| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/03/2013 | WO2013003324A1 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 01/03/2013 | WO2013002844A1 Integrated circuit design using through silicon vias |
| 01/03/2013 | WO2013002338A1 Semiconductor device and method for manufacturing semiconductor device |
| 01/03/2013 | WO2013002249A1 Semiconductor module |
| 01/03/2013 | WO2013001999A1 Circuit board for peripheral circuit in high-capacity module and high-capacity module including peripheral circuit using circuit board |
| 01/03/2013 | WO2013001905A1 Lead frame and power module |
| 01/03/2013 | WO2013001171A1 A method of making a system-in-package device, and a system-in-package device |
| 01/03/2013 | WO2013000484A1 Heat sink for cooling of power semiconductor modules |
| 01/03/2013 | US20130003377 Light-emitting device having light-emitting elements |
| 01/03/2013 | US20130002287 Apparatus for improving reliability of electronic circuitry and associated methods |
| 01/03/2013 | US20130001548 Semiconductor apparatus and stacked semiconductor apparatus |
| 01/03/2013 | DE112011100907T5 Einheiten auf der Grundlage von Graphenkanälen und Verfahren zu deren Fertigung Units on the basis of graphs channels and methods for their production |
| 01/03/2013 | DE102012206596A1 Halbleitervorrichtung Semiconductor device |
| 01/03/2013 | DE102012105772A1 Halbleiter-Leuchtdiodenvorrichtungs-Verpackung Semiconductor light-emitting device package |
| 01/03/2013 | DE102011118684B3 Direct-conversion semiconductor detector for detecting e.g. X-ray, has semiconductor device that is stretched by mechanical expansion device and is mechanically clamped and is heated to join with ceramic substrate of base |
| 01/03/2013 | DE102007044046B4 Verfahren zur internen Kontaktierung eines Leistungshalbleitermoduls Process for the internal contacting of a power semiconductor module |
| 01/02/2013 | EP2541598A1 Light emitting device package |
| 01/02/2013 | EP2541597A2 Planar light-emitting module |
| 01/02/2013 | EP2541596A1 Power semiconductor module |
| 01/02/2013 | EP2539933A1 Method and assembly for producing a semiconductor module |
| 01/02/2013 | EP2539931A1 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-d packaged integrated circuits |
| 01/02/2013 | CN202652061U Intelligent power module |
| 01/02/2013 | CN202651125U Photovoltaic bypass integration module |
| 01/02/2013 | CN202651114U Power supply chip |
| 01/02/2013 | CN202651113U Integrated packing light-emitting diode (LED) light source device |
| 01/02/2013 | CN202651112U Semiconductor device and lamination |
| 01/02/2013 | CN102859682A Power module and method for manufacturing power module |
| 01/02/2013 | CN102859671A Semiconductor device, and process for manufacture of semiconductor device |
| 01/02/2013 | CN102857135A Power converter |
| 01/02/2013 | CN102856482A LED (Light Emitting Diode) packaging structure |
| 01/02/2013 | CN102856481A 半导体发光器件封装件 The semiconductor light emitting device package |
| 01/02/2013 | CN102856316A Light emitting device package and light unit including the same |
| 01/02/2013 | CN102856315A Light-emitting diode device |
| 01/02/2013 | CN102856314A 6500V high-voltage diode module |
| 01/02/2013 | CN102856313A Light emitting device |
| 01/02/2013 | CN102856312A Planar light-emitting module |
| 01/02/2013 | CN102856311A LED (Light-Emitting Diode) packaging module and packaging method |
| 01/02/2013 | CN102856310A Light-emitting diode (LED) light source encapsulating structure special for automobile headlamp |
| 01/02/2013 | CN102856309A Semiconductor device |
| 01/02/2013 | CN102856308A Power semiconductor module |
| 01/02/2013 | CN102856307A Small-sized jumper dual bridge rectifier |
| 01/02/2013 | CN102856306A Semiconductor device system-level packaging structure and packaging module |
| 01/02/2013 | CN102856305A Strong three-friction stepper driven by two piezoelectrics side by side |
| 01/02/2013 | CN102222754B LED (light-emitting diode) chip packaging structure and packaging method thereof |
| 01/02/2013 | CN102074517B Ball grid array (BGA) package structure |
| 01/02/2013 | CN102064162B Stacked package structure, package structure thereof and manufacture method of the package structure |
| 01/02/2013 | CN102044447B Packaging technology and packaging structure |
| 01/02/2013 | CN101958307B Power semiconductor module and method of manufacturing the same |
| 01/02/2013 | CN101567345B Through-electrode, circuit board, semiconductor package and stacked semiconductor package |
