| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/05/2011 | EP2371000A1 Method for producing lamps |
| 10/05/2011 | CN202004029U Fine wire conductor-connected modular cell |
| 10/05/2011 | CN202004028U Solar cell assembly |
| 10/05/2011 | CN202003994U Novel LED support |
| 10/05/2011 | CN202003993U Large power LED packaging structure |
| 10/05/2011 | CN202003992U Cyan light LED lamp bead |
| 10/05/2011 | CN202003991U Discrete semiconductor paster ultrathin rectifier |
| 10/05/2011 | CN202003990U Low-cost chip fan-out structure |
| 10/05/2011 | CN202003978U Heating component heat-conducting base structure with diamond heat-conducting thick film |
| 10/05/2011 | CN102210199A Electric circuit apparatus |
| 10/05/2011 | CN102210023A A method for manufacture and structure of multiple electrochemistries and energy gathering components within a unified structure |
| 10/05/2011 | CN102210022A Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips |
| 10/05/2011 | CN102209410A External sudden automatic optical-power control circuit |
| 10/05/2011 | CN102208865A Bridge-driven IPM (intelligent power module) circuit for three-phase electric machine |
| 10/05/2011 | CN102208518A Integrated patch unit |
| 10/05/2011 | CN102208517A LED package die having a small footprint |
| 10/05/2011 | CN102208512A Light emitting diode |
| 10/05/2011 | CN102208509A Light emitting device, method for fabricating light emitting device, and light emitting device package |
| 10/05/2011 | CN102208498A Method and device for packaging light-emitting diode (LED) high-heat-conduction insulated base |
| 10/05/2011 | CN102208471A Solar energy stack light guide module |
| 10/05/2011 | CN102208404A High density integrated circuit module structure |
| 10/05/2011 | CN102208403A Half-bridge power module |
| 10/05/2011 | CN102208402A High-color-rendering light-emitting diode (LED) chip module, white light LED device and manufacturing method thereof |
| 10/05/2011 | CN102208401A LED (Light-emitting diode) light strip |
| 10/05/2011 | CN102208400A Electric power converter |
| 10/05/2011 | CN102208399A Electric power converter |
| 10/05/2011 | CN102208398A Electric power converter |
| 10/05/2011 | CN102208397A Semiconductor apparatus and chip selecting method thereof |
| 10/05/2011 | CN102208396A Semiconductor package part and manufacturing method thereof |
| 10/05/2011 | CN102208376A 半导体器件 Semiconductor devices |
| 10/05/2011 | CN102208209A Three-dimensional stacked semiconductor integrated circuit and control method thereof |
| 10/05/2011 | CN101714543B Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| 10/05/2011 | CN101632170B Interposer and manufacturing method of the interposer |
| 10/05/2011 | CN101630678B Luminous device and method for manufacturing same |
| 10/05/2011 | CN101496169B Electric power converter |
| 10/05/2011 | CN101416373B Power conversion apparatus |
| 10/05/2011 | CN101160733B 高频模块 High-frequency module |
| 10/04/2011 | USRE42785 Semiconductor module with serial bus connection to multiple dies |
| 10/04/2011 | US8030783 Integrated circuit package with open substrate |
| 10/04/2011 | US8030675 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| 10/04/2011 | US8030134 Stacked semiconductor package having adhesive/spacer structure and insulation |
| 09/29/2011 | WO2011119932A1 Heterogeneous technology integration |
| 09/29/2011 | WO2011118572A1 Method for manufacturing semiconductor device |
| 09/29/2011 | WO2011118444A1 Electronic control device |
| 09/29/2011 | WO2011117935A1 Power module and method for manufacturing same |
| 09/29/2011 | WO2011117303A1 Light-emitting semiconductor component and transceiver device |
| 09/29/2011 | WO2011097630A3 Systems and methods providing arrangements of vias |
| 09/29/2011 | US20110237004 Chipstack package and manufacturing method thereof |
| 09/29/2011 | US20110233757 Method for Facilitating the Stacking of Integrated Circuits Having Different Areas and an Integrated Circuit Package Constructed by the Method |
| 09/29/2011 | DE10066446B4 Verfahren zur Herstellung eines elektronischen Bauteils mit zwei Abstrahlungsbauteilen A method of manufacturing an electronic component having two radiation components |
| 09/28/2011 | EP2369624A1 Device for positioning a power semiconductor |
