| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 06/27/2012 | CN101552268B Light-emitting diode module |
| 06/27/2012 | CN101388369B Pressure contact three-phase converter module |
| 06/27/2012 | CN101378053B High-side and low-side nmosfets composite package |
| 06/27/2012 | CN101373761B Multi-chip module package |
| 06/27/2012 | CN101252115B Semiconductor package and manufacture method thereof as well as electric system and manufacture method thereof |
| 06/26/2012 | US8209460 Dual memory chip package operable to access heterogeneous memory chips |
| 06/26/2012 | DE202008018269U1 LED Modul für die Allgemeinbeleuchtung LED Module for General Lighting |
| 06/21/2012 | WO2012082358A1 Flexible integrated circuit device layers and processes |
| 06/21/2012 | WO2012082227A2 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution |
| 06/21/2012 | WO2012082177A1 Enhanced stacked microelectronic assemblies with central contacts |
| 06/21/2012 | WO2012082168A1 Pin attachment |
| 06/21/2012 | WO2012082092A1 Inter-die connection within an integrated circuit formed of a stack of circuit dies |
| 06/21/2012 | WO2012081434A1 Semiconductor device |
| 06/21/2012 | WO2012081144A1 Semiconductor device and production method for same |
| 06/21/2012 | WO2012080015A1 Support for an optoelectronic semiconductor chip, and semiconductor chip |
| 06/21/2012 | WO2012052722A3 Illumination apparatus |
| 06/21/2012 | WO2012012321A3 Stackable molded microelectronic packages with area array unit connectors |
| 06/21/2012 | WO2011120830A3 Rectifier for alternating-current generators |
| 06/21/2012 | US20120153494 Forming die backside coating structures with coreless packages |
| 06/21/2012 | US20120153311 Low-cost solid-state based light emitting devices with photoluminescent wavelength conversion and their method of manufacture |
| 06/21/2012 | DE102011107966A1 LED-Leuchtmodul LED light module |
| 06/21/2012 | DE102011085266A1 Halbleiterschaltung und Halbleitervorrichtung Semiconductor circuit and semiconductor device |
| 06/21/2012 | DE102010054781A1 Module for reducing thermomechanical stress on e.g. surface wave filters, has encapsulated components provided on support substrate, and encapsulation mass surrounding components, where encapsulation mass comprises material recess |
| 06/21/2012 | DE102009020540B4 Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe Method and apparatus for manufacturing an electronic assembly prepared by the method and in the device or electronic assembly |
| 06/21/2012 | DE102005008600B9 Chipträger, System aus einem Chipträger und Halbleiterchips und Verfahren zum Herstellen eines Chipträgers und eines Systems Chip carrier system comprising a chip carrier and a semiconductor chip and method of manufacturing a chip carrier and a system |
| 06/20/2012 | EP2466639A2 A high-color rendering LED and manufacturing method thereof |
| 06/20/2012 | EP2466638A2 High frequency module |
| 06/20/2012 | CN202282387U 发光二极管结构 Light-emitting diode structure |
| 06/20/2012 | CN202282350U 一种白光混色led光源 One kind of blending white led light |
| 06/20/2012 | CN202282349U 贴片式led支架 SMD led bracket |
| 06/20/2012 | CN202282348U 发光二极管封装件和发光二极管显示器 Light emitting diode package and a light emitting diode display |
| 06/20/2012 | CN202281057U 一种LED芯片4π出光的高效率LED发光管 An LED chip 4π light high efficiency LED light tube |
| 06/20/2012 | CN102510204A Insulated gate bipolar transistor (IGBT) half-bridge power module |
| 06/20/2012 | CN102157630B Single-substrate multi-chipset high-power LED (Light-Emitting Diode) encapsulation one-step bonding method |
| 06/20/2012 | CN102130227B Encapsulation process for white light LED with optical lens |
| 06/20/2012 | CN102072418B AC light-emitting diode device with high reliability and long service life |
| 06/20/2012 | CN101930962B Capsulation module for electronic components |
| 06/20/2012 | CN101894830B Stack type package structure and manufacturing method thereof |
| 06/20/2012 | CN101675516B Chips having rear contacts connected by through vias to front contacts |
| 06/20/2012 | CN101316485B Electronic component module and method of manufacturing the same |
| 06/20/2012 | CN101248527B Power semiconductor module with load connecting element installed on circuit carrier |
| 06/20/2012 | CN101199052B Packaging logic and memory integrated circuits |
| 06/19/2012 | US8203380 Semiconductor device |
| 06/19/2012 | US8203358 Image processing apparatus, control method, and storage medium |
| 06/19/2012 | US8203208 Three-dimensional stacked substrate arrangements |
| 06/14/2012 | WO2012078709A2 Compliant interconnects in wafers |
| 06/14/2012 | WO2012076258A1 Opto-electronic semiconductor component, method for producing same and use of such a component |
| 06/14/2012 | WO2012076223A2 Microelectromechanical sensor module and corresponding production method |
| 06/14/2012 | WO2012054711A3 Power/ground layout for chips |
| 06/14/2012 | US20120146241 Integrated circuit packaging system with bump conductors and method of manufacture thereof |
| 06/14/2012 | US20120146210 Compliant interconnects in wafers |
| 06/14/2012 | US20120146207 Stacked structure and stacked method for three-dimensional chip |