| 01/02/2013 | CN101499464B Method for manufacturing stack package using through-electrodes |
| 01/02/2013 | CN101459170B 半导体器件 Semiconductor devices |
| 01/02/2013 | CN101447544B Light emitting element and method for producing the same |
| 01/01/2013 | US8344518 Apparatus for stacking integrated circuits |
| 01/01/2013 | US8344459 Semiconductor device |
| 01/01/2013 | US8344360 Organic electronic devices with an encapsulation |
| 01/01/2013 | US8344238 Self-cleaning protective coatings for use with photovoltaic cells |
| 01/01/2013 | US8343848 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 01/01/2013 | US8343795 Method to break and assemble solar cells |
| 12/27/2012 | WO2012176706A1 Power semiconductor module and electric power conversion device using same |
| 12/27/2012 | WO2012176113A1 Autostereoscopic display apparatus having optical magnification |
| 12/27/2012 | WO2012176081A1 Transmitter for near-field chip-to-chip multichannel transmission |
| 12/27/2012 | WO2012175631A2 Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component |
| 12/27/2012 | WO2012175112A1 Power semiconductor housing with contact mechanism |
| 12/27/2012 | US20120326775 Chip select circuit and semiconductor apparatus including the same |
| 12/27/2012 | US20120326333 Semiconductor chip stacking for redundancy and yield improvement |
| 12/27/2012 | US20120326332 Semiconductor device with encapsulated electrical connection elements and fabrication process thereof |
| 12/27/2012 | US20120326307 Stacked semiconductor device |
| 12/27/2012 | US20120326304 Externally Wire Bondable Chip Scale Package in a System-in-Package Module |
| 12/27/2012 | US20120326282 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 12/27/2012 | US20120326264 Method of fabricating semiconductor device, and semiconductor device |
| 12/27/2012 | US20120326183 Light emitting device package |
| 12/27/2012 | DE112008000533B4 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device |
| 12/27/2012 | DE102011105374A1 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterbauelementen im Verbund, derart hergestelltes Halbleiterbauelement und dessen Verwendung A method for fabricating a plurality of optoelectronic semiconductor components in the composite, thus produced semiconductor device and its use |
| 12/27/2012 | DE102011051315A1 Electronic switch e.g. n-channel MOSFET, for controlling e.g. windscreen wiper in automobile industry, has suppresser diode switchable parallel to switch to protect against over-voltage, where suppresser diode is integrated into housing |
| 12/27/2012 | DE10058446B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components |
| 12/26/2012 | EP2538761A1 Intelligent Power Module and related assembling method |
| 12/26/2012 | EP2537182A1 Microelectronic package with terminals on dielectric mass |
| 12/26/2012 | CN202633381U Light-emitting diode with double platforms |
| 12/26/2012 | CN202633375U White-light LED packaging structure |
| 12/26/2012 | CN202633309U Insulated gate bipolar transistor (IGBT) power module applied to electric vehicle |
| 12/26/2012 | CN202633308U Novel packaged power module |
| 12/26/2012 | CN202633307U Low-cost surface mounting and encapsulating structure for semiconductor optical device |
| 12/26/2012 | CN202633306U Multi-cup LED (light-emitting diode) integrated light source |
| 12/26/2012 | CN202633305U Assembly of laminated apparatus possessing semiconductor components |
| 12/26/2012 | CN202633304U Distributed high-voltage LED die set |
| 12/26/2012 | CN202633303U LED full-color surface mount device and support |
| 12/26/2012 | CN202633302U Led装置 Led device |
| 12/26/2012 | CN202633301U LED lighting device |
| 12/26/2012 | CN202633300U Full color flicker RGB chip module |
| 12/26/2012 | CN202633299U Integrated chip module applied to high color highlight white light package |
| 12/26/2012 | CN202633298U Led装置 Led device |
| 12/26/2012 | CN202633297U LED integrated RGB full-color light source module |
| 12/26/2012 | CN202633296U LED integrated high-color light source module |
| 12/26/2012 | CN202633295U LED support, LED area light source and LED lamp |
| 12/26/2012 | CN202633294U White-light LED light source |
| 12/26/2012 | CN202633293U LED light source |
| 12/26/2012 | CN202633292U Mixed spectrum LED lamp plate |
| 12/26/2012 | CN202633291U Chip-on-chip packaging structure |
| 12/26/2012 | CN202633290U High-density semiconductor encapsulation structure |
| 12/26/2012 | CN202631105U Brightness and proximity multi-chip integrated transducer |