Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2012
05/23/2012CN102468278A 多芯片堆栈封装结构 Multi-chip stack package structure
05/23/2012CN102468277A Multi-chip laminating and packaging structure and manufacturing method thereof
05/23/2012CN102468263A Integrated circuit system with distributed power supply
05/23/2012CN102468249A Power package module and method for fabricating the same
05/23/2012CN102468197A Semiconductor device and method of forming flipchip interconnect structure
05/23/2012CN102466148A 使用定电压电源供应器的多晶封装结构 Use constant voltage power supply polycrystalline package structure
05/23/2012CN102064169B Single-chip white-light LED and preparation method thereof
05/23/2012CN102024804B Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness
05/23/2012CN101958300B Double-sided graphic chip inversion module packaging structure and packaging method thereof
05/23/2012CN101872757B Recess chip packaging structure and laminated packaging structure using same
05/23/2012CN101872749B Recess chip packaging structure and laminated packaging structure using same
05/23/2012CN101859736B Semiconductor packaging semi-finished product and semiconductor packaging process
05/23/2012CN101819968B Light-emitting diode (LED) packaging
05/23/2012CN101807568B New multichip LED encapsulation structure and processing method thereof
05/23/2012CN101803020B Laminated mounting structure and method for manufacturing laminated mounting structure
05/23/2012CN101794760B High current semiconductor power soic package
05/23/2012CN101794717B Stacked integrated chips and methods of fabrication thereof
05/23/2012CN101740552B Multi-chip packaging structure and manufacturing method thereof
05/23/2012CN101632169B Interposer and manufacturing method of the interposer
05/23/2012CN101494175B Three-layer stereo power encapsulation method and structure
05/23/2012CN101488496B Semiconductor integrated circuit
05/23/2012CN101459152B Stack type semi-conductor encapsulation construction having metal contact point guiding pore
05/23/2012CN101383334B Lead frame, semiconductor device, and method of manufacturing semiconductor device
05/23/2012CN101325196B Boost converter with integrated high power discrete fet and low voltage controller
05/23/2012CN101290928B Light emission device
05/23/2012CN101097982B Packaging structure for luminescent device
05/22/2012US8183678 Semiconductor device having an interposer
05/22/2012CA2460394C Image sensor with recessed planarizing layers and method for making same
05/21/2012DE202012000046U1 LED - Modul - Fassung LED - Module - Version
05/18/2012WO2012062707A2 Compact diode/thyristor rectifier architecture allowing high power
05/18/2012WO2012062643A1 Lighting device and method for producing a lighting device
05/18/2012WO2012039120A3 Printed circuit board
05/18/2012CA2816654A1 Compact diode/thyristor rectifier architecture allowing high power
05/17/2012US20120120610 Semiconductor device
05/17/2012US20120119785 Input/output core design and method of manufacture therefor
05/17/2012US20120119782 Logic for Metal Configurable Integrated Circuits
05/17/2012US20120119383 Stacked integrated circuit package fabrication methods that use vias formed and filled after stacking, and related stacked integrated circuit package structures
05/17/2012US20120119348 Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region around Semiconductor Die
05/17/2012US20120118477 Stacking apparatus and method for stacking integrated circuit elements
05/16/2012EP2453489A1 Light emitting device
05/16/2012EP2452360A1 Power electronic module
05/16/2012DE112010001153T5 LED-Modul mit verbesserter Lichtausbeute LED module with improved light efficiency
05/16/2012DE102011079278A1 Manufacturing method of electronic module based on three-dimensional technology, involves applying solder paste on solder surfaces of individual printed circuit boards (PCBs) and heating PCB in reflow oven for melting the solder paste
05/16/2012DE102010043788A1 Circuit arrangement for operating light source, has unbundling board comprising conductor layer with contact pad that is coupled with contact pad of conductor layer of metal core board through solder joint
05/16/2012CN202221759U LED light source device having high heat conduction substrate
05/16/2012CN202221758U High power LED device
05/16/2012CN202221757U Novel anti-high-surge-current transient over-voltage protection device
05/16/2012CN102460924A Dc-dc converter, module, power supply device and electronic apparatus
05/16/2012CN102460741A 具有增大的提取效率的再发光半导体构造 Re-emitting semiconductor construction having an increased efficiency of extraction
