Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2012
04/12/2012DE19616970B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices
04/12/2012DE102010048236A1 Kraftfahrzeugleuchte Vehicle light
04/12/2012DE102010047941A1 Leuchtdiodenmodul mit einem ersten Bauelement und einem zweiten Bauelement und Verfahren zu dessen Herstellung Light emitting diode module with a first component and a second component, and process for its preparation
04/12/2012DE102010042168A1 Elektronische Baugruppe sowie Verfahren zu deren Herstellung An electronic assembly as well as processes for their preparation
04/12/2012DE102007004284B4 Halbleiterleistungsmodul The semiconductor power module
04/11/2012EP2438631A2 Solid state lighting device
04/11/2012EP2438621A1 Photoelectric conversion device and method for manufacturing the same
04/11/2012EP2438618A1 Power switching devices having controllable surge current capabilities
04/11/2012EP2438613A1 Optoelectronic semi-conductor component
04/11/2012CN202189833U 热电分离的发光二极管模块和相关的高反射性散热载板 Thermal separation of the light emitting diode module and the associated carrier plate of high heat reflective
04/11/2012CN202189832U Led元件成型结构及其模组 Led elements forming the structure and modules
04/11/2012CN202189831U 一种高功率高亮度led光源封装结构 A high-power, high brightness led light package
04/11/2012CN202189784U 一种3-d霍尔传感器 One kind of 3-d Hall sensors
04/11/2012CN202189783U 灯驱合一的柱状rgb全彩led混合封装结构 Lamp drive one columnar rgb full color led mixed package
04/11/2012CN202189782U Cobled集成封装结构 Cobled integrated package structure
04/11/2012CN102412358A Packaging substrate
04/11/2012CN102412247A Semiconductor device and multilayer semiconductor device
04/11/2012CN102412246A 一种基于金属基pcb板的led模组及其制造工艺 A metal base pcb board led modules based on its manufacturing process
04/11/2012CN102412245A Light emitting component and manufacturing method thereof
04/11/2012CN102412244A 发光装置 Light-emitting device
04/11/2012CN102412243A OLED surface luminescent device
04/11/2012CN102412242A Light-emitting diode (LED) chipset capable of being connected to alternating current directly
04/11/2012CN102412241A Semiconductor chip encapsulating piece and manufacturing method thereof
04/11/2012CN102412240A APD-TIA (Avalanche Photodiode-Transfer-Impedance Amplifier) coaxial photoelectric module with temperature control function and fabrication method thereof
04/11/2012CN102412239A Semiconductor device and method of manufacturing same
04/11/2012CN102412211A 电子器件 Electronic devices
04/11/2012CN101958302B Double-side graph chip inverse single package structure and package method thereof
04/11/2012CN101636839B Light emitting module and method for the production of a light emitting module
04/10/2012US8154124 Semiconductor device having a chip-size package
04/10/2012US8154053 Programmable metal elements and programmable via elements in an integrated circuit
04/10/2012US8153885 Integrated thin-film solar cell and method of manufacturing the same
04/10/2012US8153516 Method of ball grid array package construction with raised solder ball pads
04/10/2012US8152338 LED lamp unit
04/05/2012WO2012043764A1 Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
04/05/2012WO2012043149A1 Power semiconductor module and method for manufacturing same
04/05/2012WO2012042333A1 Led module
04/05/2012WO2012040959A1 Package structure of high-power led light source module
04/05/2012WO2012007722A3 Apparatus and method for thermal interfacing
04/05/2012WO2011137733A3 Power supply module and packaging and integrating method thereof
04/05/2012US20120081984 Three-dimensional stacked semiconductor integrated circuit
04/05/2012US20120081165 High voltage tolerative driver
04/05/2012US20120080782 Method of manufacturing layered chip package
04/05/2012DE202011000007U1 LED-Anordnung zur Erzeugung von weißem Licht LED array to generate white light
04/05/2012DE102011083879A1 Transformatoranordnung Transformer assembly
04/05/2012DE102010047450A1 Leuchtvorrichtung Lighting device
04/05/2012DE102010047303A1 Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements Reflector element, optoelectronic device and method for producing a reflector element, and of an optoelectronic component