| 09/28/2011 | EP2369623A2 Light emitting device having several light emitting diodes and light unit having the same |
| 09/28/2011 | EP2369223A2 Light-emitting device and illumination device |
| 09/28/2011 | EP1928222B1 Packaging method of electronic component module and electronic component module |
| 09/28/2011 | CN201994334U Led支架 Led bracket |
| 09/28/2011 | CN201994332U 一种集成配光和散热功能的led封装结构 An integrated cooling function with light led package structure |
| 09/28/2011 | CN201994296U 一种高功率封装模块 A high-power package module |
| 09/28/2011 | CN201994295U High-antistatic light-emitting diode (LED) |
| 09/28/2011 | CN201994294U 板上芯片封装结构以及led灯珠 Board chip package structure and led lamp beads |
| 09/28/2011 | CN201994293U 一种大功率led的封装结构 Package structure for a high power led |
| 09/28/2011 | CN201994292U 高密度系统级封装结构 High-density system-level package structure |
| 09/28/2011 | CN201994291U 一种三维高集成度系统级封装结构 A three-dimensional highly integrated system-level package structure |
| 09/28/2011 | CN201994290U 扇出高密度封装结构 Fan-out of high-density packaging structure |
| 09/28/2011 | CN201994277U 晶圆封装结构 Wafer package structure |
| 09/28/2011 | CN201994271U 一种换流阀晶闸管压装机构 One kind of converter valve thyristor press-fit mechanism |
| 09/28/2011 | CN102203942A Lighting device using solid state light emitting devices having a transparent heat sink |
| 09/28/2011 | CN102203941A Connection arrangement for semiconductor power modules |
| 09/28/2011 | CN102203938A A semiconductor device comprising an in-chip active heat transfer system |
| 09/28/2011 | CN102203495A Array layout for color mixing |
| 09/28/2011 | CN102201526A Heat radiation support with integrated packaging |
| 09/28/2011 | CN102201524A Substrate for light-emitting element and light-emitting device |
| 09/28/2011 | CN102201514A Light-emitting diode |
| 09/28/2011 | CN102201513A Light emitting diode, method of manufacturing the same, light emitting diode package and lighting system including the same |
| 09/28/2011 | CN102201504A Light emitting device and light unit having thereof |
| 09/28/2011 | CN102201402A 半导体装置 Semiconductor device |
| 09/28/2011 | CN102201401A 半导体装置 Semiconductor device |
| 09/28/2011 | CN102201400A LED with protecting device |
| 09/28/2011 | CN102201399A Light emitting element |
| 09/28/2011 | CN102201398A Resin sealed semiconductor device and manufacturing method therefor |
| 09/28/2011 | CN102201397A Light-emitting diode (LED) multi-chip integrated packaging device |
| 09/28/2011 | CN102201396A Large insulated gate bipolar translator (IGBT) module and packaging method thereof |
| 09/28/2011 | CN102201395A Multi-layer semiconductor module packaging structure with anti-surge function and manufacturing method thereof |
| 09/28/2011 | CN102201382A Semiconductor packaging piece and manufacturing method thereof |
| 09/28/2011 | CN102201380A 半导体装置 Semiconductor device |
| 09/28/2011 | CN102201349A Circuit component built-in module and manufacturing method therefor |
| 09/28/2011 | CN102201067A System and method to track and authenticate semiconductor chips, multi-chip package modules and derivative system products |
| 09/28/2011 | CN101802993B Semiconductor device and wire bonding method |
| 09/28/2011 | CN101789421B Semiconductor device |
| 09/28/2011 | CN101728378B Organic light emitting diode display device and manufacturing method thereof |
| 09/28/2011 | CN101617405B 照明装置和照明方法 Lighting device and lighting method |
| 09/28/2011 | CN101587883B Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
| 09/28/2011 | CN101562139B Luminescence chip encapsulating structure for avoiding reducing luminous efficiency and manufacture method thereof |
| 09/28/2011 | CN101527300B 堆叠式集成电路与其制造方法 Stacked ICs and its manufacturing method |
| 09/28/2011 | CN101504940B Semiconductor package, and method of manufacturing semiconductor package |
| 09/28/2011 | CN101292349B Device comprising an element with electrodes coupled to connections |
| 09/27/2011 | US8026598 Semiconductor chip module with stacked flip-chip unit |
| 09/22/2011 | WO2011115081A1 Semiconductor device |
| 09/22/2011 | WO2011115041A1 Semiconductor device manufacturing method and semiconductor device |
| 09/22/2011 | WO2011113288A1 High power led illuminating device |
| 09/22/2011 | US20110227169 Semiconductor device |