05/16/2012CN102460708A 具有非负温度系数的宽带隙双极可关断闸流管和相关控制电路 A wide bandgap bipolar negative temperature coefficient having a non-turn-off thyristors and the associated control circuitry
05/16/2012CN102460696A Optoelectronic semi-conductor component
05/16/2012CN102460695A Wiring board and power conversion device
05/16/2012CN102460694A Power conversion device
05/16/2012CN102460693A Power converter
05/16/2012CN102460687A Laminated wiring board
05/16/2012CN102460667A Method of producing electronic component mounting structure, and electronic component mounting structure
05/16/2012CN102458019A Cct modulating method, led light source module, and package structure thereof
05/16/2012CN102456820A Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same
05/16/2012CN102456782A Light-emitting device
05/16/2012CN102456684A 电源转换模块 Power conversion module
05/16/2012CN102456683A Light-emitting diode packaging structure
05/16/2012CN102456682A 一种led灯结构 One kind of led light structure
05/16/2012CN102456681A 发光模块 Emitting module
05/16/2012CN102456680A Light emitting diode module group
05/16/2012CN102456679A High-efficiency power converters with integrated capacitors
05/16/2012CN102456678A Igbt module and a circuit
05/16/2012CN102456677A Packaging structure for ball grid array and manufacturing method for same
05/16/2012CN102456676A 影像感测器 Image sensor
05/16/2012CN102456675A 三维半导体器件 Three-dimensional semiconductor device
05/16/2012CN102456674A Chip stacking structure and method
05/16/2012CN102456673A 芯片堆叠结构 Chip stack structure
05/16/2012CN102456669A Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
05/16/2012CN102456642A 功率半导体系统 Power semiconductor systems
05/16/2012CN102456635A Semiconductor module with a substrate with a number of identically designed conductor line groups
05/16/2012CN102455472A Optical device, method for manufacturing same and electronic packaging including said optical device
05/16/2012CN102454945A Method for obtaining high-color rendering warm white and packaging structure thereof
05/16/2012CN102024797B Protective structure for electronic element
05/16/2012CN101971335B Illumination means
05/16/2012CN101477956B Encapsulation structure and method for tablet reconfiguration
05/15/2012US8179688 Semiconductor device
05/15/2012US8178978 Support mounted electrically interconnected die assembly
05/15/2012US8178451 Glass composition formulated for a glass-metal bond of a tube collector and glass-metal bond made with glass of said glass composition
05/10/2012WO2012060054A1 Circuit device and method for manufacturing same
05/10/2012WO2012060034A1 Electronic component module
05/10/2012WO2012030469A3 Manufacturing fixture for a ramp-stack chip package
05/10/2012US20120112829 Semiconductor device and method of controlling the same
05/10/2012US20120112827 Apparatus for semiconductor integrated circuit, design method for semiconductor integrated circuit, and semiconductor integrated circuit
05/10/2012US20120112366 Power Electronic Module
05/10/2012US20120112360 Semiconductor chip, stacked semiconductor package having the same, and method for manufacturing stacked semiconductor package
05/10/2012US20120112357 System and method for relieving stress and improving heat management in a 3d chip stack having an array of inter-stack connections
05/10/2012US20120112356 System and method for relieving stress and improving heat management in a 3d chip stack
05/10/2012US20120112308 Semiconductor device, semiconductor group member and semiconductor device manufacturing method
05/10/2012DE102010050315A1 Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule A process for preparing sintered, electrical subassemblies and power semiconductor modules thus produced
05/10/2012DE102010043726A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
05/10/2012DE102010043362A1 Leistungshalbleitermodul mit einem Substrat mit einer Mehrzahl gleichartig ausgebildeter Leiterbahngruppen Power semiconductor module comprising a substrate having a plurality of similarly formed conductor groups
05/10/2012DE102010042727A1 OLED-Modul OLED module
05/09/2012EP2451063A1 Dc-dc converter, module, power supply device and electronic apparatus
05/09/2012EP2450952A2 Semiconductor module with a substrate with a number of identically designed conductor line groups
05/09/2012EP2449589A1 Multicolor light emitting diodes
05/09/2012EP1806789B1 Lighting apparatus comprising light emitting diodes and liquid crystal display comprising the lighting apparatus
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