| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/01/2012 | DE102011000706A1 Leistungswandler Power converter |
| 03/01/2012 | DE102010039956A1 Lichtquellenvorrichtung und Lichtquellenanordnung Light source device and light source assembly |
| 03/01/2012 | DE102010039824A1 Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung Power module with a flexible connector |
| 03/01/2012 | DE102010039728A1 Verfahren zur Herstellung einer elektrischen Schaltung und elektrischen Schaltung A method of producing an electrical circuit and electrical circuit |
| 03/01/2012 | DE102007034342B4 Vorrichtung für Leistungshalbleiter Apparatus for power semiconductors |
| 03/01/2012 | DE102005031613B4 LED und LED-Array mit einer jeweiligen Kleberschicht LED and LED array with a respective adhesive layer |
| 02/29/2012 | EP2423959A2 Power system with a flexible connection device |
| 02/29/2012 | EP2423717A2 Uniform illumination system |
| 02/29/2012 | EP2422366A1 Three dimensional integrated circuit integration using dielectric bonding first and through via formation last |
| 02/29/2012 | EP2422128A1 High colour quality luminaire |
| 02/29/2012 | EP1386348B1 Method of forming a lattice-mismatched semiconductor layer |
| 02/29/2012 | CN202153539U Semiconductor light emitting diode secondary packaging member connected by bonding filamentary silver |
| 02/29/2012 | CN202153535U 发光二极管封装单元 A light emitting diode package unit |
| 02/29/2012 | CN102365739A Optoelectronic semiconductor component and display device |
| 02/29/2012 | CN102365738A Assembly of optoelectronic components |
| 02/29/2012 | CN102365734A Pressure support for an electronic circuit |
| 02/29/2012 | CN102364709A High-power LED packaging structure |
| 02/29/2012 | CN102364686A High-power LED integrated packaging structure |
| 02/29/2012 | CN102364685A Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof |
| 02/29/2012 | CN102364684A LED (Light-Emitting Diode) module and manufacturing process thereof |
| 02/29/2012 | CN102364358A Small low-profile optical proximity sensor |
| 02/29/2012 | CN102364345A Circuit arrangement with shunt resistor |
| 02/29/2012 | CN101919050B Semiconductor device |
| 02/29/2012 | CN101840909B Integrated circuit device |
| 02/29/2012 | CN101752329B Top-side cooled semiconductor package with stacked interconnection plates and method |
| 02/29/2012 | CN101740675B Circuit board of light-emitting diode |
| 02/29/2012 | CN101681903B Electronic package and manufacturing method thereof |
| 02/29/2012 | CN101625987B Fabricating process of a chip package structure |
| 02/29/2012 | CN101552262B Polycrystalline packaging unit and manufacture method thereof |
| 02/29/2012 | CN101453159B Power terminal having built-in power terminal |
| 02/29/2012 | CN101312185B Light emitting device and method for manufacturing the same |
| 02/29/2012 | CN101017814B A separating fluorescence film white LED lamp |
| 02/28/2012 | US8125248 Semiconductor device, method of fabricating semiconductor device, and semiconductor device layout method |
| 02/28/2012 | US8125243 Integrity checking of configurable data of programmable device |
| 02/28/2012 | US8125080 Semiconductor power module packages with simplified structure and methods of fabricating the same |
| 02/28/2012 | US8125067 Method for forming terminal of stacked package element and method for forming stacked package |
| 02/28/2012 | US8125065 Elimination of RDL using tape base flip chip on flex for die stacking |
| 02/28/2012 | US8124446 Structure of high performance combo chip and processing method |
| 02/27/2012 | DE202012100090U1 Halbleiteranordnung mit plattierter Basisplatte A semiconductor device comprising plated base plate |
| 02/27/2012 | DE202011052030U1 Unterwasser-LED-Beleuchtungsvorrichtung Underwater LED lighting device |
| 02/23/2012 | WO2012022657A1 Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips |
| 02/23/2012 | WO2012022628A1 Optoelectronic semiconductor component and scattering body |
| 02/23/2012 | WO2012022031A1 Micro universal serial bus disk in package |
| 02/23/2012 | US20120043670 Semiconductor Module System Having Stacked Components With Encapsulated Through Wire Interconnects (TWI) |
| 02/23/2012 | DE19758891B4 Halbleitersensor und Verfahren zu dessen Herstellung A semiconductor sensor and method for its production |
| 02/23/2012 | DE102011003608A1 Gehäustes LED-Modul A housed LED module |
| 02/23/2012 | DE102010043978A1 Anordnung zum Kühlen von Bauteilen eines HEV Arrangement for cooling of components of an HEV |
| 02/23/2012 | DE102010034665A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for the production of optoelectronic semiconductor chips |
| 02/23/2012 | DE102010034565A1 Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements A process for producing at least one optoelectronic semiconductor component |
