Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2012
08/30/2012DE102012202778A1 Kraftmodul mit Submodulen und einem Ansteuerungs- und Sicherungsmodul zur hochdynamischen Krafterzeugung Power module with submodules and a driver and security module for highly dynamic force generation
08/30/2012DE102011012295A1 Microelectromechanical system microphone for mobile radio unit, has transducer element enclosed between cover and carrier, and sound inlet openings formed in carrier and cover, respectively
08/30/2012DE102009005650B4 Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls Electronic module and method for producing an electronic module
08/30/2012DE102006044836B4 Module mit einem Abschirm- und/oder Wärmeableitungselement und Verfahren zu ihrer Herstellung Modules with a shield and / or heat dissipation element and process for their preparation
08/29/2012EP2493272A1 Device mounting structure and device mounting method
08/29/2012EP2492979A1 Light-emitting device and lamp
08/29/2012EP2492975A1 Manufacturing method of nitride semiconductor light emitting elements
08/29/2012EP2492957A2 Switching assembly
08/29/2012EP2492956A1 Process for production of electronic device, electronic device, and device for production of electronic device
08/29/2012EP2492898A2 Light Emitting Device
08/29/2012EP2492577A2 Light Emitting Device
08/29/2012CN202406000U IGBT half-bridge power module
08/29/2012CN202405322U LED (Light-Emitting Diode) module substrate structure
08/29/2012CN202405318U Integrated large-power LED packaging structure
08/29/2012CN202405313U LED surface light source module
08/29/2012CN202405258U Wafer level packaging structure for light emitting diode
08/29/2012CN202405257U Laminated type white-light LED (Light-Emitting Diode) lamp
08/29/2012CN202405256U LED capable of increasing color rendering index and improving light extraction efficiency
08/29/2012CN202405255U Led integrated light source
08/29/2012CN202405254U High power LED light source packaging structure made of graphene
08/29/2012CN202405253U Special LED light source packaging structure for automobile head lighter
08/29/2012CN202405248U Bidirectional voltage-stabilizing diode with silicon plastic package
08/29/2012CN202405247U Rapidly-recovered diode
08/29/2012CN202405246U Silicon plastic package rapid recovery diode
08/29/2012CN202403077U LED and OLED (organic light emitting diode) composite surface-emitting device
08/29/2012CN102651445A Light emitting device package
08/29/2012CN102651364A Lighting-emitting device
08/29/2012CN102651357A Semiconductor device, sensor and electronic device
08/29/2012CN102651347A Circuit system
08/29/2012CN102142471B Solar Module array
08/29/2012CN102110683B High-voltage vertical structure semiconductor light emitting diode
08/29/2012CN102024710B Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof
08/29/2012CN101877347B Flexible and thin image sensing module with electromagnetic interference prevention and circuit board module
08/29/2012CN101777551B Polycrystalline light emitting diode
08/29/2012CN101641551B Led lamp with omnidirectional light radiation and optimized heat dissipation
08/29/2012CN101635293B Wafer-to-wafer stacking
08/29/2012CN101501153B Film adhesive, adhesive sheet, and semiconductor device using the same
08/29/2012CN101442041B Multi-chip package semiconductor device
08/28/2012US8254609 Microphones sharing a common acoustic part and volume
08/28/2012US8253484 Configurable clock network for programmable logic device
08/28/2012US8253483 High-frequency switch module
08/28/2012US8253443 Interconnection architectures for multilayer crossbar circuits
08/28/2012US8253102 Gaseous focal plane thermal imager
08/23/2012WO2012112310A1 Flexible light emitting semiconductor device having thin dielectric substrate
08/23/2012WO2012111814A1 Wiring substrate, method for manufacturing same, and semiconductor device
08/23/2012WO2012111397A1 Internal wiring structure of semiconductor device
08/23/2012WO2012111254A1 Semiconductor device and process for manufacture thereof
08/23/2012WO2012110365A1 Carrier substrate and method for producing semiconductor chips
08/23/2012WO2012082881A3 Void-free wafer bonding using channels
08/23/2012US20120213010 Asymmetric Sense Amplifier Design
08/23/2012US20120211878 Chip package with plank stack of semiconductor dies
