Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2012
12/12/2012CN102820283A 半导体器件 Semiconductor devices
12/12/2012CN102820271A 半导体装置 Semiconductor device
12/12/2012CN102820267A Bolt type semiconductor packaging stacking structure
12/12/2012CN102818157A LED (light emitting diode) lamp and LED module
12/12/2012CN102818145A Combined type LED (light-emitting diode) module without radiator, and production method thereof
12/12/2012CN102148169B Silicon carbide power module and packaging method thereof
12/12/2012CN102110672B Chip-stacked package structure and method for manufacturing the same
12/12/2012CN102034799B Chip package and fabrication method thereof
12/12/2012CN101878528B Electronic circuit composed of sub-circuits and method for producing the same
12/12/2012CN101699623B 半导体装置 Semiconductor device
12/12/2012CN101548380B Twin chip-mounted diode
12/11/2012US8332552 Supporting multiple high bandwidth I/O controllers on a single chip
12/11/2012US8331121 Multi-chip packages providing reduced signal skew and related methods of operation
12/11/2012US8331102 Printed circuit board
12/11/2012US8330494 Semiconductor device having a latch circuit
12/11/2012US8330493 High utilization universal logic array with variable circuit topology and logistic map circuit to realize a variety of logic gates with constant power signatures
12/11/2012US8330492 Liquid crystal display device and electronic device
12/11/2012US8330489 Universal inter-layer interconnect for multi-layer semiconductor stacks
12/11/2012US8330035 Terminal box for solar cell modules
12/11/2012US8329581 Microelectronic packages and methods therefor
12/11/2012CA2496149C Rigid integrated photovoltaic roofing membrane and related methods of manufacturing same
12/06/2012WO2012165598A1 Laminated module and interposer used in same
12/06/2012WO2012165594A1 Laminated module and interposer used in same
12/06/2012WO2012165559A1 Mounting structure of laminated module using interposer
12/06/2012WO2012165530A1 Method for producing multi-layer substrate and multi-layer substrate
12/06/2012WO2012164720A1 Substrate with built-in component, and method for producing said substrate
12/06/2012WO2012164719A1 Substrate with built-in component, and method for producing said substrate
12/06/2012US20120306570 Semiconductor integrated circuit
12/06/2012US20120306533 Semiconductor device
12/06/2012US20120305980 Led lamps
12/06/2012US20120305978 Led lamps
12/06/2012US20120305951 Light-emitting device having light-emitting elements
12/06/2012DE10349163B4 Drucksensorvorrichtung mit Temperatursensor Pressure sensor device with temperature sensor
12/06/2012DE102012209284A1 Halbleitervorrichtung Semiconductor device
12/06/2012DE102012208146A1 Verbindungssystem zur herstellung elektrischer verbindungen eines leistungshalbleitermoduls und verfahren zur herstellung solcher verbindungen A connection system for making electrical connections of the power semiconductor module and process for the preparation of such compounds
12/06/2012DE102012104377A1 Halbleitervorrichtung und Antriebsvorrichtung, die eine Halbleitervorrichtung aufweist Semiconductor device and drive device comprising a semiconductor device
12/06/2012DE102012104345A1 Halbleitervorrichtung, Halbleitergehäuse und elektronische Vorrichtung A semiconductor device, semiconductor packages and electronic device
12/06/2012DE102011103749A1 Multi-channel detection device for detecting field components of magnetic field vector produced by magnetic field line camera, has sensor chips whose respective associated Hall-sensors form separate measuring channel
12/06/2012DE102011076765A1 Illumination device for motor vehicle, has lead frames that are electrically connected with semiconductor light source assemblies which are arranged on stage surfaces of step-like portion of heat sink
12/06/2012DE102011075260B4 MEMS-Mikrofon MEMS microphone
12/06/2012DE102011052576B3 Elektrische Vorrichtung mit Dichtelement, Dichtelement für eine elektrische Vorrichtung und Verfahren zum Abdichten eines Gehäuses Electrical device with a sealing element, sealing member for an electric device and method for sealing a housing