| 02/23/2012 | DE102005008600B4 Chipträger, System aus einem Chipträger und Halbleiterchips und Verfahren zum Herstellen eines Chipträgers und eines Systems Chip carrier system comprising a chip carrier and a semiconductor chip and method of manufacturing a chip carrier and a system |
| 02/22/2012 | EP2421039A1 Light emitting apparatus |
| 02/22/2012 | EP2421038A1 Radiation substrate for power led and power led production and manufacturing method thereof |
| 02/22/2012 | EP2421037A1 Electronic device mounting structure and electronic device mounting method |
| 02/22/2012 | EP2420873A2 Uniform illumination system |
| 02/22/2012 | EP2420872A2 Uniform illumination system |
| 02/22/2012 | EP2419932A1 Transparent oled device with high intensity |
| 02/22/2012 | CN202150791U 绝缘栅双极型晶体管升压斩波分布参数吸收器 Insulated gate bipolar transistor of the boost chopper distribution parameter absorber |
| 02/22/2012 | CN202150492U 一种带薄型复眼透镜的集成led模块 A thin led module integrated with the fly's eye lens |
| 02/22/2012 | CN202150491U 具有高显色性的白光led器件和led芯片模块 White led components and led chip module with high color rendering |
| 02/22/2012 | CN202150456U Bidirectionally conductive LED |
| 02/22/2012 | CN202150455U 全彩表面贴装元件及支架 Full-color surface mount components and brackets |
| 02/22/2012 | CN202150454U 双反光杯led护栏管灯珠 Dual reflector lamp beads led guardrail |
| 02/22/2012 | CN202150227U 显示器 Monitor |
| 02/22/2012 | CN102362348A Light diode |
| 02/22/2012 | CN102361051A Method for encapsulating LED (Light Emitting Diode) light source module |
| 02/22/2012 | CN102361028A Semiconductor packaging structure with multiple convex block structures |
| 02/22/2012 | CN102361027A Semiconductor detector and manufacture method thereof |
| 02/22/2012 | CN101853845B 多芯片堆叠封装 Multi-chip stacked packages |
| 02/22/2012 | CN101632175B 用于封装半导体装置的设备和制造半导体组件的方法 Apparatus and a method for manufacturing a semiconductor component of a semiconductor device package |
| 02/22/2012 | CN101625986B 芯片封装结构制程 Chip package process |
| 02/22/2012 | CN101604678B 半导体装置、层叠型半导体装置以及内插器基板 Semiconductor device, the multi-layer semiconductor device and an interpolation filter substrate |
| 02/22/2012 | CN101325197B 具有共同封装的肖特基二极管的高压高功率升压变换器 Schottky diodes have a co-packaged high-voltage high-power boost converter |
| 02/21/2012 | US8120921 Device having electronic components mounted therein and method for manufacturing such device |
| 02/21/2012 | US8120052 Flip chip type LED lighting device manufacturing method |
| 02/21/2012 | US8117742 Fabrication method of semiconductor integrated circuit device |
| 02/21/2012 | CA2423943C Enhanced trim resolution voltage-controlled dimming led driver |
| 02/16/2012 | WO2012020689A1 Method of manufacturing semiconductor device and semiconductor device |
| 02/16/2012 | WO2012020064A1 Packaging an integrated circuit die |
| 02/16/2012 | DE10354936B4 Strahlungemittierendes Halbleiterbauelement Strahlungemittierendes semiconductor device |
| 02/16/2012 | DE102011076235A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 02/16/2012 | DE102010039156A1 Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung A method of manufacturing an electrical circuit and electrical circuit |
| 02/16/2012 | DE102009044712B4 Halbleiter-Bauelement Semiconductor component |
| 02/16/2012 | DE102008059214B4 Anzeige zur Darstellung eines Musters und ein Verfahren zum Herstellen einer Anzeige Display for displaying a pattern and a method for producing a display |
| 02/16/2012 | DE102007038937B4 Baugruppenanordnung Assembly arrangement |
| 02/15/2012 | EP2418696A1 Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device |
| 02/15/2012 | EP2418587A1 High performance sub-system design & assembly |
| 02/15/2012 | EP2417630A1 A method for manufacturing a radiation imaging panel comprising imaging tiles |
| 02/15/2012 | EP1663056B1 Electric toothbrush comprising an electrically powered element |
| 02/15/2012 | CN202145462U Led封装 Led package |
| 02/15/2012 | CN102356476A Tandem photovoltaic cell and method using three glass substrate configuration |
| 02/15/2012 | CN102354693A Capsulation structure of surface light source including a plurality of reflection cups |
| 02/15/2012 | CN102353029A Packaging body of luminous source |
| 02/15/2012 | CN101577237B 包括第一和第二支座的半导体装置和方法 Includes a semiconductor device and a method of the first and second bearing |
| 02/15/2012 | CN101303984B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 02/15/2012 | CN101266968B 发光装置和制造该种发光装置的方法 A light emitting device and a method for manufacturing the luminescent device |
| 02/14/2012 | US8116091 Printed circuit board |
| 02/14/2012 | US8115511 Method for fabrication of a semiconductor device and structure |
| 02/14/2012 | US8115295 Semiconductor device |
| 02/14/2012 | US8115269 Integrated circuit package having reduced interconnects |
| 02/14/2012 | US8115094 Photovoltaic apparatus |