Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2012
11/07/2012CN101304015B Semiconductor device and manufacturing method thereof
11/06/2012US8307318 Method of configuring a semiconductor integrated circuit involving capacitors having a width equal to the length of active resistors
11/06/2012US8304894 Super high-density module with integrated wafer level packages
11/06/2012US8304876 Semiconductor package and method for manufacturing the same
11/06/2012US8304807 Low-capacitance electrostatic discharge protection diodes
11/06/2012US8304643 Photoelectric conversion material containing fullerene derivative
11/06/2012US8304289 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
11/01/2012WO2012148355A1 Led light source
11/01/2012WO2012146316A1 Led module for a display
11/01/2012WO2012146249A1 Modular chip layout for active optical links
11/01/2012WO2012109265A3 Three-dimensional power supply module having reduced switch node ringing
11/01/2012US20120275122 Using a coupling orthogonalization approach to reduce cross-talk
11/01/2012US20120273970 Semiconductor device
11/01/2012US20120273783 Semiconductor apparatus
10/2012
10/31/2012EP2519089A1 Circuit module
10/31/2012EP2518766A2 Power module with press-fit clamps
10/31/2012EP2518765A2 Switching assembly with contact springs
10/31/2012EP2517243A2 Hybrid circuit
10/31/2012EP2517242A2 Semiconductor chip device with solder diffusion protection
10/31/2012EP2517241A1 Window interposed die packaging
10/31/2012DE102011075021A1 Semiconductor illumination tape i.e. flexible LED illumination tape, for illuminating image plane, has band shaped substrate retained in substrate retainer that is permeable for white mixture light emitted by laterally emitting LEDs
10/31/2012DE102011017790A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
10/31/2012CN202513209U Heat conduction substrate structure of light emitting diode
10/31/2012CN202513158U Electric encapsulation structure with chip arranged on light-sensing component
10/31/2012CN202513157U Small size light-emitting diode
10/31/2012CN202513156U LED device with shared voltage-limiting unit and individual voltage-equalizing resistor
10/31/2012CN202513155U Multi-chip encapsulation structure of light-emitting diode chip
10/31/2012CN202513154U Novel bonding wire structure LED integrated light source module
10/31/2012CN202513153U Light-emitting diode packaging structure
10/31/2012CN202513152U LED display screen, LED surface-mounted module and support thereof
10/31/2012CN202513151U Novel rectifier bridge connecting piece
10/31/2012CN202513144U Combined high-voltage high-power field effect tube
10/31/2012CN102763218A Substrate for a lighting module and lighting module
10/31/2012CN102763217A Semiconductor die package structure
10/31/2012CN102760823A Light emitting device and illumination device using the same
10/31/2012CN102760817A Light-emitting diode encapsulation structure
10/31/2012CN102760730A Light-emitting diode device
10/31/2012CN102760729A Pulse power switch device
10/31/2012CN102760724A Integrally-packaged power semiconductor device
10/31/2012CN102760665A Semiconductor packaging structure and method for making the same
10/31/2012CN102082141B Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect
10/31/2012CN101752355B Light-emitting device
10/31/2012CN101628705B Substrate bonding method and electronic component thereof
10/30/2012USRE43776 Layout technique for matched resistors on an integrated circuit substrate
10/30/2012US8302057 Standard cell library and semiconductor integrated circuit
10/30/2012US8300922 Hand-held programmable inspection system with a display
10/30/2012US8299848 Multi-layered semiconductor apparatus
10/30/2012US8299593 Stack package made of chip scale packages
10/30/2012US8299585 Power semiconductor device
10/26/2012WO2012145480A1 Reinforced fan-out wafer-level package
10/26/2012WO2012145477A1 Multiple die face-down stacking for two or more die
10/26/2012WO2012145370A1 Multi-chip module with stacked face-down connected dies
10/26/2012WO2012145237A1 Led array having embedded led and method therefor
10/26/2012WO2012145201A1 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
10/26/2012WO2012145115A1 Stacked chip-on-board module with edge connector
10/26/2012WO2012145114A1 Flip-chip, face-up and face-down wirebond combination package
10/26/2012WO2012144070A1 Semiconductor device
10/26/2012WO2012143964A1 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
10/26/2012WO2012143060A1 Improvements in or relating to thyristor clamped assemblies
10/25/2012US20120268849 Semiconductor device
10/25/2012US20120268217 Calibration of Temperature Sensitive Circuits with Heater Elements
10/25/2012US20120268199 Chip Having Register to Store Value that Represents Adjustment to Reference Voltage
10/25/2012US20120267800 Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Level Chip Scale Package
10/25/2012US20120267799 Package structures
10/25/2012US20120267654 Light emitting device array
10/25/2012US20120267645 Light emitting diode module package structure
10/25/2012DE202012008890U1 Flüssigkristallanzeige und LED-Modul dafür Liquid crystal display and LED module for
10/25/2012DE202012008888U1 Flüssigkristallanzeige und LED-Modul dafür Liquid crystal display and LED module for
10/25/2012DE102007017546B4 Mehrzahl von Multichipmodulen und Verfahren zur Herstellung Plurality of multichip modules, and methods for preparing
10/24/2012EP2515333A2 Light Emitting Device Module and Method of Manufacturing the Same
10/24/2012EP2514797A1 Thiophene-containing organic photoelectric materials, their perparation methods and solar cell devices
10/24/2012EP2513970A2 Apparatus and method for embedding components in small-form-factor, system-on-packages
10/24/2012CN202503035U LED package
10/24/2012CN202503032U LED (Light Emitting Diode) light source unlikely to form facular points
10/24/2012CN202502993U Power supply chip
10/24/2012CN202502992U Nut power terminal, power module containing the same and circuit system
10/24/2012CN102754206A Semiconductor electronic components and circuits
10/24/2012CN102754205A Power module and method for manufacturing same
10/24/2012CN102751429A Light-emitting device
10/24/2012CN102751426A Packaging structure and light-emitting diode packaging structure
10/24/2012CN102751424A Light emitting device module and method of manufacturing the same
10/24/2012CN102751275A Light-emitting diode display screen and manufacturing method thereof
10/24/2012CN102751274A Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
10/24/2012CN102751273A Structure of white LED (Light Emitting Diode) fluorescent lamp and production method of structure
10/24/2012CN102751272A Semiconductor light emitting module and method of manufacturing the same
10/24/2012CN102751271A Light emitting device array
10/24/2012CN102751270A Metal substrate structure with light-emitting diode (LED)
10/24/2012CN102751269A Light-emitting diode module encapsulation structure
10/24/2012CN102751268A MOSFET pair with stack capacitor and manufacturing method thereof
10/24/2012CN102751267A Semiconductor packaging structure for stacking and manufacturing method thereof
10/24/2012CN102751266A Wafer package and forming method thereof
10/24/2012CN102751265A Substrate stacking structure
10/24/2012CN102751254A Semiconductor packaging piece, stack packaging piece using semiconductor packaging piece and manufacturing method of semiconductor packaging piece
10/24/2012CN102751251A Semiconductor package and stacked semiconductor package having
10/24/2012CN102748608A Solid state illumination device
10/24/2012CN102148219B Power module of insulated gate bipolar transistor
10/24/2012CN102130021B Silicon carbide power module and packaging method thereof
10/24/2012CN101996986B White light-emitting diode packages with tunable colour temperature
10/24/2012CN101924040B Chip repairing method and chip stack structure
10/24/2012CN101834176B Half-bridge drive circuit chip
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