H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2011
12/21/2011	CN102290410A Led面光源及其制造方法 Led surface light source and its manufacturing method
12/21/2011	CN102290409A 发光装置 Light-emitting device
12/21/2011	CN102290408A 发光装置以及照明装置 A light emitting device and a lighting device
12/21/2011	CN102290407A 发光装置以及照明装置 The light emitting device and a lighting device
12/21/2011	CN102290406A 具有测试垫的发光二极管封装及其测试方法 A light-emitting diode package and method of test pads
12/21/2011	CN102290405A 一种用于模块化多电平电压源换流器的晶闸管压装结构 SCR press-fit structure of a modular multi-level voltage source inverter for the
12/21/2011	CN102290404A 半导体芯片封装及其制造方法 The semiconductor chip package and method of manufacturing
12/21/2011	CN102290403A 模块基板、具有该基板的半导体模块及其制造方法 Module substrate, comprising a semiconductor module and a manufacturing method of the substrate
12/21/2011	CN102290402A 卧式光控水冷晶闸管阀组 Water-cooled horizontal light control thyristor valve
12/21/2011	CN102290401A 堆叠多芯片封装结构 Stacked multi-chip package structure
12/21/2011	CN102290400A 半导体封装模块及具有该模块的电子电路组件 The semiconductor package module and an electronic circuit assembly having the module
12/21/2011	CN102290399A 堆叠式芯片封装结构及方法 Stacked chip packaging structure and method
12/21/2011	CN102290397A 硅晶圆结构及多晶粒的堆栈结构 Silicon structure and multi-stack structure grains
12/21/2011	CN102290392A 具有导电扩散区的半导体芯片、其制造方法以及堆叠封装 A semiconductor chip having a conductive diffusion region, its manufacturing method, and the stacked package
12/21/2011	CN102287768A 发光二极管封装以及具有其的发光装置 A light emitting diode package and a light emitting device having its
12/21/2011	CN102005430B Double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly
12/21/2011	CN101916757B 一种微流体冷却的硅晶圆片级led照明系统 A microfluidic cooling the silicon wafer level led lighting system
12/21/2011	CN101840915B 一种引脚共享装置及方法 One kind of pin sharing device and method
12/21/2011	CN101740550B 带屏蔽装置的电子部件及其制造方法 With a shielding device and a manufacturing method for an electronic component
12/21/2011	CN101728370B 化合物半导体元件的封装模块结构及其制造方法 Encapsulation module structure and manufacturing method of the compound semiconductor element
12/21/2011	CN101577301B 白光led的封装方法及使用该方法制作的led器件 White led encapsulation methods and the use of the method of making the led devices
12/21/2011	CN101322246B 层叠式微电子封装 Stacked microelectronic packaging
12/21/2011	CN101286507B 半导体装置及便携式设备 Semiconductor device and a portable device
12/21/2011	CN101237219B 振荡器 Oscillator
12/21/2011	CN101005062B 使用相互连接的三维层片将垂直封装的mosfet和集成电路功率器件构建成集成模块 The vertical packaged mosfet power devices and integrated circuits to construct a three-dimensional integrated module interconnected layers
12/20/2011	US8080873 Semiconductor device, semiconductor package, and method for testing semiconductor device
12/20/2011	US8080871 Carbon nanotube-based structures and methods for removing heat from solid-state devices
12/20/2011	US8080442 Vertical system integration
12/20/2011	CA2533490C Improved rectifier bridge assembly
12/20/2011	CA2460840C Thin electronic label and method for making same
12/19/2011	DE202011107527U1 LED-Modul, insbesondere zur Montage in herkömmlichen Raster-, Einbau-, Pendel- und Anbauleuchten LED module, in particular for installation in conventional grid, recessed, pendant and surface mounted
12/15/2011	WO2011156038A2 A sub-threshold fpga and related circuits and methods thereof
12/15/2011	WO2011155851A1 Led lamp and method of manufacturing the same
12/15/2011	WO2011155165A1 Resin-sealed semiconductor device and method for manufacturing same
12/15/2011	US20110304354 Universal digital block interconnection and channel routing
12/15/2011	US20110304035 Package On Package Having Improved Thermal Characteristics
12/15/2011	DE10213648B4 Leistungshalbleitermodul The power semiconductor module
12/15/2011	DE102011002198A1 ESD- und EMC-optimierter MOS-Transistor ESD and EMC optimized MOS transistor
12/15/2011	DE102010035223B3 Mehrstufig justierbare Fassungsbaugruppe für zwei optische Bauteile Multi-stage adjustable socket assembly for two optical components
12/15/2011	DE102010023342A1 Leuchtdiodenanordnung und Leuchtmittel insbesondere mit solch einer Leuchtdiodenanordnung LED arrangement and lighting especially with such a light emitting diode array
12/15/2011	DE102010023191A1 Power module for use in e.g. construction machine, has electromagnetic vulnerability (EMV) filter capacitor and/or EMV filter capacitor bank arranged on circuit board and integrated in housing
12/15/2011	DE102005039947B4 Leistungshalbleitermodul mit Befestigungseinrichtung Power semiconductor module with mounting means
12/14/2011	EP2395568A1 Led light emitting device
12/14/2011	EP2395550A1 Method for recognising and evaluating shadowing
12/14/2011	EP2394303A2 Iii-nitride devices and circuits
12/14/2011	EP2394300A2 Improved packaging for led combinations
12/14/2011	CN202076327U 数码管和电子仪器 Digital and electronic equipment
12/14/2011	CN202076326U 一种数码管及电子仪器 One kind of digital and electronic equipment
12/14/2011	CN202076325U 一种数码管和电子仪器 One kind of digital and electronic equipment
