| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/16/2013 | CN202678309U A COB packaging structure of a large-power LED lamp |
| 01/16/2013 | CN202678308U COB integrated optical source module |
| 01/16/2013 | CN202678307U Medium power TOP LED product structure |
| 01/16/2013 | CN202678306U Minitype packaging thyristor module |
| 01/16/2013 | CN202675173U COB encapsulating structure of uniformly luminous LED illuminating lamp |
| 01/16/2013 | CN102884623A Microelectronic package with terminals on dielectric mass |
| 01/16/2013 | CN102883095A Seamlessly spliced photoelectronic imaging system with double lens using 25 area-array detectors |
| 01/16/2013 | CN102881801A Back switching type light emitting diode packaging structure and manufacturing method thereof |
| 01/16/2013 | CN102881686A Light-emitting diode (LED) light source module |
| 01/16/2013 | CN102881685A Light-emitting diode (LED) chip on board (COB) packaging light source |
| 01/16/2013 | CN102881684A LED (light-emitting diode) packaging structure and method |
| 01/16/2013 | CN102881683A Double-chip glass-sealed diode |
| 01/16/2013 | CN102881682A Power semiconductor device |
| 01/16/2013 | CN102881681A Three-dimensional solar cell array |
| 01/16/2013 | CN102881230A Glass window advertising screen with internally embedded LED (light-emitting diode) and manufacture method thereof |
| 01/16/2013 | CN102176451B LED packaging base |
| 01/16/2013 | CN102130084B Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 01/16/2013 | CN101971380B Optoelectronic component |
| 01/16/2013 | CN101958316B LED integrated packaging power source module |
| 01/16/2013 | CN101819965B Semiconductor device |
| 01/16/2013 | CN101510542B Encapsulation structure and manufacturing method for high power light-emitting diode chip |
| 01/16/2013 | CN101055856B Connecting device for electronic component |
| 01/15/2013 | US8354861 Magnetoresistive element, logic gate and method of operating logic gate |
| 01/15/2013 | US8354299 Semiconductor component having a stack of semiconductor chips and method for producing the same |
| 01/15/2013 | CA2507431C Single package multi-chip rf power amplifier |
| 01/10/2013 | WO2013006641A2 Ehf communication with electrical isolation and with dielectric transmission medium |
| 01/10/2013 | WO2013005474A1 Semiconductor device |
| 01/10/2013 | WO2013005147A1 Light guide |
| 01/10/2013 | WO2013005144A1 Lighting module for a modular lighting system |
| 01/10/2013 | WO2013004608A1 Luminaire with a potting compound |
| 01/10/2013 | WO2013004496A2 Optoelectronic semiconductor component and module comprising a plurality of such components |
| 01/10/2013 | WO2013004297A1 Short-circuit failure mode with multiple device breakdown |
| 01/10/2013 | WO2012151520A3 Wafer scale packaging platform for transceivers |
| 01/10/2013 | WO2012148869A3 Contact metal for hybridization and related methods |
| 01/10/2013 | US20130009668 4-terminal piezoelectronic transistor (pet) |
| 01/10/2013 | US20130009304 Chip-stacked semiconductor package |
| 01/10/2013 | US20130009290 Power module package and method for manufacturing the same |
| 01/10/2013 | US20130009275 Semiconductor integrated circuit device and terminal structure of standard cell |
| 01/10/2013 | US20130009186 Led lamps |
| 01/10/2013 | DE102012210440A1 Halbleitermodul Semiconductor module |
| 01/10/2013 | DE102011106478A1 Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen An optoelectronic semiconductor device and module with a plurality of such devices |
| 01/10/2013 | DE102011078620A1 Hochvolt-LED-Multichip-Modul und Verfahren zur Einstellung eines LED-Multichip-Moduls High voltage LED multi-chip module and method for adjusting a multi-chip LED module |
| 01/10/2013 | DE102011078619A1 LED light source has electrically conductive connections which are provided with respect to conductor tracks, mounting portions and reserve area for bridging the defective LED chip |
| 01/10/2013 | DE102010008485B4 Leistungshalbleitergerät Power semiconductor device |
| 01/09/2013 | EP2544234A1 Method for manufacturing a light emitting device |
| 01/09/2013 | EP2544233A1 Display module, manufacturing method thereof, and display device |
| 01/09/2013 | EP2544232A1 Light emitting device array and backlight unit |
| 01/09/2013 | EP2544231A2 High performance electronics system with a cooling device |
