Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2012
10/24/2012CN101692448B Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof
10/24/2012CN101557100B Bidirectional and reverse blocking battery switch
10/24/2012CN101387549B Selfluminous device
10/23/2012US8295892 Mobile terminal and method for controlling display thereof
10/23/2012US8295572 Dual-spectrum heat pattern separation algorithm for assessing chemotherapy treatment response and early detection
10/23/2012US8294511 Vertically stacked fin transistors and methods of fabricating and operating the same
10/23/2012US8294490 Integrated circuit and method of asynchronously routing data in an integrated circuit
10/23/2012US8294487 Configuration setting device of integrated circuit and the configuration setting method thereof
10/23/2012US8294272 Power module
10/23/2012US8294100 Imaging apparatus and methods
10/23/2012US8293847 Film-like adhesive, adhesive sheet, and semiconductor device using same
10/18/2012WO2012140810A1 Three-dimensional integrated circuit having redundant relief structure for chip bonding section
10/18/2012WO2012078709A3 Compliant interconnects in wafers
10/18/2012WO2012031178A3 A light emitting apparatus
10/18/2012US20120264240 Semiconductor device and manufacturing method thereof
10/18/2012US20120262992 Semiconductor device including multi-chip
10/18/2012US20120262974 Memory module and memory system
10/18/2012US20120261838 Multi-chip package and method of providing die-to-die interconnects in same
10/18/2012US20120261820 Assembly of stacked devices with semiconductor components
10/18/2012DE112010001882T5 Tandemphotovoltaikzelle und Verfahren, die eine dreifache Glassubstratkonfiguration verwenden Tandem photovoltaic cell and methods using a triple glass substrate configuration
10/18/2012DE112008000248B4 System mit im Waferbonding-Zwischenraum gebildeten Chipkühlkanälen System formed in wafer bonding gap chip cooling channels
10/18/2012DE10227008B4 Kühlvorrichtung für Halbleitermodule und Elektronikanordnung Cooling device for semiconductor modules and electronics assembly
10/18/2012DE102012103369A1 Ein Verfahren zum Ausbilden eines Halbleiterbauelements und ein Halbleiterbauelement A method of forming a semiconductor device and a semiconductor device
10/18/2012DE102011090124A1 Halbleitervorrichtung Semiconductor device
10/18/2012DE10066441B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components
10/17/2012EP2511954A1 Stacked composite device including a group III-V transistor and a group IV diode
10/17/2012EP2511953A1 Stacked composite device including a group III-V transistor and a group IV lateral transistor
10/17/2012EP2511952A1 Stacked composite device including a group III-V transistor and a group IV vertical transistor
10/17/2012CN202495473U Light emitting diode light engine
10/17/2012CN202495445U LED chip group and chip module directly using alternating current
10/17/2012CN102742008A Substrate for power module, and power module
10/17/2012CN102738374A Full-color direct inserted LED (Light Emitting Diode) lamp bead and display screen thereof
10/17/2012CN102738367A Light emitting apparatus
10/17/2012CN102738355A Package having light-emitting element and fabrication method thereof
10/17/2012CN102738317A Packaging method for light source used in LED fluorescent lamp and light source
10/17/2012CN102738277A Chain-plate solar power generation waterproof integrated board system and preparation method thereof
10/17/2012CN102738139A Novel packaged power module
10/17/2012CN102738138A IGBT (Insulated Gate Bipolar Transistor) power module specific to electromobile
10/17/2012CN102738137A Light emitting diode (LED) lamp panel packaging structure and method thereof
10/17/2012CN102738136A Distributed high-voltage light emitting diode (LED) module
10/17/2012CN102738135A Light emitting semiconductor structure
10/17/2012CN102738134A 半导体装置 Semiconductor device
10/17/2012CN102738133A Semiconductor device and method of fabricating the same
10/17/2012CN102738132A Semiconductor package comprising optical semiconductor device
10/17/2012CN102738131A Semiconductor module, packaging structure and packaging method thereof
10/17/2012CN102738130A Die arrangement and method of forming die arrangement
10/17/2012CN102738129A Apparatus and method for increasing bandwidths of stacked dies
10/17/2012CN102738090A Light emitting device-light receiving device assembly, and manufacturing method thereof
10/17/2012CN102738086A Assembly of stacked devices with semiconductor components
