Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2012
11/20/2012US8316336 Method and mechanism for modeling interconnect structures for integrated circuits
11/20/2012US8314637 Non-volatile latch circuit and logic circuit, and semiconductor device using the same
11/20/2012US8314635 Methods for forming programmable transistor array comprising basic transistor units
11/15/2012WO2012155135A2 Scalable high-bandwidth connectivity
11/15/2012WO2012153842A1 Through wiring substrate, electronic device package, and electronic component
11/15/2012WO2012153531A1 Electromagnetic resonance coupler
11/15/2012WO2012152719A1 Semiconductor device and method for producing a semiconductor device
11/15/2012US20120287024 Method for driving display device
11/15/2012US20120286858 Integrated circuit, method of generating a layout of an integrated circuit using standard cells, and a standard cell library providing such standard cells
11/15/2012US20120286851 Semiconductor device
11/15/2012US20120286419 Semiconductor package with interposer block therein
11/15/2012US20120286411 Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/15/2012DE112006002635B4 Schaltungsmodul und Schaltungsvorrichtung, die ein Schaltungsmodul umfasst A circuit module and circuit device comprising a circuit module
11/15/2012DE102011075731A1 Power semiconductor module e.g. insulated gate bipolar transistor module, for e.g. power converter, has heat sink terminal for connecting heat sink with potential, and other heat sink terminal for connecting other sink with other potential
11/15/2012DE102011075531A1 LED arrangement for viewing e.g. logo, has LED arranged on printed circuit board, and profile part with opening emerges radiation from arrangement, where profile part partially surrounds one of protective materials
11/15/2012DE102011075523A1 Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung Light emitting diode device and method of manufacturing a light emitting diode array
11/14/2012EP2523230A2 Light emitting device package and ultraviolet lamp having the same
11/14/2012CN202534688U LED module structure with remote phosphor powder
11/14/2012CN202534682U LED module having groove
11/14/2012CN202534647U Integrated packaging multi-chip LED light source module
11/14/2012CN202534646U Direct COB structure compatible for LED chips having different wavelength
11/14/2012CN202534645U Light emitting diode module group
11/14/2012CN102782844A Electronic control device
11/14/2012CN102782843A 半导体装置 Semiconductor device
11/14/2012CN102782842A Systems and methods providing arrangements of vias
11/14/2012CN102782841A Dummy TSV to improve process uniformity and heat dissipation
11/14/2012CN102782840A Semiconductor device, solid-state imaging device, and camera system
11/14/2012CN102779923A Manufacturing method of patch type LED (Light-Emitting Diode) module
11/14/2012CN102779920A Semiconductor packaging member and manufacturing method
11/14/2012CN102779908A Graphite heat conduction high-powder flat plane light source encapsulation method
11/14/2012CN102779815A Led package structure and method of fabricating the same
11/14/2012CN102779814A Light emitting element capable of giving out white light and light mixing method of light emitting element
11/14/2012CN102779813A Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/14/2012CN102779802A Semiconductor packaging structure and manufacturing method thereof
11/14/2012CN102208376B 半导体器件 Semiconductor devices
11/14/2012CN102157499B Manufacturing method of hybrid integrated circuit module based on low temperature co-fired ceramic technology
11/14/2012CN102097416B High-power module with novel packaging structure
11/14/2012CN102024802B Integrated circuit structure and forming method thereof
11/14/2012CN101847620B 功率模块 Power Modules
11/14/2012CN101755337B 半导体模块 Semiconductor Modules
11/14/2012CN101599484B Resin sealed semiconductor device and manufacturing method therefor
11/13/2012US8312407 Integration of open space/dummy metal at CAD for physical debug of new silicon
11/13/2012US8310302 Abutment structure of semiconductor cell
11/13/2012US8310301 Fully featured control pin powered analog switch
11/13/2012US8309924 Circuit arrangement and imaging pyrometer for generating light- and temperature-dependent signals
11/13/2012US8309840 Solar panel overlay and solar panel overlay assembly
11/12/2012DE202012009070U1 Optoelektronischer Sensor und Empfangselement Photoelectric Sensor and receiving element
11/08/2012WO2012151520A2 Wafer scale packaging platform for transceivers
11/08/2012WO2012151002A1 Package-on-package assembly with wire bonds to encapsulation surface
11/08/2012WO2012149803A1 Epoxy coating on substrate for die attach