| 01/09/2013 | EP2544230A1 Semiconductor module and module substrate |
| 01/09/2013 | EP2544229A1 Power semiconductor arrangement |
| 01/09/2013 | EP2544228A2 High performance electronics system with a cooling device |
| 01/09/2013 | EP2543919A1 Led light source lamp |
| 01/09/2013 | EP2543067A1 Dummy tsv to improve process uniformity and heat dissipation |
| 01/09/2013 | EP2543066A2 Thermal vias in an integrated circuit package with an embedded die |
| 01/09/2013 | EP2543064A1 Multi-chip integrated circuit |
| 01/09/2013 | CN202662604U White-light LED (light-emitting diode) with high colour rendering index |
| 01/09/2013 | CN202662603U LED (light-emitting diode) light emitting element |
| 01/09/2013 | CN202662602U Multi-wafer LED structure |
| 01/09/2013 | CN202662601U LED (light emitting diode) encapsulation structure |
| 01/09/2013 | CN202662600U Light-emitting module based on COB (Chip On Board) |
| 01/09/2013 | CN202662599U Integrated LED packaging structure |
| 01/09/2013 | CN202662598U High-reliability integrated packaged LED chip |
| 01/09/2013 | CN202662597U Integrated multilayer lighting device |
| 01/09/2013 | CN202662594U Infrared remote control receiving amplifier |
| 01/09/2013 | CN202662593U 半导体器件 Semiconductor devices |
| 01/09/2013 | CN202662589U Switching device with fly-wheel diode |
| 01/09/2013 | CN202662240U LED (light-emitting diode) packaging structure of high-brightness full-color display screen |
| 01/09/2013 | CN102870216A Optoelectronic semiconductor chip |
| 01/09/2013 | CN102870214A Optoelectronic component and method for producing an optoelectronic component |
| 01/09/2013 | CN102870213A Epoxy coating on substrate for die attach |
| 01/09/2013 | CN102868319A Energy recovering and utilizing device based on human motion energy |
| 01/09/2013 | CN102868166A Thyristor valve module for horizontal water-cooling static var compensator |
| 01/09/2013 | CN102867900A Light emitting apparatus |
| 01/09/2013 | CN102867821A 半导体器件 Semiconductor devices |
| 01/09/2013 | CN102867820A Light-emitting diode encapsulating structure |
| 01/09/2013 | CN102867819A Light-emitting diode encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867818A Light-emitting diode encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867817A Power electronic system with cooling device |
| 01/09/2013 | CN102867816A Power electronics system with cooling device |
| 01/09/2013 | CN102867815A Power module package and method for manufacturing the same |
| 01/09/2013 | CN102867800A Connecting function chips to a package to form package-on-package |
| 01/09/2013 | CN102867796A 3D (three-dimensional) integrated circuit structure and method for detecting alignment of chip structures |
| 01/09/2013 | CN102867786A Chip-stacked semiconductor package |
| 01/09/2013 | CN102865471A Light emitting device array and backlight unit |
| 01/09/2013 | CN102214645B Multi-layer array type light emitting diode |
| 01/09/2013 | CN102157501B 三维系统级封装结构 Three-dimensional system-level package structure |
| 01/09/2013 | CN102130107B Step array high-voltage light-emitting diode and preparation method thereof |
| 01/09/2013 | CN102074540B Matrix dual in-line package (DIP) lead frame, integrated circuit (IC) packages based on frame and production method of IC packages |
| 01/09/2013 | CN102054826B Novel baseplate-free power module |
| 01/09/2013 | CN101997064B Light-emitting diode (LED) |
| 01/09/2013 | CN101465345B Light source device Light source die set and method for manufacturing the light source device |
| 01/09/2013 | CN101131986B Method for manufacturing lead frame structure, semiconductor device and flip device |
| 01/08/2013 | US8351214 Electronics module comprising an embedded microcircuit |
| 01/08/2013 | US8350621 Analog circuit and semiconductor device |
| 01/08/2013 | US8350620 Integrated circuit power consumption calculating apparatus and processing method |
| 01/08/2013 | US8350591 Configurable IC's with dual carry chains |
| 01/08/2013 | US8350372 Semiconductor device including a DC-DC converter |
| 01/08/2013 | US8350364 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly |
| 01/08/2013 | US8349707 Process for making contact with and housing integrated circuits |
| 01/08/2013 | CA2496125C Flexible integrated photovoltaic roofing membrane and related methods of manufacturing same |