12/14/2011	CN202076313U 一种具有多路输出的led照明装置的多功能支架 Multifunctional stand led lighting device having a multi-output
12/14/2011	CN202076268U 凸杯结构led光源模块封装结构 Convex glass structure led light module package structure
12/14/2011	CN202076267U 一种cob封装结构的led Led one kind cob package structure
12/14/2011	CN202076266U 发光二极管的封装模块 Light emitting diode package module
12/14/2011	CN202076265U LED module encapsulating structure and lighting device
12/14/2011	CN202076264U 一种表面贴装式双色led的封装结构 A surface-mount package of color led
12/14/2011	CN202076263U 白色发光数码管 White LED digital tube
12/14/2011	CN202076262U 堆叠式多芯片封装结构 Stacked multi-chip package structure
12/14/2011	CN202076261U 一种智能功率模块的功率封装结构 Power package structure an intelligent power module
12/14/2011	CN202075942U 高匀称性组合式显示模组及高匀称性全彩显示屏 High symmetry combined display modules and high symmetry of the full-color display
12/14/2011	CN102282672A 用于检测堆叠式集成电路装置中的层到层耦合的电路 A circuit coupled to the detection layer stacked integrated circuit device layer
12/14/2011	CN102282661A 半导体芯片的安装方法、使用该方法获得的半导体装置以及半导体芯片的连接方法与表面设有布线的立体结构物及其制法 A semiconductor chip mounting method, a method for connecting the surface of the semiconductor device and a semiconductor chip obtained by the method has a three-dimensional wiring structure and its preparation method
12/14/2011	CN102282660A 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物 Method of manufacturing a semiconductor package, a semiconductor packaging method and solvent-based semiconductor package epoxy resin composition
12/14/2011	CN102280557A 发光元件组立装置及其方法 Emitting element group legislature apparatus and method
12/14/2011	CN102280555A 一种发光二极管及其制造方法 A light-emitting diode and its manufacturing method
12/14/2011	CN102280540A 具有微通道散热器的led模块及其制备方法 Led module and its preparation method has the microchannel heat sink
12/14/2011	CN102280478A 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process
12/14/2011	CN102280449A 集成dmos和肖特基 Dmos and integrated Schottky
12/14/2011	CN102280442A 发光元件基板及其制法 Light-emitting element substrate preparation method
12/14/2011	CN102280441A 半导体装置 Semiconductor device
12/14/2011	CN102280440A 一种叠层封装结构及制造方法 A laminated package structure and method of manufacture
12/14/2011	CN102280420A 半导体模块以及半导体装置 The semiconductor module and semiconductor device
12/14/2011	CN101677092B 芯片封装结构 Chip package
12/14/2011	CN101496190B 具有一体式天线的混合电路 Hybrid integrated circuit having an antenna
12/14/2011	CN101427371B 电子部件模块 Electronics module
12/14/2011	CN101110293B 超小型电力变换装置及其制造方法 Device and method for manufacturing ultra-small power conversion
12/13/2011	USRE43017 Lighting devices using a plurality of light sources
12/13/2011	US8076957 Semiconductor integrated circuit
12/13/2011	US8076767 Semiconductor device
12/13/2011	US8076763 Electrical shielding in stacked dies by using conductive die attach adhesive
12/13/2011	US8076679 Nitride-based semiconductor light-emitting diode and illuminating device
12/13/2011	US8076586 Heat conduction from an embedded component
12/09/2011	DE202010008479U1 Leiterplatte zum Bestücken mit Leuchtkörpern Circuit board for mounting with flares
12/08/2011	WO2011153436A1 Vertically stackable dies having chip identifier structures
12/08/2011	WO2011153153A1 Multicolored light converting led with minimal absorption
12/08/2011	WO2011152204A1 Method for manufacturing semiconductor device
12/08/2011	WO2011152151A1 Method for predicting lifetime of element, and circuit board provided with function of predicting lifetime of element
12/08/2011	WO2011152003A1 Semiconductor device, solid-state imaging device, and camera system
12/08/2011	WO2011151351A1 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip
12/08/2011	WO2011124692A3 Flat lighting elements, array of flat lighting elements and method for producing flat lighting elements
12/08/2011	US20110299752 Method for implementing depth deconvolution algorithm for enhanced thermal tomography 3d imaging
12/08/2011	US20110298533 Semiconductor device having a bias resistor circuit
12/08/2011	US20110298532 Integrated circuit, integrated circuit design device and integrated circuit design method
12/08/2011	US20110298119 Integrated circuit package system with package stacking and method of manufacture thereof
12/08/2011	US20110298112 Semiconductor module and semiconductor device
12/08/2011	US20110298107 Shielded stacked integrated circuit packaging system and method of manufacture thereof
12/08/2011	US20110298011 Semiconductor Memory Device And System Having Stacked Semiconductor Layers
12/08/2011	US20110298010 Cell Library, Integrated Circuit, and Methods of Making Same
12/08/2011	DE102011106209A1 LED lighting device, has luminescence conversion element absorbing portion of blue light and converting blue light into secondary light, and additional set of light sources constructed of LEDs with wavelength greater than preset value
12/08/2011	DE102011076886A1 Leistungshalbleitervorrichtung Power semiconductor device
12/08/2011	DE102010038731B3 Submodul und Leistungshalbleitermodul Submodule and power semiconductor module

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