11/08/2012WO2012042452A3 Wavelength converted light emitting device
11/08/2012US20120281408 High efficiency solid-state light source and methods of use and manufacture
11/08/2012US20120280715 Logic circuit and semiconductor device
11/08/2012US20120280403 Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
11/08/2012US20120280387 Three-dimensional stacked substrate arrangements
11/08/2012US20120280380 High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same
11/08/2012DE102012207460A1 LED-Reflektionsregulierungsleuchte LED light reflection regulation
11/08/2012DE102011100743A1 Halbleiterbauelement und ein Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and a method of manufacturing a semiconductor device
11/08/2012DE102011100543A1 Power electronic device used as power converter unit for wind power plant, has semiconductor module whose module-side cooling fluid inlet and coolant outlet are connected with coolant outlet and cooling liquid inlet of cooling module
11/08/2012DE102011100526A1 Leistungselektronische Anordnung mit Flüssigkeitskühlung Power electronic device with liquid cooling
11/08/2012DE102011075260A1 MEMS-Mikrofon MEMS microphone
11/08/2012DE102011075161A1 Leuchtvorrichtung Lighting device
11/08/2012DE102009040444B4 Leistungsmodul Power module
11/08/2012DE102009029476B4 Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe An electronic device for switching currents and manufacturing method for the same
11/08/2012DE102008031786B4 LED-Modul mit einem Kühlkörper LED module to a heat sink
11/08/2012DE102008028611B4 Leuchtelement mit Kunststoffhalterung Lamp unit with plastic holder
11/08/2012DE102006048230B4 Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung Light-emitting system, and method for producing such a backlighting
11/08/2012DE102006027481C5 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
11/07/2012EP2521176A1 High voltage cascoded III-nitride rectifier package comprising conductive clips between electrodes of components and the surface of a package support member
11/07/2012EP2521175A1 Electrical interconnection device of at least one electronic component with a power supply comprising means for reducing loop inductance between a first and a second terminal
11/07/2012EP2521172A1 High voltage cascoded III-nitride rectifier package with etched leadframe
11/07/2012EP2521171A1 High voltage cascoded III-nitride rectifier package with stamped leadframe
11/07/2012EP2521170A2 Pop package and manufacturing method thereof
11/07/2012EP2521169A1 White light luminescent device based on purple light leds
11/07/2012EP2519971A1 Optoelectronic component and method for producing an optoelectronic component
11/07/2012CN202523708U Multi-chip light-emitting diode (LED)
11/07/2012CN202523707U Major loop thyristor module
11/07/2012CN202523706U Three-dimensional stack packaging structure of fan out wafer level semiconductor chip
11/07/2012CN202523705U Miniature power semiconductor module
11/07/2012CN202523704U Non-welding packaged power module
11/07/2012CN102770956A Thermosetting resin composition, b-stage thermally conductive sheet, and power module
11/07/2012CN102769090A Luminous module, luminous unit and manufacturing method
11/07/2012CN102769053A Solar cell module and method for manufacturing the same
11/07/2012CN102769011A High-light-efficiency and high-thermal-conductivity LED COB light source packaging structure and manufacture process thereof
11/07/2012CN102769010A Large-current high-density contact pin type rectifier bridge
11/07/2012CN102769009A Semiconductor packaging piece
11/07/2012CN102769003A High performance electronics assembly with liquid cooling
11/07/2012CN102768996A Semiconductor packaging structure and manufacture method thereof
11/07/2012CN102768995A Memory device with external chip controller and manufacturing method of memory device
11/07/2012CN102768962A Integrated circuit package and assembling method therefor
11/07/2012CN102214641B Wafer-level semiconductor device packages with stacking functionality
11/07/2012CN102163640B Ultraviolet light sensing display device
11/07/2012CN102097417B Integrated power semiconductor power module
11/07/2012CN101937910B LED light source, its manufacturing method, and LED-based exposure apparatus and method
11/07/2012CN101933139B Semiconductor device and method for fabricating the same
11/07/2012CN101728367B Image sensing module for reducing whole thickness and preventing electromagnetic interference
11/07/2012CN101681907B Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
11/07/2012CN101562178B 半导体发光装置 Semiconductor light emitting device
11/07/2012CN101483381B Combined structure
11/07/2012CN101393899B Semiconductor device
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