Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2012
04/26/2012US20120100672 Methods and apparatus for a stacked-die interposer
04/26/2012US20120098119 Semiconductor chip device with liquid thermal interface material
04/26/2012US20120098115 Semiconductor device and method of manufacturing the same
04/26/2012DE102011084803A1 Leistungshalbleitervorrichtung Power semiconductor device
04/26/2012DE102011054646A1 Ein IGBT-Modul und eine Schaltung An IGBT module and a circuit
04/26/2012DE102011054380A1 Memory module e.g. single inline memory module (SIMM) for desktop computer, has memory circuit for storing operating parameters for regions of dynamic RAM for influencing operation of regions in response to command
04/26/2012DE102011002960B3 Solarsimulator und Verfahren zum Betreiben eines Solarsimulators Solar simulator and method of operating a solar simulator
04/26/2012DE102010049333A1 Endless band shaped structure for retaining e.g. power LEDs, has reflecting film covering strip guard structure, where reflecting film is left blank in punched receiving areas utilized for retaining electronic parts
04/26/2012DE102010042132A1 Leuchtelement mit OLED-Modulen Light-emitting element with OLED modules
04/26/2012DE102006030890B4 System und Verfahren zum Erzeugen von weißem Licht unter Verwendung einer Kombination von weißen Leuchtstoffumwandlungs-LEDs und Nicht-Leuchtstoffumwandlung-Farb-LEDs System and method for generating white light using a combination of white phosphor conversion LEDs and non-fluorescent conversion-color LEDs
04/25/2012EP2445024A1 Led array module and fabrication method thereof
04/25/2012EP2445023A2 Light emitting diode packaging structure and light emitting diode stereoscopic display device
04/25/2012EP2445021A2 Lighting emitting diode (LED) package and method of fabrication
04/25/2012EP2445007A2 Multichip package structure using a constant voltage power supply
04/25/2012EP2445006A2 Light-emitting device and method for manufacturing the same
04/25/2012EP2445004A1 Laminated wiring board
04/25/2012EP2445000A2 Process for realising a connecting structure
04/25/2012EP2444715A2 Multichip package structure for directly electrically connecting to an AC power source
04/25/2012EP2443654A1 Cooling of electrical components
04/25/2012CN202206339U 一种新型mosfmt驱动模块 A new mosfmt drive module
04/25/2012CN202206338U 新型mosfmt驱动模块 The new mosfmt drive module
04/25/2012CN202205746U 集成式组合波长可调光植物生长led The integrated combination of wavelength tunable light for plant growth led
04/25/2012CN202205745U 一种户外显示用的led贴片结构 Kind of outdoor display with SMD led structure
04/25/2012CN202205744U 提高多led芯片白光光源显色指数和光通量的封装结构 Multi-chip package structure to improve led CRI white light source and a light flux
04/25/2012CN202205743U 易安装led灯珠 Easy to install led lamp beads
04/25/2012CN202205742U 一种led灯珠 One kind of led lamp beads
04/25/2012CN202205741U 分层高密led灯珠 Stratified density led lamp beads
04/25/2012CN202205740U 高散热多晶片封装结构 High heat multi-chip package structure
04/25/2012CN202205739U 凸式led封装结构 Convex type led package structure
04/25/2012CN202205738U 高压硅堆 High voltage silicon stack
04/25/2012CN202205737U Multi-chip packaging structure and inductive chip
04/25/2012CN202205734U 一种薄型大功率半导体模块 A thin high-power semiconductor module
04/25/2012CN202203733U 集成封装led灯泡 Integrated package led bulb
04/25/2012CN202203727U Optical engine with optical switching array
04/25/2012CN102427075A LED apparatus and field sequential display
04/25/2012CN102427074A Multilayer semiconductor device
04/25/2012CN102110750B Method for packaging wafer level glass micro-cavity of light-emitting diode (LED)
04/25/2012CN101855723B Power semiconductor module
04/25/2012CN101752269B Integrated circuit structure and its forming method
04/25/2012CN101609828B Semiconductor device and method of manufacturing the same
04/25/2012CN101431132B Luminous diode
04/25/2012CN101419965B Circuit device
04/25/2012CN101207050B Light emitting device package and method for manufacturing the same
04/24/2012US8164192 Thermo-compression bonded electrical interconnect structure
04/19/2012WO2012049823A1 Semiconductor device production method and semiconductor device
04/19/2012WO2012049607A1 Pec biasing technique for leds
04/19/2012WO2012027081A3 Optical communication in a ramp-stack chip package