| 06/14/2012 | DE10233050B4 Lichtquelle auf LED-Basis für die Erzeugung von Licht unter Ausnutzung des Farbmischprinzips LED-based light source for generating light by utilizing the color mixing principle |
| 06/14/2012 | DE102011088285A1 Electronic device i.e. electronic control unit, for use in engine block of vehicle, has ceramic and resin substrates adhered and secured on side of housing by heat conducting and electrically insulating adhesive |
| 06/14/2012 | DE102011056403A1 Die-Anordnung und Verfahren zum Bilden einer Die-Anordnung The arrangement and method for forming a die assembly |
| 06/14/2012 | DE102010062802A1 Sensor device for pressure measurement, has signal interface unit which outputs digital signals and receives input signals, and portion of analog components of signal interface unit is formed on sensor semiconductor component |
| 06/14/2012 | DE102010062761A1 Electronic circuit module for motor car, has overmold material which is bonded on both sides of printed circuit board mounted with electronic component |
| 06/14/2012 | DE102010062677A1 Generatorvorrichtung zur Spannungsversorgung eines Kraftfahrzeugs Generator means for supplying voltage to a motor vehicle |
| 06/14/2012 | DE102010062497A1 Piezoelectric actuator module for fuel injection valve for internal combustion engine, has receiving layer that includes recess in which electronic memory is arranged |
| 06/14/2012 | DE102010053809A1 Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements An opto-electronic semiconductor device, method for its production and use of such a device |
| 06/13/2012 | EP2463953A1 Transmission line substrate and semiconductor package |
| 06/13/2012 | EP2463952A1 Transmission line substrate and semiconductor package |
| 06/13/2012 | EP2463899A2 Semiconductor circuit assembly |
| 06/13/2012 | EP2462617A1 Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement |
| 06/13/2012 | EP2462373A1 Light source having a refractive element |
| 06/13/2012 | EP1690300B1 Manufacturing method of semiconductor light emitting device |
| 06/13/2012 | CN202275833U 光学模块封装单元 The optical module packaging unit |
| 06/13/2012 | CN202275832U Optical module packaging structure |
| 06/13/2012 | CN202275831U Photo coupler |
| 06/13/2012 | CN202275830U 一种发光二极管改良结构 An improved structure of a light-emitting diode |
| 06/13/2012 | CN202275829U 一种发光二极管的新型封装结构 The new package structure of a light-emitting diode |
| 06/13/2012 | CN202275828U 一种可调色温的白光led集成封装结构 An adjustable color temperature of white led integrated package |
| 06/13/2012 | CN202274442U Light-emitting diode heat-dissipation base with good heat conduction |
| 06/13/2012 | CN1783487B Circuit device and its producing method |
| 06/13/2012 | CN102498565A Method for manufacturing a semiconductor device |
| 06/13/2012 | CN102496615A Assembled cell device based on photovoltaic cell and thermoelectric cell |
| 06/13/2012 | CN102496614A Packaging structure and packaging method of collimated light device |
| 06/13/2012 | CN102496613A Light-emitting diode (LED) package and backlight module with LED package |
| 06/13/2012 | CN101908534B 发光装置 Light-emitting device |
| 06/13/2012 | CN101889345B Substrate for an LED submount, and LED submount |
| 06/13/2012 | CN101872761B Optocoupler, MOS drive and semiconductor relay |
| 06/13/2012 | CN101872750B Chip structure, stack chip packaging structure and manufacturing method of chip structure |
| 06/13/2012 | CN101866909B Bidirectional switch module |
| 06/13/2012 | CN101826516B Side light-emitting type light-emitting assembly encapsulating structure and manufacturing method thereof |
| 06/13/2012 | CN101740688B Packaging body of light source |
| 06/13/2012 | CN101740556B Hybrid microwave integrated circuit |
| 06/13/2012 | CN101685783B Light emitting diode chip package structure and making method thereof |
| 06/13/2012 | CN101681905B Arc discharge device |
| 06/13/2012 | CN101615601B Vertically upward contact semiconductor and method thereof |
| 06/13/2012 | CN101599524B Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
| 06/13/2012 | CN101453059B Radio frequency module integrating active antenna and manufacturing method thereof |
| 06/13/2012 | CN101442042B Display device, preparation method and mask board for preparing the same |
| 06/13/2012 | CN101308840B Multi-wafer 3d cam cell and manufacture process |
| 06/13/2012 | CN101286505B Semi-conductor encapsulation structure having an antenna |
| 06/12/2012 | US8198915 Semiconductor device using normal and auxiliary through silicon vias |
| 06/12/2012 | US8198914 Apparatus and methods for adjusting performance of programmable logic devices |
| 06/12/2012 | US8198720 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 06/12/2012 | DE202012101344U1 Beleuchtungseinrichtung und LED-Beleuchtungssystem Lighting device and LED lighting system |
| 06/07/2012 | WO2012075371A1 Stacked microelectronic assembly having interposer connecting active chips |
| 06/07/2012 | WO2012075272A2 Structures and methods for electrically and mechanically linked monolithically integrated transistor and mems/nems devices |