12/06/2012DE102007017604B4 Verfahren zur Herstellung einer Lampenreihe A method for producing a lamp series
12/06/2012DE102006038541B4 Halbleiterbauelementanordnung mit komplementären Leistungsbauelementen Semiconductor device assembly with complementary power devices
12/06/2012DE102005046710B4 Verfahren zur Herstellung einer Bauelementanordnung mit einem Träger und einem darauf montierten Halbleiterchip A method of manufacturing a component assembly comprising a support and a semiconductor chip mounted thereon
12/05/2012EP2530712A2 Power converter and method for manufacturing power converter
12/05/2012EP2530711A1 Power semiconductor arrangement
12/05/2012EP2529399A1 Illumination device
12/05/2012CN202586720U Novel IGBT module
12/05/2012CN202585520U Light source module structure of a light-emitting diode
12/05/2012CN202585514U Automatic dispensing machine for reducing settlement of phosphor particles and related LED modules
12/05/2012CN202585415U Aluminum base row type integrated LED device
12/05/2012CN202585414U Light emitting diode device
12/05/2012CN202585413U Full-color surface-mounting device having front face brushed into black
12/05/2012CN202585412U Full-color surface-mounting device
12/05/2012CN202585411U Encapsulating structure of LED light source
12/05/2012CN202585410U LED bimorph mounting bracket
12/05/2012CN202585409U Led surface mount device
12/05/2012CN202585408U Improved structure of a multilayer array-type light-emitting diode engine
12/05/2012CN202585407U 光伏二极管 PV diode
12/05/2012CN202585406U Novel rectifier bridge
12/05/2012CN202585405U Three-phase rectifier module
12/05/2012CN202585404U Igbt module
12/05/2012CN202585403U Full-bridge single-tube IGBT packaging module
12/05/2012CN202585402U Printed circuit board type high-voltage diode
12/05/2012CN202585401U A semiconductor package structure
12/05/2012CN202580860U Light-emitting diode (LED) light source
12/05/2012CN202580859U Chip-on-board (COB) based light-emitting diode (LED) light source
12/05/2012CN1525485B Laminated integrated circuit memory
12/05/2012CN102812548A 多芯片集成电路 Multi-Chip Integrated Circuits
12/05/2012CN102812542A Surface preparation of die for improved bonding strength
12/05/2012CN102810979A Semiconductor module and driving apparatus including semiconductor module
12/05/2012CN102810537A White-light LED lighting device
12/05/2012CN102810536A LED module
12/05/2012CN102810535A Modulized full operation junction ultra high voltage (uhv) device
12/05/2012CN102810534A LED (light emitting diode) module
12/05/2012CN102810533A White light emitting device
12/05/2012CN102810532A Semiconductor device and driving apparatus including semiconductor device
12/05/2012CN102810531A Semiconductor module system,semiconductor module and method for manufacturing semiconductor module
12/05/2012CN102810525A Multi-unit light emitting diode
12/05/2012CN102809764A System and method for clear layer isolation
12/05/2012CN102194811B 热电装置 Thermoelectric devices
12/05/2012CN102082142B 封装结构 Package structure
12/05/2012CN102064156B Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect
12/05/2012CN102027596B LED arrangement
12/05/2012CN101946337B Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
12/05/2012CN101894892B LED wafer package and manufacturing method thereof
12/05/2012CN101828136B Side-emitting led light source for backlighting applications
12/05/2012CN101714823B Power transducer
12/05/2012CN101657899B 功率半导体模块 Power semiconductor module
12/05/2012CN101385140B Microelectronic assemblies having very fine pitch stacking
12/04/2012US8324937 Methods for differential pair conductor routing in a logic circuit
12/04/2012US8324931 Configuration context switcher with a latch
12/04/2012US8324924 Post-programming functional verification for programable integrated circuits
12/04/2012US8324733 Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same
12/04/2012US8324725 Stacked die module
12/04/2012US8324090 Method to improve dielectric quality in high-k metal gate technology
12/04/2012CA2438889C High power led
11/2012
11/29/2012WO2012161991A1 Power generation system
11/29/2012WO2012161044A1 Semiconductor device
11/29/2012US20120299546 Under voltage tolerant clamp
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