Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2012
09/27/2012WO2012126379A1 Three-dimensional system-level packaging methods and structures
09/27/2012WO2012126377A1 System-level packaging methods and structures
09/27/2012WO2012126375A1 Fan-out high-density packaging methods and structures
09/27/2012WO2012126269A1 Electro-static shielding apparatus, electronic device, and method for manufacturing said electro-static shielding apparatus
09/27/2012WO2012076223A3 Microelectromechanical sensor module and corresponding production method
09/27/2012US20120242403 Switching core layout
09/27/2012US20120241982 Packaged semiconductor assemblies and methods for manufacturing such assemblies
09/27/2012US20120241980 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
09/27/2012US20120241977 Configurable interposer
09/27/2012US20120241968 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241956 Techniques for packaging multiple device components
09/27/2012US20120241954 Unpackaged and packaged IC stacked in a system-in-package module
09/27/2012US20120241928 Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
09/27/2012DE10296523B4 Vorrichtung bestehend aus LDMOS-Transistor und Leistungsverstärker mit einer gemeinsamgenutzten Erdungsebene und Verfahren zur Herstellung. Device consisting of LDMOS transistor and power amplifier having a shared ground plane, and methods of manufacture.
09/26/2012EP2503604A1 Led light emitting module and manufacturing method thereof
09/26/2012EP2503595A1 Power semiconductor module and method of manufacturing a power semiconductor module
09/26/2012EP2502271A1 Substrate for a lighting module and lighting module
09/26/2012DE202012007280U1 Leistungshalbleiterspannstapel Power semiconductor chip stack
09/26/2012CN202454606U Packaging structure, LED and display screen
09/26/2012CN202454557U LED integrated module
09/26/2012CN202454556U Stacked chip packaging structure, synchronous rectification module and converter module
09/26/2012CN202452144U Five-series-connection and sixteen-parallel-connection light-emitting diode (LED) chip integrated surface light source
09/26/2012CN102696105A Chip package with a chip embedded in a wiring body
09/26/2012CN102694379A Plane voltage protection assembly
09/26/2012CN102694102A Light emitting diode packaging structure, manufacturing method thereof, and light source apparatus
09/26/2012CN102694036A Silicon-based thin film solar cell with novel back reflection structure
09/26/2012CN102693974A Infrared remote control receiving amplifier with double-layer structure
09/26/2012CN102693973A Light-emitting diode lighting device
09/26/2012CN102693972A Light emitting diode package and manufacture method of lead frame of the light emitting diode package
09/26/2012CN102693971A Light emitting apparatus
09/26/2012CN102693970A Light emitting diode apparatus
09/26/2012CN102693969A Insulated gate bipolar translator (IGBT) power module
09/26/2012CN102693968A Chip stacking and packaging structure
09/26/2012CN102693967A Semiconductor memory card
09/26/2012CN102693966A 电力用半导体装置以及逆变器装置 A power semiconductor device and an inverter device
09/26/2012CN102693965A Package-on-package structure
09/26/2012CN102693746A 半导体器件 Semiconductor devices
09/26/2012CN102691921A Light-emitting diode light bar and method for manufacturing same
09/26/2012CN102222756B Packaging structure for light emitting diode light source
09/26/2012CN102037560B Method for making microstructures by converting porous silicon into porous metal or ceramics
09/26/2012CN101989595B Power device module
09/26/2012CN101877349B Semiconductor module and portable device
09/26/2012CN101621107B Light-emitting diode with high light efficiency and encapsulation method thereof
09/26/2012CN101621046B Semiconductor package using through-electrodes having voids
09/25/2012US8274143 Semiconductor device, method of forming the same, and electronic device
09/20/2012WO2012124209A1 Semiconductor module and manufacturing method therefor
09/20/2012WO2012123840A1 Led having vertical contacts redistributed for flip chip mounting
09/20/2012DE102012200863A1 Halbleitervorrichtung mit Grundplatte Semiconductor device with base plate
09/20/2012DE102012102154A1 Halbleiteranordnung mit einer schaltung zur kompensation parasitärer induktivitäten A semiconductor device comprising a circuit for compensation of parasitic inductances