04/19/2012US20120094482 Microelectronic devices and methods for filing vias in microelectronic devices
04/19/2012US20120091597 Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package
04/19/2012DE102011002534A9 Chippaket umfassend eine Vielzahl von Chips und Leiterausrichtung Chip package comprising a plurality of chips and circuit alignment
04/19/2012DE102010061972A1 LED-Strahler mit Reflektor LED spotlight with reflector
04/19/2012DE102010046300A1 Beleuchtungsmodul Lighting module
04/19/2012DE102010042619A1 Leuchtvorrichtung zur flächigen Lichtabstrahlung A lighting device for planar optical radiation
04/19/2012DE102009037259B4 Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul Arrangement with a cooling device and a power semiconductor module
04/19/2012DE102007022959B4 Verfahren zur Herstellung von Halbleitervorrichtungen A process for the manufacture of semiconductor devices
04/18/2012EP2442358A1 Semiconductor device
04/18/2012EP2442179A1 Display system
04/18/2012CN202196814U 一种三通道共极式发光二极管 A three-channel co-pole light-emitting diodes
04/18/2012CN202196812U 条状发光结构 Strip light emitting structure
04/18/2012CN202196811U 发光二极管封装基板 A light emitting diode package substrate
04/18/2012CN202196780U 半导体整流器件的二极管模块 Semiconductor rectifier diode module
04/18/2012CN202196779U Sun illumination angle identification device
04/18/2012CN202196778U 一种包括多芯片的芯片块和基底构件的电子设备和组件 An electronic device and a multi-chip module and the base of the die member
04/18/2012CN202196777U Packaging structure of module integrated circuit
04/18/2012CN202195426U 新型led红外灯 The new led infrared light
04/18/2012CN202195349U 一种led光源及其在背光源模组上的应用 A light source and its application in backlight module led
04/18/2012CN1568543B Semiconductor component
04/18/2012CN102422415A Panelized backside processing for thin semiconductors
04/18/2012CN102422414A Device mounting structure and device mounting method
04/18/2012CN102422412A Stacked microelectronic assemblies having vias extending through bond pads
04/18/2012CN102420283A Light emitting device package and lighting apparatus using the same
04/18/2012CN102420223A Circuit device and method for manufacturing the same
04/18/2012CN102420222A Light emitting diode combination
04/18/2012CN102420221A 气密型多层式阵列型发光二极管 Airtight array of multi-layered light-emitting diode
04/18/2012CN102420220A Circuit device and method of manufacturing the same
04/18/2012CN102420219A 分立半导体贴片超薄整流器 Slim Rectifier Discrete Semiconductor Chip
04/18/2012CN102420218A Light emitting diode combination
04/18/2012CN102420217A Multi-chip semiconductor packages and assembly thereof
04/18/2012CN102420208A 半导体封装件 The semiconductor package
04/18/2012CN102420196A Semiconductor module design method and semiconductor module
04/18/2012CN101635295B 一种量子阱红外焦平面阵列及其制作方法 A quantum well infrared focal plane array and its production methods
04/18/2012CN101548372B IC chip-mounted package and image display device using the same
04/18/2012CN101542732B 光检测装置 Light detecting means
04/18/2012CN101488495B Semiconductor module with switching components and driver electronics
04/18/2012CN101414603B Stacked semiconductor package and method for manufacturing the same
04/18/2012CN101359645B Semiconductor device, premolding packaging structure and manufacture method
04/17/2012US8161435 Reset mechanism conversion
04/17/2012US8159268 Interconnect structures for metal configurable integrated circuits
04/17/2012US8159266 Metal configurable integrated circuits
04/17/2012US8159065 Semiconductor package having an internal cooling system
04/17/2012US8159062 Semiconductor and a method of manufacturing the same
04/17/2012US8159054 Semiconductor device
04/17/2012US8158458 Power semiconductor module and method of manufacturing the same
04/12/2012WO2012048031A1 Electronic package and method of making an electronic package
04/12/2012WO2012046578A1 Semiconductor device and method of producing semiconductor device
04/12/2012WO2012046338A1 Semiconductor package, cooling mechanism, and a method for manufacturing semiconductor package
04/12/2012WO2012045540A1 Light-emitting diode module comprising a first component and a second component and method for producing said module
04/12/2012WO2012045214A1 Ceramic packaging base having convex platforms
04/12/2012US20120086505 Switching core layout
04/12/2012US20120086111 Semiconductor device
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