Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2012
09/13/2012WO2012120672A1 Cooler
09/13/2012WO2012120659A1 Method for manufacturing semiconductor device
09/13/2012WO2012120594A1 Semiconductor module and semiconductor module manufacturing method
09/13/2012WO2012120084A1 Light-emitting device
09/13/2012WO2012119950A1 Method for producing at least one optoelectronic semiconductor component
09/13/2012WO2012119812A1 Optoelectronic semiconductor device
09/13/2012US20120229202 Power efficient generation of band gap referenced supply rail, voltage and current references, and method for dynamic control
09/13/2012US20120229200 Gate drive circuit and power semiconductor module
09/13/2012US20120228754 Chip-last embedded interconnect structures and methods of making the same
09/13/2012US20120227916 Deployable Flat Panel Array
09/13/2012DE102012201080A1 Leistungsmodul Power module
09/13/2012DE102011013504A1 Licht emittierende Vorrichtung Light emitting device
09/13/2012DE102011013370A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
09/13/2012DE102011013228A1 Method for manufacturing semiconductor component that is three-dimensionally integrated in semiconductor chip stack, involves selectively removing upper stop layer with respect to lower stop layer
09/13/2012DE102008000261B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
09/13/2012DE102007006212B4 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs
09/13/2012CA2829348A1 Tilt monitor and stress controller for absorption type refrigerator
09/12/2012EP2498290A1 Contact element and power semiconductor module comprising a contact element
09/12/2012EP2498289A2 IGBT power semiconductor package having an electrically conductive clip
09/12/2012CN202434520U Photovoltaic conversion module
09/12/2012CN202434519U LED light-emitting module
09/12/2012CN202434518U Novel high power module
09/12/2012CN202434517U Light emitting diode array
09/12/2012CN202434516U White light and infrared light integrated LED (Light-Emitting Diode) package
09/12/2012CN202434515U LED (Light-Emitting Diode) structure capable of being subjected to dimming and color regulation
09/12/2012CN202434514U Novel LED (Light Emitting Diode) encapsulating structure
09/12/2012CN202434513U LED (light emitting diode) array packaging light source module based on lead frame
09/12/2012CN202434512U Multi-chip light-emitting diode (LED) module packaging structure
09/12/2012CN202434511U Bracket for full color SMD (Surface Mount Device) light emitting diode
09/12/2012CN202434510U Full color SMD (Surface Mount Device) LED (Light-Emitting Diode)
09/12/2012CN202434509U Stackable semiconductor chip packaging structure
09/12/2012CN202434508U Semiconductor chip stacking and encapsulating structure
09/12/2012CN202434507U High-reliability high-power insulated gate bipolar transistor module
09/12/2012CN102668734A 电路模块 Circuit module
09/12/2012CN102668076A Hybird circuit
09/12/2012CN102668075A Semiconductor chip device with solder diffusion protection
09/12/2012CN102668074A Circuit module manufacturing method, circuit module, and electronic apparatus including circuit module
09/12/2012CN102668070A Electronic device for switching currents and method for producing the same
09/12/2012CN102668065A Production method for electronic device, electronic device, production method for electronic device package, and electronic device package
09/12/2012CN102668051A Process for production of electronic device, electronic device, and device for production of electronic device
09/12/2012CN102664231A Light emitting diode device
09/12/2012CN102664229A Light emitting diode light source structure
09/12/2012CN102664178A Full-colored surface-mounted device
09/12/2012CN102664177A Power semiconductor module adopting double-sided cooling
09/12/2012CN102664175A Multi-chip packaging structure of power conversion chip
09/12/2012CN102661491A Light emitting diode device with effective heat dissipation
09/11/2012US8264851 Multi-configuration processor-memory substrate device
09/11/2012US8263996 Light emitting device and fabrication method thereof and light emitting system using the same
09/11/2012US8263438 Method for connecting a die assembly to a substrate in an integrated circuit
09/07/2012WO2012117899A1 Transmission control device and electronic circuit device
09/07/2012WO2012117894A1 Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus
09/07/2012WO2012116470A1 Miniature surface mount device
09/07/2012WO2012095812A3 Method for embedding a led network
09/06/2012US20120223745 Monolithic low impedance dual gate current sense mosfet
09/06/2012US20120223409 Integrated circuit structures, semiconductor structures, and semiconductor die
09/06/2012DE202011110024U1 Weisslichtgerät White light unit
09/06/2012DE102011013052A1 Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements A process for producing at least one optoelectronic semiconductor component
09/05/2012EP2495761A2 Light emitting unit and display device
09/05/2012EP2494616A1 Optoelectronic component and method for producing an opto-electronic component
09/05/2012EP1791180B1 Semiconductor device
09/05/2012CN202425207U Packaging structure for tri-axial sensor
09/05/2012CN202423372U Circuit baseplate used for high-temperature component and LED (light-emitting diode) assembly provided with baseplate
09/05/2012CN202423289U Light emitting diode (LED) light emitting module
09/05/2012CN202423288U LED device
09/05/2012CN202423287U Light-emitting diode device
09/05/2012CN202423286U Integrated LED point light source
09/05/2012CN202423285U LED (light-emitting diode) surface light source module
09/05/2012CN202423284U LED high-power module
09/05/2012CN202423283U Energy-saving environment-friendly LED (light-emitting diode) module
09/05/2012CN202423282U White LED
09/05/2012CN202423281U Fluorescence transparent ceramic lens packaged white light LED
09/05/2012CN202423280U Serial-diode high voltage rectifying bridge arm with radiating device
09/05/2012CN202423279U Packaging structure for multi-chip wafer-level semiconductor
09/05/2012CN202423278U Semiconductor chip stacking structure
09/05/2012CN202423277U Stacking packaging integrated circuit device
09/05/2012CN102656688A Retrofit LED lamp with warm-white, more particularly flame-like white light
09/05/2012CN102655189A Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
09/05/2012CN102655188A Optical mechanical module and manufacture method thereof
09/05/2012CN102655143A Vibrating device, method for manufacturing vibrating device, and electronic apparatus
09/05/2012CN102655142A 发光二极管封装件 Light emitting diode package
09/05/2012CN102655141A Packaging structure for plural bare chips
09/05/2012CN102655140A Multi-die package
09/05/2012CN102655126A Power module, substrate provided with heat radiator and used for power module and manufacturing method of substrate
09/05/2012CN101958261B Semiconductor process and stackable semiconductor device packages
09/05/2012CN101937907B Chip stacking package structure and manufacture method thereof
09/05/2012CN101904007B Light emitting module and thermal protection method
09/05/2012CN101807662B Thermoelectric element, manufacturing method thereof, chip stack structure and chip encapsulating structure
09/05/2012CN101794848B Method of transferring a device and method of manufacturing a display apparatus
09/05/2012CN101771028B White-light LED chip and manufacturing method thereof
09/05/2012CN101577273B CPU power delivery system
09/05/2012CN101436587B Semiconductor module and image pickup apparatus
09/05/2012CN101436571B Electrical device and method
09/05/2012CN101404276B Light emitting module and method for manufacturing the same
09/05/2012CN101207114B Semiconductor device and manufacturing method of the same
09/04/2012US8258613 Semiconductor memory card
09/04/2012US8257538 Device transfer method and display apparatus
08/2012
08/30/2012US20120217644 Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding
08/30/2012US20120217625 Integrated circuit micro-module
08/30/2012US20120217620 Semiconductor apparatus
08/30/2012DE102012203038A1 System und Verfahren zur Verteilungsanalyse von integrierten Stapel-Die-Schaltungen System and method for distribution analysis of integrated circuits, the stack-
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