04/05/2012DE102010041892A1 Leistungshalbleitermodul mit einem Grundmodul und einem Verbindungsmodul Power semiconductor module with a base module and a connection module
04/05/2012DE102010041849A1 Leistungshalbleitermodul mit einem Grundmodul und einem Verbindungsmodul Power semiconductor module with a base module and a connection module
04/05/2012DE102009001722B4 Verfahren zum Aufbringen eines Wärmeleitmediums auf eine Wärmeableitfläche Method for applying a heat conducting medium to a heat dissipation surface
04/04/2012EP2437581A1 Light diode on a ceramic substrate basis
04/04/2012EP2437318A2 Light-Emitting Device
04/04/2012EP2437295A2 High-power semiconductor module with a base module and a connection module
04/04/2012EP2437294A2 High-power semiconductor module with a base module and a connection module
04/04/2012EP2436242A1 Optoelectronic module and method for producing an optoelectronic module
04/04/2012EP1547129B1 Method and system for processing a substrate using a dynamic liquid meniscus
04/04/2012CN202183370U 非互联型多芯片封装二极管 Non-interconnected multi-chip package diode
04/04/2012CN102405526A Photovoltaic devices including controlled copper uptake
04/04/2012CN102403440A Light-emitting device
04/04/2012CN102403422A 一种led封装结构的加工方法及led封装结构 Processing method led package structure and led package structure
04/04/2012CN102403309A Light emitting device
04/04/2012CN102403308A 一种不对称多芯片系统级集成封装器件及其封装方法 A multi-chip system-level integration package device and packaging method asymmetry
04/04/2012CN102403307A 一种led基板结构 One kind of led substrate structure
04/04/2012CN102403306A Light-emitting diode packaging structure
04/04/2012CN102403305A 一种usb装置结构 One kind of usb device structure
04/04/2012CN102403294A 半导体器件 Semiconductor devices
04/04/2012CN102403291A Semiconductor Part And Method For Making The Same
04/04/2012CN102403277A Method for constructing an electrical circuit, and electrical circuit
04/04/2012CN102403275A Package on package structure and fabricating method for same
04/04/2012CN102403239A Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in fo-wlcsp
04/04/2012CN101840913B Semiconductor device
04/04/2012CN101819964B Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
04/04/2012CN101740553B Cooling channels in 3dic stacks
04/04/2012CN101577269B Bonding pad sharing method applied to multi-chip module and apparatus thereof
04/04/2012CN101436585B Power semiconductor module having a substrate and a pressure device
04/04/2012CN101315963B 半导体发光装置 The semiconductor light emitting device
04/04/2012CN101192637B 发光二极管元件 Light-emitting diode element
04/03/2012US8151238 Semiconductor integrated circuit and design method thereof
04/03/2012US8151237 Disabling unused IO resources in platform-based integrated circuits
04/03/2012US8148826 Three-dimensional integrated circuits with protection layers
04/03/2012US8148813 Integrated circuit package architecture
04/03/2012US8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
04/03/2012US8148626 Integrated thin-film solar cell and method of manufacturing the same
04/03/2012US8148202 Integrated circuit chip with smart pixels that supports through-chip electromagnetic communication
04/03/2012US8146243 Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
03/2012
03/29/2012WO2012040274A1 Semiconductor chip with reinforcing through-silicon-vias
03/29/2012WO2012040271A1 Stacked semiconductor chip device with thermal management
03/29/2012WO2012040085A1 High density multi-chip led devices
03/29/2012WO2012040084A1 Multi-chip led devices
03/29/2012WO2012039120A2 Printed circuit board
03/29/2012WO2012039116A1 Circuit device
03/29/2012WO2012039115A1 Circuit device
03/29/2012WO2012039114A1 Circuit device
03/29/2012WO2012038483A2 Optoelectronic semiconductor device
03/29/2012WO2012038235A1 Lighting module
03/29/2012WO2012038127A1 Multifunction sensor as pop microwave pcb
03/29/2012WO2012037720A1 Method for manufacturing packaged light emitting diode
03/29/2012US20120079176 Memory device
03/29/2012US20120076167 Side-emitting led light source for backlighting applications
03/29/2012US20120075029 Semiconductor device
03/29/2012US20120074985 Semiconductor device
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