | EP2407015A1 Power semiconductor module having layered insulating side walls |
| 01/18/2012 | EP2406834A2 Led module with improved light output |
| 01/18/2012 | EP2406832A2 Led module for modified lamps and modified led lamp |
| 01/18/2012 | EP2406816A1 Method for fabricating semiconductor components using maskless back side alignment to conductive vias |
| 01/18/2012 | EP1576654B1 Led package die having a small footprint |
| 01/18/2012 | EP1439584B1 Light emitting device using led |
| 01/18/2012 | CN202120985U Surface-mounting full-color LED |
| 01/18/2012 | CN202120980U Light emitting diode package unit |
| 01/18/2012 | CN202120979U Full color SMD support improved structure |
| 01/18/2012 | CN202120911U Frequency conversion interference resisting infrared ray receiving module |
| 01/18/2012 | CN202120910U Oil immersed self-cooling device of high-voltage tandem silicon controlled combined valve used in high-voltage solid soft-starting equipment |
| 01/18/2012 | CN202120909U LED module group |
| 01/18/2012 | CN202120908U Single-lead light-emitting diode (LED) module |
| 01/18/2012 | CN202120907U Leadless LED (Light-emitting Diode) module |
| 01/18/2012 | CN202120906U Surface mounting type LED |
| 01/18/2012 | CN202120905U Luminous device |
| 01/18/2012 | CN202120904U Low capacitance value surge protector |
| 01/18/2012 | CN202120903U Half-bridge power module |
| 01/18/2012 | CN202120886U Packaging structure |
| 01/18/2012 | CN202118571U True color LED project lamp driven by DMX 512 power supply |
| 01/18/2012 | CN102326251A Method for bonding high heat conductive insulating resin |
| 01/18/2012 | CN102326239A Method of producing semiconductor chip stack, and semiconductor device |
| 01/18/2012 | CN102324426A Novel high-power light-emitting diode (LED) package structure |