09/19/2012EP2500940A1 Systems including an I/O stack and methods for fabricating such systems
09/19/2012EP2500936A1 Insulating structure and method for manufacturing same
09/19/2012EP2500704A1 Sensor device and method for producing sensor device
09/19/2012EP2500636A1 Light emitting device
09/19/2012EP2500627A2 Light-emitting device, light-emitting device module, and vehicle lighting unit
09/19/2012EP2499668A1 Thin-film semiconductor device with protection diode structure and method for producing a thin-film semiconductor device
09/19/2012EP2499667A1 PARALLELIZED CHECK POINTING USING MATs AND THROUGH SILICON VIAs (TSVs)
09/19/2012CN202444434U Three-phase rectifier bridge
09/19/2012CN202443970U LED packaging structure adopting COB technology
09/19/2012CN202443969U Line plate type three-phase rectification bridge
09/19/2012CN202443423U Sensor module of optical mouse
09/19/2012CN1947255B Photovoltaic module with an electric device
09/19/2012CN102687271A Thin-film semiconductor device with protection diode structure and method for producing a thin-film semiconductor device
09/19/2012CN102687270A Power semiconductor module
09/19/2012CN102687269A Semiconductor device and manufacturing method therefor
09/19/2012CN102687256A Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device
09/19/2012CN102686707A Artificial photosynthesis
09/19/2012CN102685932A Wireless sensor network transmitter
09/19/2012CN102683570A White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof
09/19/2012CN102683566A High power LED (Light Emitting Diode) heat dissipation structure applying superconductive uniform temperature plate
09/19/2012CN102683558A Semiconductor light emitting device wafer and method for manufacturing semiconductor light emitting device
09/19/2012CN102683557A Semiconductor light emitting device and method for manufacturing the same
09/19/2012CN102683555A Packaging structure and packaging method for light-emitting diode
09/19/2012CN102683554A High-light-effect light source module based on known good die (KGD) design technology and chip testability packaging method of high-light-effect light source module
09/19/2012CN102683529A Light-emitting diode device and method for manufacturing the same
09/19/2012CN102683337A Integrated method of high-power light-emitting diode (LED) arrays
09/19/2012CN102683336A LED (Light-Emitting Diode) integrated optical source with high color rendering index
09/19/2012CN102683335A Light-emitting diode package structure
09/19/2012CN102683334A High-power LED packaging structure with super-heat-conducting temperature equalizing plate
09/19/2012CN102683333A Double-layer isolation mixed crystal orientation accumulated nanowire metal oxide semiconductor field effect transistor (MOSFET)
09/19/2012CN102683332A 功率模块 Power Modules
09/19/2012CN102683331A Side-mounted controller and methods for making the same
09/19/2012CN102683330A Semiconductor device and manufacturing method of the same
09/19/2012CN102683329A Semiconductor package and method of fabricating the same
09/19/2012CN102683328A Electronic device, portable electronic terminal, and method of manufacturing electronic device
09/19/2012CN102683327A Sheet type circuit protector
09/19/2012CN102679195A Light emitting device
09/19/2012CN102679187A LED (light-emitting diode) optical module for lighting, and LED chip
09/19/2012CN101882606B Heat-dissipation semiconductor encapsulation structure and manufacturing method thereof
09/18/2012USRE43663 Semiconductor device
09/18/2012US8269553 Delay circuit
09/18/2012US8269552 Control pin powered analog switch
09/18/2012US8269331 Power semiconductor module
09/18/2012US8269327 Vertical system integration
09/18/2012US8269326 Semiconductor device assemblies
09/18/2012US8269183 Radiation detector
09/18/2012US8268673 Stacked electronic component and manufacturing method thereof
09/18/2012US8268672 Method of assembly and assembly thus made
09/18/2012CA2552910C A two stage energy storage device
09/13/2012WO2012122390A2 Tilt monitor and stress controller for absorption type refrigerator
09/13/2012WO2012121344A1 Method of manufacturing semiconductor device
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