08/23/2012US20120211766 Image display device and light emission device
08/23/2012DE202012102809U1 Oberflächenmontierter LED-Leuchtstreifen The surface mount LED light strip
08/23/2012DE112010004326T5 Integrierter Entkopplungskondensator, bei welchem leitfähige Durchkontaktierungen durch das Substrat verwendet werden Integrated decoupling capacitor can be used in which conductive vias through the substrate
08/23/2012DE102011055018A1 Semiconductor package for use in e.g. electronic system, has upper semiconductor device comprising conductive bumps that connect pads on upper surface of interposer to corresponding terminal on lower surface of device
08/23/2012DE102011004544A1 Schaltungsanordnung Circuitry
08/23/2012DE102008063724B4 Sammelschienenanordnung mit eingebauter Kühlung, Fahrzeugwechselrichtermodul und Verfahren zum Kühlen eines Wechselrichtermoduls Busbar arrangement with integrated cooling, car inverter module and method for cooling an inverter module
08/22/2012EP2490515A1 Electric function unit and method for manufacturing a three-dimensional electric function unit
08/22/2012EP2490267A2 Photovoltaic device and photovoltaic panel
08/22/2012EP2490259A2 Light-Emitting Device Package and Method of Manufacturing the Same
08/22/2012EP2490258A2 Light emitting device
08/22/2012EP2490257A2 Package comprising a stack of dies and a side-mounted controller and methods for making the same
08/22/2012EP2490256A1 Electronic arrangement
08/22/2012EP2488786A1 Light source
08/22/2012CN202394972U Schottky rectifier bridge
08/22/2012CN202394971U LED lighting modular assembly
08/22/2012CN202394970U Light-emitting diode (LED) chip and light source module using same
08/22/2012CN202394969U LED lighting packaging module
08/22/2012CN202394968U Semiconductor packaging structure
08/22/2012CN202394967U Semiconductor packaging structure
08/22/2012CN202394966U e/LQFP stacked packaging piece with grounding ring
08/22/2012CN202394965U e/LQFP (low profile quad flat package) planar package with ground loop
08/22/2012CN202394964U Multilayer-spacer IC (integrated circuit) chip laminated package for substrate
08/22/2012CN202394963U Multi-chip wafer-level semiconductor packaging structure
08/22/2012CN202394962U Semiconductor packaging structure with stacked chips
08/22/2012CN202394961U Semiconductor wafer with radiating columns and packaging structure
08/22/2012CN202394960U Integrated electronic triode
08/22/2012CN102648520A Power module for an automobile
08/22/2012CN102646782A 发光装置 Light-emitting device
08/22/2012CN102646778A Light emitting device and method for manufacturing same
08/22/2012CN102646675A LED (light-emitting diode) light source and substrate thereof
08/22/2012CN102646674A Light-emitting device of white-light LED (light-emitting diode)
08/22/2012CN102646673A Highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED) and encapsulating method thereof
08/22/2012CN102646672A Led module
08/22/2012CN102646671A Power cushioning diode
08/22/2012CN102646670A Semiconductor device and manufacturing method thereof
08/22/2012CN102646669A Capacitive proximity communication using tuned-inductor
08/22/2012CN102646668A Semiconductor package having tsv interposer and method of manufacturing same
08/22/2012CN102646667A Power semiconductor module and method of manufacturing a power semiconductor module
08/22/2012CN102013422B Insulated gate bipolar translator power tube module
08/22/2012CN101916755B Plane rectifier
08/22/2012CN101894831B Ultraviolet-infrared dual band detector and manufacturing method thereof
08/22/2012CN101807566B Compound crystal type light-emitting diode assembly and manufacturing method thereof
08/22/2012CN101764126B Multi-chip semiconductor package structure without outer leads and lead frame thereof
08/21/2012US8248100 Method and system for providing spin transfer based logic devices
08/21/2012US8247985 Light tube and power supply circuit
08/21/2012US8247680 Light energy conversion material
08/16/2012WO2012109265A2 Three-dimensional power supply module having reduced switch node ringing
08/16/2012WO2012108469A1 Semiconductor device and semiconductor device manufacturing method
08/16/2012WO2012108011A1 Power semiconductor module
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