10/17/2012CN102738025A Method of forming bonded semiconductor structure, and semiconductor structure formed by such method
10/17/2012CN102738012A Method for producing sensor unit
10/17/2012CN102734647A White light illumination system
10/17/2012CN102110678B Semiconductor package and manufacturing method thereof
10/17/2012CN101714542B Circuit device
10/17/2012CN101606237B Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
10/17/2012CN101562176B A device of a chip module comprising a frequency enlarging device and a method
10/17/2012CN101517845B Socket, module board, and inspection system using the module board
10/17/2012CN101419990B Flexible thin-film solar cell component
10/16/2012US8291364 Automated digital circuit design tool that reduces or eliminates adverse timing constraints do to an inherent clock signal skew, and applications thereof
10/16/2012US8290245 Measuring apparatus and method for range inspection
10/16/2012US8289372 Method for displaying a thermal image in an IR camera and an IR camera
10/16/2012US8289052 Logic circuit and display device having the same
10/16/2012US8289051 Input/output core design and method of manufacture therefor
10/16/2012US8288862 Multiple die stack package
10/16/2012US8288820 High voltage power integrated circuit
10/16/2012US8288729 Image processing apparatus, image processing method, image processing program, and information storage medium having image processing program stored therein
10/11/2012WO2012138999A1 Novel oled display architecture
10/11/2012WO2012137760A1 Semiconductor device and method for manufacturing semiconductor device
10/11/2012WO2012137714A1 Semiconductor device and method for manufacturing semiconductor device
10/11/2012WO2012137685A1 Semiconductor device and method for manufacturing same
10/11/2012US20120256683 Semiconductor integrated circuit
10/11/2012US20120256682 Method and Apparatus to Enable a Selective Push Process During Manufacturing to Improve Performance of a Selected Circuit of an Integrated Circuit
10/11/2012US20120256322 Semiconductor device
10/11/2012US20120256300 Semiconductor device and method for fabricating semiconductor device
10/11/2012DE102012205742A1 Vertikale Halbleiteranordnung und Verfahren zur Herstellung Vertical semiconductor device and process for producing
10/11/2012DE102012006924A1 LED-Beleuchtungsmodul mit gleichförmiger Lichtabgabe LED lighting module with uniform light output
10/11/2012DE102011001928A1 Farbkonversionselement sowie Lampe Color conversion element and lamp
10/11/2012DE102008029829B4 Vertikal nach oben kontaktierender Halbleiter und Verfahren zu dessen Herstellung Vertically upwards contacted semiconductor and process for its preparation
10/10/2012EP2509394A2 Light emitting device module and surface light source device
10/10/2012EP2509106A1 A microstructure device comprising semiconductor devices stacked face to face and coupled by electromagnetic near field and method of forming the microstructure device
10/10/2012EP2508255A1 Uv-irradiation apparatus
10/10/2012EP2507832A1 Methods and apparatus for inductors with integrated passive and active elements
10/10/2012EP2507831A1 Retrofit led lamp with warm-white, more particularly flame-like white light
10/10/2012CN202487575U Composite diode structure
10/10/2012CN202487574U Three-primary-color light-emitting diode for display screen
10/10/2012CN202487573U Chromatic-aberration-free LED (light-emitting diode) module light source device
10/10/2012CN202487572U Integrated LED (light-emitting diode) packaging structure
10/10/2012CN202487571U LED (light-emitting diode) integration module
10/10/2012CN202487570U Positive and negative pole reversal connection parallel LED packaging structure
10/10/2012CN202487569U LED module group
10/10/2012CN202487568U Semiconductor module
10/10/2012CN102725618A Sensor device and method for producing sensor device
10/10/2012CN102723423A Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device
10/10/2012CN102723327A Novel rectifier bridge for soybean milk maker
10/10/2012CN102723326A Plane slice type LED array light source with double fluorescent films
10/10/2012CN102723325A LED (Light-Emitting Diode) light-emitting element
10/10/2012CN102723324A Double-face light emitting planar wafer type LED (Light-Emitting Diode) packaging structure
10/10/2012CN102723321A Photoelectric coupler lead frame and photoelectric coupler
10/10/2012CN102723306A Microwave multi-chip packaging structure using silicon through hole and manufacture method thereof
10/10/2012CN102214642B Combined type high-power semiconductor chip
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